LV5681P. Monolithic Linear IC Multi-Power Supply System IC for Car Audio Systems. Ordering number : ENA1902A.

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1 Ordering number : ENA02A LV568P Monolithic Linear IC Multi-Power Supply System IC for Car Audio Systems Overview The LV568P is a multi-power supply system IC that provides four regulator outputs and two high side switches as well as a number of protection functions including overcurrent protection, overvoltage protection and overheat protection. It is an optimal power supply IC for car audio and car entertainment systems and similar products. Features Four regulator output systems For microcontroller: 5.V output voltage, 200mA maximum output current For CD drive:.0v output voltage, 300mA maximum output current For illumination: 8 to 2V output voltage (output can be set with external resistors), 300mA maximum output current For audio systems: 8 to V output voltage (output voltage can be set with external resistors), 300mA maximum output current Two VCC-linked high side switch systems EXT: 350mA maximum output current, 0.5V voltage difference between input and output. ANT: 300mA maximum output current, 0.5V voltage difference between input and output. Two VDD 5V-linked high side switch systems SW5V: 200mA maximum output current, 0.2V voltage difference between input and output. ACC (accessory voltage detection output): 00mA maximum output current, 0.2V voltage difference between input and output. Overcurrent protection function Overvoltage protection function, typ 2V (excluding VDD 5V output) Overheat protection function, typ 5ºC On-chip accessory voltage detection circuit P-channel LDMOS used for power output block CAUTION) The protection functions are provided in order to improve the ability of the ICs to withstand breakdown, and they are not intended to guarantee safety when used under conditions outside the safe operating area or rated operating conditions. Use of the ICs under any conditions exceeding the safe operating area or above the IOmax, and especially use in overcurrent protection areas or under conditions in which they are subject to thermal protection, may reduce their reliability and result in permanent breakdown. Semiconductor Components Industries, LLC, 203 August, 203 O26 SY 2004-S00003/D220 SY S00005 No.A02-/4

2 LV568P Specifications Absolute Maximum Ratings at Ta = 25 C Parameter Conditions Conditions Ratings Unit Supply voltage max 36 V Peak supply voltage peak See below for the waveform applied. 50 V Allowable Power dissipation Pd max Independent IC Ta 25 C.5 W Al heat sink * 5.6 W With an infinity heat sink 32.5 W Junction temperature Tj max 50 C Operating ambient temperature Topr -40 to 85 C Storage temperature Tstg -55 to 50 C * : When the Aluminum heat sink (50mm 50mm.5mm) is used Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Allowable Operating range at Ta = 25 C Parameter Conditions Ratings Unit Operating supply voltage V DD output, SW output, ACC output.5 to 6 V Operating supply voltage 2 ILM output at 0V 2 to 6 V ILM output at 8V 0 to 6 V Operating supply voltage 3 Audio output at V 0 to 6 V Operating supply voltage 4 CD output (CD output current =.3A) 0.5 to 6 V CD output (CD output current A) 0 to 6 V Electrical Characteristics at Ta = 25 C, VCC = 4.4V *: All the specifications are defined based on the tests that Tj is almost equal to Ta (=25 C). To suppress the rise of Tj in the junction temperature as much as possible, it tests by the pulse loading. Parameter Symbol Conditions Ratings min typ max Current drain I CC V DD no load, CTRL/2 = L/L, ACC = 0V μa CTRL Input Low input voltage V IL V M input voltage V IM V M2 input voltage V IM V High input voltage V IH V Input impedance R IH kω CTRL2 Input Low input voltage V IL V M input voltage V IM V High input voltage V IH V Input impedance R IH kω V DD 5.V Output * The V DD 5.V output supplies the output currents of SW 5.V and ACC 5.V. Output voltage V O I O = 200mA, I O, I O 8 = 0A V Output voltage 2 V O I O = 200mA, I O = 200mA, I O 8 = 00mA V Output total current Ito V O 5.4V, Ito = I O I O I O ma Line regulation ΔV OLN.5V < < 6V, I O = 200mA * mv Load regulation ΔV OLD ma < I O < 200mA * mv Dropout voltage V DROP I O = 200mA *2.0.5 V Dropout voltage 2 V DROP I O = 00mA * V Dropout voltage 3 V DROP I O I O I O 8 = 500mA V Ripple rejection R REJ f = 20Hz, I O = 200mA * db CD Output ; CTRL2 = H Output voltage V O 2 I O 2 = 000mA V * : The V DD 5.V output also supplies the output currents of SW 5.V and ACC 5.V. Therefore, the current supply capability of the V DD 5.V output and its other electrical characteristics are affected by the output statuses of SW 5.V and ACC 5.V. *2 : SW 5V and ACC 5.V are not subject to a load. Continued on next page. Unit No.A02-2/4

3 LV568P Continued from preceding page. Ratings Parameter Symbol Conditions Unit min typ max Output current I O 2 V O V 300 ma Line regulation ΔV OLN 2 0.5V < < 6V, I O 2 = 000mA mv Load regulation ΔV OLD 2 0mA < I O 2 < 000mA mv Dropout voltage V DROP 2 I O 2 = 000mA.0.5 V Dropout voltage 2 V DROP 2 I O 2 = 500mA V Ripple rejection R REJ 2 f = 20Hz, I O 2 = 000mA db AUDIO (8-V) Output ; CTRL2 = M AUDIO_F pin voltage V I V AUDIO_F pin inflow current I IN 3 - μa AUDIO output voltage V O 3 I O 3 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ * V AUDIO output voltage 2 V O 3 I O 3 = 200mA, R2 = 2kΩ, R3 = 4.kΩ * V AUDIO output voltage 3 V O 3 I O 3 = 200mA, R2 = 24kΩ, R3 = 3.kΩ * V AUDIO output current I O ma Line regulation ΔV OLN 3 0V < < 6V, I O 3 = 200mA 30 0 mv Load regulation ΔV OLD 3 ma < I O 3 < 200mA 0 50 mv Dropout voltage V DROP 3 I O 3 = 200mA V Dropout voltage 2 V DROP 3 I O 3 = 00mA V Ripple rejection R REJ 3 f = 20Hz, I O 3 = 200mA db ILM (8-2V) Output ; CTRL = M ILM_F pin voltage V I V ILM output voltage V O 4 I O 4 = 200mA, R2 = 30kΩ, R3 = 5.6kΩ * V ILM output voltage 2 V O 4 I O 4 = 200mA, R2 = 2kΩ, R3 = 3.kΩ * V ILM output voltage 3 V O 4 I O 4 = 200mA, R2 = 33kΩ, R3 = 3.kΩ * V ILM output current I O ma Line regulation ΔV OLN 4 2V < < 6V, I O 4 = 200mA 30 0 mv Load regulation ΔV OLD 4 ma < I O 4 < 200mA 0 50 mv Dropout voltage V DROP 4 I O 4 = 200mA V Dropout voltage 2 V DROP 4 I O 4 = 00mA V Ripple rejection R REJ 4 f = 20Hz, I O 4 = 200mA db Remoto (EXT) ; CTRL = M2 Output voltage V O 5 I O 5 = 350mA V Output current I O 5 V O ma ANT remoto ; CTRL = H Output voltage V O 6 I O 6 = 300mA V Output current I O 6 V O ma SW 5V Output ; CTRL2 = M Output voltage V O I O = ma, I O, I O 8 = 0A *4 V O V O V Output voltage 2 V O I O = 200mA, I O, I O 8 = 0A *4 V O V O -0.2 V Output current I O V O ma ACC Detection ; ACC Integration 5V output ACC detection voltage V TH V Hysteresis width V HIS V Input impedance ZI8 (Pull-down resistance internal) kω ACC output voltage V O 8 I O 8 = 0.5mA, I O, I O = 0A *4 V O V O V ACC output voltage 2 V O 8 I O 8 = 00mA, I O, I O = 0A *4 V O V O -0.2 V ACC output voltage I O 8 V O ma *3 : When a component with a resistance accuracy of ±% is used <Reference> When a component with a resistance accuracy of ±0.5% is used, V O 3 is 8.6V.0V.33V. *4 : Since the SW 5.V and ACC 5.V are output from V DD 5.V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW. No.A02-3/4

4 Package Dimensions unit : mm (typ) 335 (R.5) (.6) (.) 2.6 (20.0) (5.8) HEAT SINK. (4.55) 3.35 (.0) (.05) LV568P HEAT SPREADER Allowable power dissipation, Pd max -- W Allowable power dissipation derating curve Pd max -- Ta Aluminum heat sink mounting conditions tightening torque : 3N cm, using silicone grease Aluminum heat sink ( mm 3 ) when using Independent IC Ambient temperature, Ta -- C SANYO : HZIP5J Waveform applied during surge test 50V 0% 0% 6V 5msec 00msec No.A02-4/4

5 Block Diagram LV568P B C C2 EXT out 5 Remote EXT( -0.5V) D 350mA C3 D2 Over Voltage Protection Start up ANT out 4 ANT Remote ( -0.5V) D3 300mA C4 D4 Vref - 2 ILM output (8V to 2V) 300mA R C5 C6 ILM_F R2 CTRL (four-value control) CTRL2 (three-value control) 8 6 OUTPUT Control AUDIO output (8V to V) 300mA R3 C C8 AUDIO_F R4-3 CD output (V) 300mA C C0 Thermal Shut Down - 2 VDD output (5.V) 200mA C C2 ACC 0 - Output Current Limit Circuit 3 SW output (5.V) 200mA ACC output (5.V) 00mA Pin Function Pin No. Pin name Description Equivalent Circuit ILM ILM output pin ON when CTRL = M, M2, H 8.0 to2.0v/300ma 2 ILM_F ILM output voltage adjustment pin 2 Continued on next page. No.A02-5/4

6 LV568P Continued from preceding page. Pin No. Pin name Description Equivalent Circuit 3 CD CD output pin ON when CTRL2 = M, H.0V/.3A 3 4 AUDIO_F AUIDO output voltage adjustment pin 5 5 AUDIO AUDIO output pin ON when CTRL2 = M, H 8.0 to.0v/300ma 4 6 CTRL2 CTRL2 input pin three-value input VCC 6 500kΩ Supply terminal 8 CTRL CTRL input pin four-value input VCC 8 500kΩ pin Continued on next page. No.A02-6/4

7 LV568P Continued from preceding page. Pin No. Pin name Description Equivalent Circuit 0 ACC Accessory input 0 45kΩ 5kΩ ACC5V Accessory detection output ON when ACC > 3V 2 V DD 5V V DD 5.V output pin 5.V/500mA 2 3 SW5V SW5.V output pin ON when CTRL2 = M, H 3 4 ANT ANT output pin ON when CTRL = H -0.5V/300mA 4 5 EXT EXT output pin ON when CTRL = M2, H -0.5V/350mA VCC 5 No.A02-/4

8 CTRL Pin Output Truth Table LV568P CTRL ANT EXT ILM CTRL2 CD AUDIO SW5 L OFF OFF OFF L OFF OFF OFF M OFF OFF ON M OFF ON ON M2 OFF ON ON H ON ON ON H ON ON ON Timing Chart (Pin ) 2V V DD 5.V output (Pin 2) CTRL input (Pin 8) CTRL2 input (Pin 6) CD output (Pin 3) AUDIO output (Pin 5) ILM output (Pin ) EXT output (Pin 5) ANT output (Pin 4) SW5.V output (Pin 3) ACC input (Pin 0) 3.0V 2.V ACC output (Pin ) No.A02-8/4

9 Recommended Operation Circuit LV568P ILM ILM_F 2 CD 3 AUDIO_F 4 AUDIO 5 CTRL2 6 CTRL 8 ACC 0 ACC5.V V DD 5.V 2 SW5.V 3 ANT 4 EXT 5 C5 C6 R R2 C C2 R4 R3 CTRL2 CTRL ACC ACC5.V SW5.V C C8 C C2 C C2 C4 D3 D4 C3 D D2 ILM CD AUDIO V DD 5.V ANT EXT Peripheral parts list Name of part Description Recommended value Remarks C Power supply bypass capacitor 00μF or more These capacitors must be placed near C2 Oscillation prevention capacitor 0.22μF or more the and pins. C3 EXT output stabilization capacitor 2.2μF or more C4 ANT output stabilization capacitor 2.2μF or more C5, C5 C, C Output stabilization capacitor 4.μF or more Electrolytic capacitor * C6, C8, C0, C2 Output stabilization capacitor 0.22μF or more Ceramic capacitor * R/R2 A resistor with resistance accuracy as R,R2 Resistor for ILM voltage adjustment :30kΩ/5.6kΩ = 8.0V low as less than ±% must be used. :2kΩ/3.kΩ = 0.0V :33kΩ/3.kΩ =.V R3, R4 Resistor for AUDIO voltage setting R3/R4 :30kΩ/5.6kΩ = 8.0V A resistor with resistance accuracy as :2kΩ/4.kΩ = 8.5V low as less than ±% must be used. :24kΩ/3.kΩ =.0V D, D2, D3, D4 Diode for internal device breakdown protection * : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel. Furthermore, the values listed above do not guarantee stabilization during the overcurrent protection operations of the regulator, so oscillation may occur during an overcurrent protection operation. No.A02-/4

10 LV568P AUDIO/ILM output voltage setting method.26v 5 4 AUDIO AUDIO_F R R2 The AUDIO_F voltage is determined by the internal band gap voltage of the IC (typ =.26V). Formula for AUDIO voltage calculation.26[ V ] AUDIO = R.26[ V ] R R R 2 2 (.26) = AUDIO.26 The circuit must be designed in such a way that the R:R2 ratio satisfies the formula given above for the AUDIO voltage that has been set. Example : AUDIO = 8.5V setting method R R R R ( ) = kΩ = 4.kΩ The ILM output voltage can be set by the above-mentioned method. AUDIO =.26V V 8.4V Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the effects of production-related variations of the IC and external resistors. No.A02-0/4

11 CTRL Application Circuit Example R A CTRL B R2 500kΩ LV568P () 3.3V input: R = 4.kΩ, R2 = 0kΩ A B CTRL 0V 0V 0V 0V 3.3V.05V 3.3V 0V 2.23V 3.3V 3.3V 3.20V CTRL2 Application Circuit Example R3 C R4 CTRL2 D 500kΩ () 3.3V input: R3 = R4 = 4.kΩ A B CTRL2 0V 0V 0V 0V 3.3V.6V 3.3V 0V.6V 3.3V 3.3V 3.2V Caution for implementing LV568P to a system board In HZIP5J, the package used in this IC, there are several metal exposure other than the connection pins and heat-sinks as shown in the following diagrams. In the diagrams, the electric potential of 2 and 3 are the same as Pin5 and Pin, respectively. 2 (=Pin5) is EXT pin and 3 (=Pin) is ILM output (regulator). When the IC is implemented to the system, make sure that no attachment clamp touches the exposed Pin/ Pin5. When the exposed Pin/ Pin5 touch the attachment clamp (same electrical potential as ), ILM output or VCC enter the same state as time when was shorted. The electric potential of the exposed metal connected to heat-sinks is the same as that of sub board of the IC (). Therefore, even if the exposed metal and of the system board are adjacent to each other, there should be no problem. HZIP5J external view Heat-sink 2 5PIN PIN Heat-sink Same potential Same potential 3 Same potential Same potential Heat-sink side Heat-sink Same potential Heat-sink side <Top view of HZIP5J> :Metal exposure <Side view of HZIP5J> :Metal exposure No.A02-/4

12 LV568P Frame diagram (LV568P) *In the system power supply other than LV568P, pin assignment may differ. Metal exposure Metal exposure 3 Metal exposure 2 Metal exposure Metal exposure LV568 Metal exposure PIN 5PIN No.A02-2/4

13 HZIP5J Heat sink attachment LV568P Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be applied to the heat sink or tabs. b. Heat sink attachment Use flat-head screws to attach heat sinks. Use also washer to protect the package. Use tightening torques in the ranges 3-5Ncm(4-6kgcm). If tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. Do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. Take care a position of via hole. Do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. Verify that there are no press burrs or screw-hole burrs on the heat sink. Warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for either concave or convex warping. Twisting must be limited to under 0.05 mm. Heat sink and semiconductor device are mounted in parallel. Take care of electric or compressed air drivers The speed of these torque wrenches should never exceed 00 rpm, and should typically be about 400 rpm. Binding head machine screw Heat sink gap Via hole Countersunk head mashine screw c. Silicone grease Spread the silicone grease evenly when mounting heat sinks. Our company recommends YG-6260 (Momentive Performance Materials Japan LLC) d. Mount First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. When mounting the semiconductor device to the heat sink using jigs, etc., Take care not to allow the device to ride onto the jig or positioning dowel. Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. Heat sink screw holes Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. A hole diameter about 5% larger than the diameter of the screw is desirable. When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about 5% smaller than the diameter of the screw is desirable. g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not recommended because of possible displacement due to fluctuation of the spring force with time or vibration. No.A02-3/4

14 LV568P ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitabilityof its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PS No.A02-4/4