LA E65F. Power TOPLED Lens. Applications. Features: Produktdatenblatt Version 1.1 LA E65F

Transcription

1 Produktdatenblatt Version 1.1 Power TOPLED Lens PowerTOPLED with lens, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles and for display panels for traffic control systems. Applications Interior Illumination (e.g. Ambient Map) Signalling Traffic Lights Features: Package: white PLCC-4 package, colorless clear resin Chip technology: Thinfilm Typ. Radiation: 60 Color: λ dom = 617 nm ( amber) Corrosion Robustness Class: 3B ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) 1 Version

2 Ordering Information Type Luminous Intensity 1) Ordering Code = 50 ma I v -DAFA-24-3A4B mcd Q65112A Version

3 Maximum Ratings Parameter Symbol Values Operating Temperature T op min. max. Storage Temperature T stg min. max. -40 C 100 C -40 C 100 C Junction Temperature T j max. 125 C Forward current T S = 25 C Surge Current t 10 µs; D = ; T S = 25 C Reverse voltage 2) T S = 25 C ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) max. 70 ma S max. 100 ma V R max. 12 V V ESD 2 kv 3 Version

4 Characteristics = 50 ma; T S = 25 C Parameter Symbol Values Peak Wavelength 3) λ peak typ. 624 nm Dominant Wavelength 3) = 50 ma λ dom min. typ. max. 612 nm 617 nm 624 nm Spectral Bandwidth at 50% I rel,max λ typ. 18 nm Viewing angle at 50 % I V 2φ typ. 60 Forward Voltage 4) = 50 ma Reverse current 2) V R = 12 V Temperature Coefficient of Peak Wavelength -10 C T 100 C V F I R min. typ. max. typ. max V 2.15 V 2.50 V 0.01 µa 10 µa TC λpeak typ nm / K Real thermal resistance junction/solderpoint 5) R thjs real typ. max. Electrical thermal resistance junction/solderpoint 5) with efficiency η e = 30 % R thjs elec. typ. max. 110 K / W 130 K / W 77 K / W 91 K / W 4 Version

5 Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6) = 50 ma = 50 ma = 50 ma min. max. typ. I v I v Φ V DA 4500 mcd 5600 mcd 6390 mlm DB 5600 mcd 7100 mcd 8040 mlm EA 7100 mcd 9000 mcd mlm EB 9000 mcd mcd mlm FA mcd mcd mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) = 50 ma = 50 ma min. max. V F V F 3A 1.90 V 2.05 V 3B 2.05 V 2.20 V 4A 2.20 V 2.35 V 4B 2.35 V 2.50 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) = 50 ma = 50 ma min. max. λ dom λ dom nm 616 nm nm 620 nm nm 624 nm 5 Version

6 Group Name on Label Example: DA-2-3A Brightness Wavelength Forward Voltage DA 2 3A 6 Version

7 Relative Spectral Emission 6) I rel = f (λ); = 50 ma; T S = 25 C I 1,0 :V λ :amber 0,8 0,6 0,4 0,2 0, λ / Radiation Characteristics 6) I rel = f (ϕ); T S = 25 C ϕ / ,0 I 0, ,6-70 0,4-80 0,2-90 0, Version

8 Forward current 6), 7) Relative Luminous Intensity 6), 7) = f(v F ); T S = 25 C I v /I v (50 ma) = f( ); T S = 25 C / ma I V I V (50mA) , , , ,7 1,8 1,9 2,0 2,1 2,2 2,3 V F / V 0, / ma 8 Version

9 Forward Voltage 6) V F = V F - V F (25 C) = f(t j ); = 50 ma Relative Luminous Intensity 6) I v /I v (25 C) = f(t j ); = 50 ma V F / V 0,3 I v I v (25 C) 1,6 0,2 1,4 1,2 0,1 1,0 0,0 0,8-0,1 0,6 0,4-0,2 0,2-0, T j / C 0, T j / C Dominant Wavelength 6) λ dom = f(t j ); = 50 ma λ / nm T / C 9 Version

10 Max. Permissible Forward Current = f(t) 80 ma 70 OHL TA TS ΤA temp. ambient temp. solder point Τ S C 100 T Permissible Pulse Handling Capability = f(t p ); D: Duty cycle; T A = 25 C Permissible Pulse Handling Capability = f(t p ); D: Duty cycle; T A = 85 C 0.12 A D = OHL02046 D = A OHL02045 D = t P D = T t P T t p s t P D = T t P T t p s Version

11 Dimensional Drawing 8) 0.8 (0.031) 0.6 (0.024) 3.4 (0.134) 3.0 (0.118) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) A A (2.4) (0.095) 3.7 (0.146) 3.3 (0.130) 0.1 (0.004) typ 3.5 (0.138) max. 4 ±1 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) ø2.60 (0.102) ø2.55 (0.100) A A A C Package marking 1.1 (0.043) 0.5 (0.020) 0.6 (0.024) 0.4 (0.016) 0.18 (0.007) 0.13 (0.005) A C GPLY6085 Approximate Weight: Package marking: 38.0 mg Cathode Corrosion test: Class: 3B Test condition: 40 C / 90 % RH / 15 ppm H 2 S / 14 days (stricter then IEC ) 11 Version

12 _< Recommended Solder Pad 8) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Anode 3.3 (0.130) Fläche darf bei Verwendung von TOPLED elektrisch nicht beschaltet werden. For TOPLED assembly do not use this area for electrical contact 3.3 (0.130) 2.3 (0.091) 0.8 (0.031) Lötstoplack Solder resist For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. OHLPY (0.146) 1.1 (0.043) 1.5 (0.059) 11.1 (0.437) 0.7 (0.028) Kathode/ Cathode Fläche darf bei Verwendung von TOPLED elektrisch nicht beschaltet werden. For TOPLED assembly do not use this area for electrical contact Cu Fläche / Cu-area 16 mm 2 per pad 12 Version

13 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 300 C T C 217 C 200 t P t L T p OHA C 150 t S C s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L s Peak temperature T P C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P s 3 4 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version

14 Taping 8) 14 Version

15 Tape and Reel 9) Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 330 mm / Version

16 _< C). _< If wet, 5% parts still adequately dry. change desiccant If wet, 10% examine units, if necessary bake units If wet, 15% examine units, if necessary bake units WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD Version

17 _< C). _< ML C R 2a (9D) D/C: Bin2: Q-1-20 Bin3: ML Temp ST C R 2a Transportation Packing and Materials 8) Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours LEVEL If blank, see bar code label OSRAM Opto Semiconductors LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OHA02044 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH (Q)QTY: 2000 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: (X) PROD NO: 1 123GH1234 Muster (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OSRAM Packing Sealing label Dimensions of transportation box in mm Width Length Height 349 ± 5 mm 349 ± 5 mm 33 ± 5 mm 17 Version

18 Schematic test method for partial flux measurement 18 Version

19 Type Designation System Wavelength Emission Color Color coordinates according (λ dom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CW: warm white Y: 587 nm yellow CB: color on demand blue O: 606 nm orange CR: crystal pink CP/P: 560 nm R: 625 nm red B: 470 nm blue pure green Package Type E: PowerTOPLED L: Light emitting diode L A E Lead / Package Properties 6: folded leads T: folded leads, improved corrosion stability (Au-LF), w/o TiO2 jetting Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion (resin encapsulation) S: Silicone (with or without diffuser) 3: lens : lens Chip Technology: 5: HOP 2000 B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) 19 Version

20 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC For further application related informations please visit 20 Version

21 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 21 Version

22 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC and specified in mm. 22 Version

23 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved. 23 Version