Features. H FE at 10 V ma > 70. Description. Table 1. Device summary (1)

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1 Hi-Rel PNP bipolar transistor 80 V - 5 A Features Datasheet - production data TO-257 BV CEO 80 V SMD.5 TO-39 Figure 1. Internal schematic diagram I C (max) Hi-Rel PNP bipolar transistor Linear gain characteristics ESCC qualified European preferred part list - EPPL Radiation level: lot specific total dose contact marketing for specified level Description 5 A H FE at 10 V ma > 70 Operating temperature range -65 C to +200 C The is a silicon planar epitaxial PNP transistor in TO-39, TO-257 and SMD.5 packages. It is specifically designed for aerospace Hi-Rel applications and ESCC qualified according to the specification. In case of conflict between this datasheet and ESCC detailed specification, the latter prevails. Table 1. Device summary (1) Device Qualification system Agency specification Package Other features EPPL 2N5153RSHRx ESCC 5204/002 SMD.5 Emitter on Pin krad: ESCC LDR Yes 2N5153SHR ESCC 5204/002 SMD.5 Emitter on Pin 1 Yes (2) ESCC 5204/002 TO N5153RESYHRx ESCC 5204/002 TO krad : ESCC LDR - 2N5153ESYHRB ESCC 5204/002 TO Former SW version have been upgraded to ESCC 100 kard Low dose rate version. Contact ST sales office for more information. 2. Not recommended for new design. December 2013 DocID15386 Rev 4 1/17 This is information on a product in full production.

2 Contents Contents 1 Electrical ratings Electrical characteristics Electrical characteristics (curves) Test circuit Radiation hardness assurance Package mechanical data Order codes Shipping details Date code Documentation Revision history /17 DocID15386 Rev 4

3 Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V CBO Collector-base voltage (I E = 0) -100 V V CEO Collector-emitter voltage (I B = 0) -80 V V EBO Emitter-base voltage (I C = 0) -5.5 V I C Collector current -5 A Total dissipation at T amb 25 C for TO-39 for TO W W P TOT T C 25 C for TO-39 for TO-257 for SMD.5 TSTG Storage temperature -65 to 200 C TJ Max. operating junction temperature 200 C W W W Table 3. Thermal data for through-hole packages Symbol Parameter TO-39 TO-257 Unit R thjc Thermal resistance junction-case max R thja Thermal resistance junction-ambient max C/W C/W Table 4. Thermal data for SMD package Symbol Parameter SMD.5 Unit R thjc Thermal resistance junction-case max 5 C/W DocID15386 Rev 4 3/17 17

4 Electrical characteristics 2 Electrical characteristics T case = 25 C unless otherwise specified Table 5. Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I CES Collector cut-off current (I E = 0) V CB = - 60 V V CB = - 60 V T amb = 150 C μa μa I EBO Emitter cut-off current (I C = 0) V EB = - 4 V V EB = V -1-1 μa ma I CEO V (BR)CEO (1) V CE(sat) (1) Collector cut-off current (I B = 0) Collector-emitter breakdown voltage (I B = 0) Collector-emitter saturation voltage V CE = - 40 V -50 μa I C = ma -80 V I C = - 5 A I B = A -1.5 V V BE(sat) (1) Base-emitter saturation voltage I C = A I C = - 5 A I B = A I B = A V V h FE (1) DC current gain I C = - 50 ma I C = A I C = - 5 A V CE = - 5 V V CE = - 5 V V CE = - 5 V I C = A V CE = - 5 V T amb = - 55 C 35 h fe AC forward current transfer ratio V CE = - 5 V f = 20 MHz I C = ma 3.5 C OBO Output capacitance I E = 0 f = 1 MHz V CB = - 10 V 250 pf V CC = - 30 V V BB = - 4 V t on Turn-on time V in - 51 V I C = 5 A I B1 = - I B2 = A 0.5 μs V CC = - 30 V V BB = - 4 V t off Turn-off time V in - 51 V I C = - 5 A 1.3 μs I B1 = - I B2 = A 1. Pulsed duration = 300 μs, duty cycle 1.5% 4/17 DocID15386 Rev 4

5 Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2. h CE = 5 V Figure 3. V h FE = 10 1E3 AM12794v1 1 AM12795v1-55 C 25 C 125 C C 25 C 125 C Ic (A) Figure 4. V h FE = C 25 C 125 C AM12796v Ic (A) Ic (A) 1 10 [V] Figure 5. V V CE = 5 V -55 C 25 C 125 C AM12797v Ic (A) DocID15386 Rev 4 5/17 17

6 Electrical characteristics 2.2 Test circuit Figure 6. Resistive load switching test circuit 1. Fast electronic switch 2. Non-inductive resistor 6/17 DocID15386 Rev 4

7 Radiation hardness assurance 3 Radiation hardness assurance The products guaranteed in radiation within the ESCC system fully comply with the ESCC 5201/002 and ESCC specifications. ESCC radiation assurance Each product lot is tested according to the ESCC basic specification 22900, with a minimum of 11 samples per diffusion lot and 5 samples per wafer, one sample being kept as unirradiated sample, all of them being fully compliant with the applicable ESCC generic and/or detailed specification. ST goes beyond the ESCC specification by performing the following procedure: Test of 11 pieces by wafer, 5 biased at least 80% of V (BR)CEO, 5 unbiased and 1 kept for reference Irradiation at 0.1 rad (Si)/s Acceptance criteria of each individual wafer if as 100 krad guaranteed if all 10 samples comply with the post radiation electrical characteristics provided in Table 6 Delivery together with the parts of the radiation verification test (RVT) report of the particular wafer used to manufacture the products. This RVT includes the value of each parameter at 30, 50, 70 and 100 krad (Si) and after 24 hour annealing at room temperature and after an additional 168 hour annealing at 100 C. DocID15386 Rev 4 7/17 17

8 Radiation hardness assurance Table 6. ESCC 5201/002 post radiation electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I CES Collector cut-off current (I E = 0) V CB = - 60 V -1 μa I EBO Emitter cut-off current (I C = 0) V EB = - 4 V V EB = V -1-1 μa ma I CEO V (BR)CEO (1) V CE(sat) (1) Collector cut-off current (I B = 0) Collector-emitter breakdown voltage (I B = 0) Collector-emitter saturation voltage V CE = - 40 V -50 μa I C = ma -80 V I C = - 5 A I B = A -1.5 V V BE(sat) (1) Base-emitter saturation voltage I C = A I C = - 5 A I B = A I B = A V V [h FE ] (1) Post irradiation gain calculation (2) I C = - 50 ma I C = A I C = - 5 A V CE = - 5 V V CE = - 5 V V CE = - 5 V [25] [35] [20] Pulsed duration = 300 μs, duty cycle 1.5% 2. The post-irradiation gain calculation of [h FE ], made using h FE measurements from prior to and on completion of irradiation testing and after each annealing step if any, shall be as specified in MILSTD-750 method /17 DocID15386 Rev 4

9 Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. DocID15386 Rev 4 9/17 17

10 Package mechanical data Figure 7. TO-257 mechanical data Dim. mm Min. Typ. Max. A A A b b D D D e 2.54 E L L P Figure 8. TO-257 mechanical drawing 10/17 DocID15386 Rev 4

11 Package mechanical data Table 7. TO-39 mechanical data Dim. mm Min. Typ. Max. A B C D E F G H I L DocID15386 Rev 4 11/17 17

12 Package mechanical data Figure 9. TO-39 drawing 12/17 DocID15386 Rev 4

13 Package mechanical data Table 8. SMD.5 mechanical data Dim. mm Inch Min. Typ. Max. Min. Typ. Max. A A b b b D D E e Figure 10. TSMD.5 drawing DocID15386 Rev 4 13/17 17

14 14/17 DocID15386 Rev 4 5 Order codes Part number Agency specification 2N5153S N5153ESY - - Table 9. Order codes (1) EPPL Quality level Other features Package Engineering model ESCC Engineering model ESCC Contact ST sales office for information about the specific conditions for: Products in die form Tape and reel packing Lead Finish Marking (2) Packing Emitter on pin 1 SMD.5 Gold 2N5153S1 Strip Pack - TO-257 Gold 2N5153ESY + BeO Strip Pack 2N5153RSHRG 5204/002/06R Yes ESCC Emitter on pin krad: ESCC LDR SMD.5 Gold R Strip Pack 2N5153SHR 5204/002/06 Yes ESCC Emitter on pin 1 SMD.5 Gold Strip Pack 2N5153RHR (3) 5204/002/01R - ESCC 100 krad: ESCC LDR TO-39 Gold R Strip Pack 2N5153RHRT (3) 5204/002/02R - ESCC 100 krad: ESCC LDR TO-39 Solder dip R Strip Pack (3) 5204/002/01 or 02 (4) - ESCC - TO-39 Gold or solder dip or 02 (4) Strip Pack 2N5153RESYHRG 5204/002/04R - ESCC 100 krad: ESCC LDR TO-257 Gold R + BeO Strip Pack 2N5153RESYHRT 5204/002/05R - ESCC 100 krad: ESCC LDR TO-257 Solder dip R + BeO Strip Pack 2N5153ESYHRB 5204/002/04 or 05 (4) - ESCC - TO-257 Gold or solder dip or 05 + BeO (4) Strip Pack 1. Former SW version have been upgraded to ESCC 100 krad Low dose rate version. Contact ST sales office for more information. 2. Specific marking only. The full marking includes in addition: For the Engineering Models: ST logo, date code; country of origin (FR). For ESCC flight parts: ST logo, date code, country of origin (FR), ESA logo, serial number of the part within the assembly lot. For JANS flight parts: ST logo, date code, country of origin (FR), manufacturer code (CSTM), serail number of the part within the assembly lot. 3. Not recommended for new design. 4. Depending ESCC part number mentioned on the purchase order. Order codes

15 Shipping details 6 Shipping details 6.1 Date code Date code xyywwz is structured as below table: Table 10. Date code x yy ww z EM (ESCC) ESCC FLIGHT 3 - last two digits of the year week digits lot index in the week 6.2 Documentation Table 11. Documentation provided for each type of product Quality level Radiation level Documentation Engineering model Certificate of conformance ESCC Flight 100 krad Certificate of conformance 0.1 rad/s radiation verification test report DocID15386 Rev 4 15/17 17

16 Revision history 7 Revision history Table 12. Document revision history Date Revision Changes 10-Dec Initial release 08-Jan Modified Table 1 on page 1 12-Sep Added: Section 2.1: Electrical characteristics (curves) on page 5 12-Dec Updated Table 1: Device summary and Section 4: Package mechanical data. Added Section 3: Radiation hardness assurance, Section 5: Order codes and Section 6: Shipping details. 16/17 DocID15386 Rev 4

17 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America DocID15386 Rev 4 17/17 17

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