LINEAR INTEGRATED CIRCUIT

Transcription

1 TDA W CAR RADIO AUDIO AMPLIFIER DESCRIPTION The TDA is a monolithic audio power amplifier integrated circuit. FEATURES *Very low external component required. *High current output ( up to A). *Low harmonic and crossover distortion. *Built-in Over temperature protection. *Short circuit protection between all pins. PIN CONFIGURATIONS Non inverting input Inverting input Ground Output Supply Voltage TO-B BLOCK DIAGRAM Microelectronics Co.,Ltd.

2 TDA ABSOLUTE MAXIMUM RATINGS(Ta= C) PARAMETER SYMBOL VALUE UNIT Peak Supply Voltage Vs V DC Supply Voltage Vs V Operating Supply Voltage Vs V Output Peak Current (repetitive) Io. A Output Peak Current ( non repetitive) Io. A Power Dissipation at Tcase = 9 C W Storage Temperature Tstg -~+ C Junction Temperature Tj -~+ C ELECTRICAL CHARACTERISTICS(Refer to the test circuit,vs=+-6v,ta= C) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT DC CHARACTERISTICS Supply Voltage Vs V Quiescent Output Vo V Voltage Quiescent Drain Current Id ma AC CHARACTERISTICS d=%,f=khz RL=. 6 Output Power Po RL= 9 W RL=. 7. RL=.6 f=khz Po=.W,RL= mv Input Sensitivity Vi Po=6W,RL= mv Po=.W,RL= mv Po=W,RL= mv Input Saturation Voltage Vi(rms) mv Frequency B Po=W,RL= Hz Response(-dB) f=khz Distortion D Po=. to.w,rl=. % Po=. to 7.W,RL=. Input Resistance(Pin ) Ri open loop,f=khz 7 k Input Noise Current e N 6 pa Input Noise Voltage I N V Open Loop Gvo f=khz db Voltage Gain f=khz 6 db Closed Loop Gvc f=khz Voltage Gain RL= 9.. db Microelectronics Co.,Ltd.

3 TDA PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT f=khz Efficiency Po=6W,RL= 69 % Po=W,RL= 6 % Supply Voltage Rejection SVR f=hz,vripple=.v Rg=k,RL= 6 db TEST CIRCUIT +Vs Vi C F TDA Rx 9 Cx 9nF F C 7 F C nf R R. C F R RL nf Rx=*R Cx=/( B*R) Vi DC Test Circuit TDA 7 F ma +Vs nf F V R R. RL Vi C F AC Test Circuit +Vs TDA Rx 9 Cx 9nF F C 7 F C nf C F R R R. nf RL Rx=*R Cx=/( B*R) Microelectronics Co.,Ltd.

4 TDA TYPICAL PERFORMANCE CHARACTERISTICS Vo(V) Fig.Quiescentoutputvoltage vs.supplyvoltage Id(mA) Fig.Quiescentdraincurrent vs.supplyvoltage Po Fig.Outputpowervs.Supply voltage Gv=dB f=khz d=% R= R= R=. R= 6 Vs(V) 6 Vs(V) Vs(V) Fig.outputpowervs.load resistance Fig.Gainvs.Inputsensitivity Fig.6Gainvs.Inputsensitivity Po 6 Vs=6V Gv=dB f=khz d=% Gv=dB f=khz RL= Gv=dB f=khz RL= Vs=.V Vs=V 6 6 Vs=V 6 RL( ) Vi(rms) Vi(rms) Fig.7Distortionvs. outputpower Fig.Distortionvs. frequency Fig.9Supplyvoltagerejection vs.voltagegain d(%) Gv=dB f=khz Vs=.V R= R=. R= R=.6 d(%)..6 Gv=dB Vs=.V RL= / SVR (db) - - fripple=hz Vs=,V RL=. Rg=k. Po=.W -.. Po=mW -.. Po( ) Frequency (Hz) - Gv(dB) Microelectronics Co.,Ltd.

5 TDA SVR (db) - - Fig. Supply voltage rejection vs.frequency Vs=.V Vripple=.V Gv=dB f=khz Rg=k R= 6 Fig. Power dissipation and efficiency vs. output power(rl= ) Vs=.V Gv=dB f=khz (%) 6 6 Fig. Power dissipation and efficiency vs. output power(rl= ) Vs=.V Gv=dB f=khz (%) 6-6 R= - frequency(hz) 6 Po 6 Po Fig. Maximum Power dissipation and supply voltage(sine wave operation) Fig. Maximum allowable dissipation and ambient temperature infiniteheatsink Cx (nf) Fig. Typical values of capacitor(cx) for different values of frequency response B=kHz B=kHz RL=.6 RL= RL=. RL= X C/W X C/W R=. B=kHz Vs(V) Tamb( X C) 6 Gv(dB) APPLICATION CIRCUIT +Vs Vi C F F TDA C nf C F Rx 9 Cx 9nF C 7 F R R. R RL nf Rx=*R Cx=/( B*R) Fig 6 Typical Application Circuit Microelectronics Co.,Ltd.

6 TDA Vs=.V. F. F. F TDA. F RL= TDA C F 6 C F 6 Fig. W Bridge Configuration Application The Values of the capacitors C and C are different to optimize the SVR(Typ. db) Vs=.V. F. F TDA. F RL=. F TDA. F C F 6 nf Fig. Low Cost Bridge Configuration Application Circuit(Po=W) Microelectronics Co.,Ltd. 6

7 TDA BUILT-IN PROTECTION SYSTEMS LOAD DUMP VOLTAGE SURGE The TDA has a circuit which enables it to withstand a volt. CHARACT age pulse train, on pin, of the type shown in Fig.. If the supply voltage peaks to more than V, then an LC filter must be inserted between the supply and pin, in order to assure that the pulses at pin will be head within the limits shown in Fig.. A suggested LC network is shown in Fig..With this network, a train of pulses with amplitude up to V and width of ms can be applied at point A. This type of protection is ON when the supply voltage(pulsed or DC) exceeds V.For this reason the maximum operating supply voltage is V. Vs (V) t=ms A mh B From Supply Voltage F 6V To Pin. t=ms t SHORT CIRCUIT (AC and DC Conditions) The TDA can withstand a permanent short-circuit on the output for a supply voltage up to 6V. POLARITY INVERSION High current(up to A) can be handled by the device with no damage for a longer period than the blow-out time of a quick A fuse(normally connected in series with the supply). The feature is added to avoid destruction if, during fitting to the car, a mistake on connection of the supply is made. OPEN GROUND When the radio is in the ON condition and the ground is accidentally opened, a standard audio amplifier will be damaged. On the TDA protection diodes are included to avoid any damage. INDUCTIVE LOAD A protection diode is provide between pin and pin (see the internal schematic diagram) to allow use of the TDA with inductive loads. In particular, the TDA can drive a coupling transformer for audio modulation. DC VOLTAGE The maximum operating DC voltage on the TDA is V. However the device can withstand a DC voltage up to V with no damage. This could occur during winter if two batteries were series connected to crank the engine. Microelectronics Co.,Ltd. 7

8 TDA THERMAL SHUT-DOWN The presence of a thermal limiting circuit offers the following advantages: ).an overload on the output (even if it is permanent),or an excessive ambient temperature can be easily withstood. ).the heat-sink can have a smaller factor compared with that of a conventional circuit. There is no device damage in case of excessive junction temperature: all that happens is that Po ( and there ) and Id are reduced. APPLICATION SUGGESTION The recommended values of the components are those shown on application circuit of Fig.6. Different values can be used. The following table can help the designer. COMPONENT RECOMMENDED VALUE PURPOSE LARGE THAN RECOMMENDED VALUE LARGE THAN RECOMMENDED VALUE R (Gv-)*R gain setting. increase of Gain R. gain and SVR Decrease of SVR setting. R Frequency stability Danger of oscillation at high frequencies with inductive loads. Rx R Upper frequency Poor high frequencies Dange of oscillation cutoff attenuation C. F Input DC decoupling Noise at switch-on switch-off C 7 F Ripple rejection Decrease of SVR C. F Supply voltage bypass Dange of oscillation C F Supply voltage bypass Higher low frequency cutoff C. F Frequency stability Danger of oscillation at high frequencies with inductive loads. Cx /( *B*R) Upper frequency cutoff smaller bandwidth Larger bandwidth Microelectronics Co.,Ltd.

9 This datasheet has been downloaded from: Datasheets for electronic components.