S-19610A MINI ANALOG SERIES FOR AUTOMOTIVE 125 C OPERATION CMOS OPERATIONAL AMPLIFIER. Features. Applications. Package.

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1 MINI ANALOG SERIES FOR AUTOMOTIVE 15 C OPERATION CMOS OPERATIONAL AMPLIFIER SII Semiconductor Corporation, 14 The mini-analog series is a group of ICs that incorporate a general purpose analog circuit in a small package. The is a CMOS type operational amplifier that has a phase compensation circuit, and operates at a low voltage with low current consumption. The is a dual operational amplifier (with circuits). Caution This product can be used in vehicle equipment and in-vehicle equipment. Before using the product in the purpose, contact to SII Semiconductor Corporation is indispensable. Features Low input offset voltage: VIO = 6. mv max. (Ta = 4 C to 15 C) Operation power supply voltage range: VDD =.7 V to 5.5 V Low current consumption (Per circuit): IDD = 1. μa typ. No external parts required for internal phase compensation Operation temperature range: Ta = 4 C to 15 C Lead-free (Sn 1%), halogen-free AEC-Q1 qualified *1 *1. Contact our sales office for details. Applications Current sensing Signal amplification Buffer Active filter Package TMSOP-8 1

2 Block Diagram VDD IN1() IN1() OUT1 IN() IN() OUT VSS Figure 1

3 AEC-Q1 Qualified This IC supports AEC-Q1 for the operation temperature grade 1. Contact our sales office for details of AEC-Q1 reliability specification. Product Name Structure Refer to "1. Product name" regarding the contents of product name, ". Package" regarding the package drawings and "3. Product name list" regarding the product type. 1. Product name B A - K8T U *1. Refer to the tape drawing. Environmental code U: Lead-free (Sn 1%), halogen-free Product name abbreviation and IC packing specifications *1 K8T: TMSOP-8, Tape Operation temperature A: Ta = 4 C to 15 C Number of circuits B:. Package Table 1 Package Drawing Codes Package Name Dimension Tape Reel TMSOP-8 FM8-A-P-SD FM8-A-C-SD FM8-A-R-SD 3. Product name list Table Product Name BA-K8TU TMSOP-8 Package 3

4 Pin Configuration 1. TMSOP Top view Figure Table 3 Pin No. Symbol Description 1 OUT1 Output pin 1 IN1() Inverted input pin 1 3 IN1() Non-inverted input pin 1 4 VSS GND pin 5 IN() Non-inverted input pin 6 IN() Inverted input pin 7 OUT Output pin 8 VDD Positive power supply pin 4

5 Absolute Maximum Ratings Table 4 (Ta = 5 C unless otherwise specified) Parameter Symbol Absolute Maximum Rating Unit Power supply voltage VDD VSS.3 to VSS 7. V Input voltage VIN(), VIN(-) VSS.3 to VSS 7. V Output voltage VOUT VSS.3 to VDD.3 V Differential input voltage VIND ±7. V Output pin current ISOURCE. ma ISINK. ma Operating ambient temperature Topr 4 to 15 C Storage temperature Tstg 55 to 15 C Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not be exceeded under any conditions. Thermal Resistance Value Table 5 Item Symbol Condition Min. Typ. Max. Unit Board 1 16 C/W Junction-to-ambient thermal resistance *1 θja TMSOP-8 Board 133 C/W *1. Test environment: compliance with JEDEC STANDARD JESD51-A Remark Refer to " Thermal Characteristics" for details of power dissipation and test board. 5

6 Electrical Characteristics DC Electrical Characteristics Operation power supply voltage range Table 6 (VDD = 5. V, Ta = 5 C unless otherwise specified) Item Symbol Condition Min. Typ. Max. Unit Test Circuit VDD V Current consumption ( circuits) IDD VCMR = VOUT = VDD /..5 ma 5 Input offset voltage Input offset voltage drift VCMR = VDD /, Ta = 4 C to 15 C ΔVIO VCMR = VDD /, ΔTa Ta = 4 C to 15 C VIO 6. ±3. 6. mv 1 ±3 μv/ C 1 Input offset current IIO 1 pa Input bias current IBIAS 1 pa Common-mode input voltage range Voltage gain (open loop) Maximum output swing voltage Common-mode input signal rejection ratio Power supply voltage rejection ratio VCMR V AVOL VOH VOL VOUT = VSS.5 V to VDD.5 V VCMR = VDD /, RL = 1. MΩ RL = 1. MΩ, Ta = 4 C to 15 C RL = 1. MΩ, Ta = 4 C to 15 C db V 3.1 V 4 CMRR VCMR = VSS.1 V to VDD 1. V 7 85 db PSRR VDD =.7 V to 5.5 V 7 9 db 1 Source current ISOURCE VOUT = VDD.1 V 5. ma 6 Sink current ISINK VOUT =.1 V 5. ma 7 Table 7 AC Electrical Characteristics (VDD = 5. V, Ta = 5 C unless otherwise specified) Item Symbol Condition Min. Typ. Max. Unit Slew rate SR RL = 1. MΩ, CL = 15 pf (Refer to Figure 11). V/μs Gain-bandwidth product GBP CL = pf 3. MHz 6

7 Test Circuits (Per Circuit) 1. Power supply voltage rejection ratio, input offset voltage Power supply voltage rejection ratio (PSRR) R S R F V OUT The power supply voltage rejection ratio (PSRR) can be calculated by the following expression, with VOUT measured at each VDD. Test conditions: VDD =.7 V: VDD = VDD1, VOUT = VOUT1, R S VDD = 5.5 V: VDD = VDD, VOUT = VOUT V CMR = / R F PSRR = log VOUT1 VDD1 VDD1 VDD VOUT VDD RF RS RS Figure 3 Test Circuit 1 Input offset voltage (VIO) VIO = VOUT VDD RS RF RS. Common-mode input signal rejection ratio, common-mode input voltage range Common-mode input signal rejection ratio (CMRR) R S R F V OUT The common-mode input signal rejection ratio (CMRR) can be calculated by the following expression, with VOUT measured at each VIN. Test conditions: VIN = VCMR Max.: VIN = VIN1, VOUT = VOUT1, R S VIN = VCMR Min.: VIN = VIN, VOUT = VOUT R F V IN / CMRR = log VIN1 VIN VOUT1 VOUT RF RS RS Figure 4 Test Circuit Common-mode input voltage range (VCMR) The common mode input voltage range (VCMR) is the range of VIN in which the common mode input signal rejection ratio (CMRR) is satisfied when VIN is varied. 7

8 3. Maximum output swing voltage (VOH) Maximum output swing voltage (VOH) V OH Test conditions VIN1 = VDD.1 V VIN = VDD.1 V RL = 1 MΩ R L V IN1 V IN / Figure 5 Test Circuit 3 4. Maximum output swing voltage (VOL) / Maximum output swing voltage (VOL) R L V OL Test conditions: VIN1 = VDD.1 V VIN = VDD.1 V RL = 1 MΩ V IN1 V IN Figure 6 Test Circuit 4 5. Current consumption Current consumption (IDD) A V CMR = / Figure 7 Test Circuit 5 8

9 6. Source current Source current (ISOURCE) A Test conditions: VOUT = VDD.1 V VIN1 = VDD.1 V VIN = VDD.1 V V IN1 V IN V OUT 7. Sink current Figure 8 Test Circuit 6 V OUT Sink current (ISINK) A Test conditions: VOUT = VSS.1 V VIN1 = VDD.1 V VIN = VDD.1 V V IN1 V IN Figure 9 Test Circuit 7 9

10 8. Voltage gain R S R S R F R F N D.U.T 1 MΩ V CMR = / / Figure 1 Test Circuit 8 NULL V SSN V M V OUT Voltage gain (open loop) (AVOL) The voltage gain (AVOL) can be calculated by the following expression, with VOUT measured at each VM. Test conditions: VM = VDD.5 V: VM = VM1, VOUT = VOUT1, VM =.5 V: VM = VM, VOUT = VOUT AVOL = log VM1 VM VOUT1 VOUT RF RS RS 9. Slew rate (SR) Measured by the voltage follower circuit. t R = t F = ns ( V to V CMR Max. ) IN() = V CMR Max. IN() = V V OUT (= IN()) V OUT (= IN()) t THL t TLH V CMR Max. V CMR Max..9 V CMR Max..1 SR = SR = VCMR Max..8 ttlh VCMR Max..8 tthl Figure 11 1

11 Precautions Do not apply an electrostatic discharge to this IC that exceeds performance ratings of the built-in electrostatic protection circuit. SII Semiconductor Corporation claims no responsibility for any disputes arising out of or in connection with any infringement by products including this IC of patents owned by a third party. Use this IC with the output current of ma or less. This IC operates stably even directly connecting a load capacitance of 1 pf or less to the output pin, as seen in Figure 1. When using a load capacitance of 1 pf or larger, set a resistor of 47 Ω or more as seen in Figure 13. In case of connecting a filter for noise prevention, and using a load capacitance of 1 pf or more, also set a resistor of 47 Ω or more as seen in Figure 14. V IN V IN V OUT Load capacitance 1 pf or less V SS Figure 1 V IN V OUT V IN 47 Ω or more V SS Load capacitance Figure 13 Filter V IN V OUT 47 Ω or more V IN Load capacitance V SS Caution Figure 14 The above connection diagram and constant will not guarantee successful operation. Perform through evaluation using the actual application to set the constant. 11

12 Characteristics (Typical Data) 1. Current consumption (IDD) ( circuits) vs. Power supply voltage (VDD).4 VSS = V, VCMR = VOUT = VDD /. IDD [ma] Ta = 4C Ta = 5C Ta = 15C VDD [V] 5 6. Voltage gain (AVOL) vs. Frequency (f) AVOL [db] VDD =.7 V, VSS = V Ta = 4C Ta = 5C Ta = 15C k 1k 1k 1M 1M f [Hz] AVOL [db] Ta = 5C Ta = 15C VDD = 5. V, VSS = V Ta = 4C k 1k 1k 1M 1M f [Hz] 3. Output current 3. 1 Source current (ISOURCE) vs. Power supply voltage (VDD) ISOURCE [ma] VOUT = VDD.1 V, VSS = V 3 Ta = 4C 4 VDD [V] Ta = 5C Ta = 15C 3. Sink current (ISINK) vs. Power supply voltage (VDD) VOUT =.1 V, VSS = V ISINK [ma] Ta = 4C Ta = 5C Ta = 15C 3 4 VDD [V] 5 6 1

13 3. 3 Output voltage (VOUT) vs. Source current (ISOURCE) VOUT [V] Ta = 15C VDD =.7 V, VSS = V Ta = 4C Ta = 5C VOUT [V] VDD = 5. V, VSS = V Ta = 4C Ta = 15C Ta = 5C ISOURCE [ma] ISOURCE [ma] Output voltage (VOUT) vs. Sink current (ISINK) 3. VDD =.7 V, VSS = V 6. VDD = 5. V, VSS = V VOUT [V] Ta = 15C Ta = 5C Ta = 4C ISINK [ma] VOUT [V] Ta = 4C Ta = 15C Ta = 5C ISINK [ma] 1 4. Input bias current (IBIAS) vs. Temperature (Ta) IBIAS[nA] VDD = 5. V, VSS = V, VCMR = VDD / Ta [ C] 13

14 Thermal Characteristics 1. TMSOP-8 1. Tj = 15C max. Power dissipation (PD) [W] Board.94 W Board 1.78 W Ambient temperature (Ta) [C] Figure 15 Power Dissipation of Package (When Mounted on Board) 1. 1 Board mm Table 8 Figure mm Item Thermal resistance value (θja) 16 C/W Specification Size mm 76. mm t1.6 mm Material FR-4 Number of copper foil layer 1 Land pattern and wiring for testing: t.7 mm Copper foil layer mm 74. mm t.7 mm Thermal via 1. Board 76. mm Table 9 Figure mm Item Thermal resistance value (θja) 133 C/W Specification Size mm 76. mm t1.6 mm Material FR-4 Number of copper foil layer 4 1 Land pattern and wiring for testing: t.7 mm 74. mm 74. mm t.35 mm Copper foil layer mm 74. mm t.35 mm mm 74. mm t.7 mm Thermal via 14

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18 Disclaimers (Handling Precautions) 1. All the information described herein (product data, specifications, figures, tables, programs, algorithms and application circuit examples, etc.) is current as of publishing date of this document and is subject to change without notice.. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of any specific mass-production design. SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or infringement of third-party intellectual property rights and any other rights due to the use of the information described herein. 3. SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein. 4. Take care to use the products described herein within their specified ranges. Pay special attention to the absolute maximum ratings, operation voltage range and electrical characteristics, etc. SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur due to the use of products outside their specified ranges. 5. When using the products described herein, confirm their applications, and the laws and regulations of the region or country where they are used and verify suitability, safety and other factors for the intended use. 6. When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all other export-related laws, and follow the required procedures. 7. The products described herein must not be used or provided (exported) for the purposes of the development of weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision (export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons, missiles, or other military use. 8. The products described herein are not designed to be used as part of any device or equipment that may affect the human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation. Especially, the products described herein cannot be used for life support devices, devices implanted in the human body and devices that directly affect human life, etc. Prior consultation with our sales office is required when considering the above uses. SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our products. 9. Semiconductor products may fail or malfunction with some probability. The user of these products should therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction. The entire system must be sufficiently evaluated and applied on customer's own responsibility. 1. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be taken in the product design by the customer depending on the intended use. 11. The products described herein do not affect human health under normal use. However, they contain chemical substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Take care when handling these with the bare hands to prevent injuries, etc. 1. When disposing of the products described herein, comply with the laws and ordinances of the country or region where they are used. 13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation. The information described herein does not convey any license under any intellectual property rights or any other rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor Corporation is strictly prohibited. 14. For more details on the information described herein, contact our sales office