Background Statement for SEMI Draft Document 5728 New Standard: Test Method for the Wire Tension of Multi-wire Saws

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1 Background Statement for SEMI Draft Document 5728 ew Standard: Test Method for the Wire Tension of Multi-wire Saws otice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document. otice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, patented technology is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Background statement: With the rapid development of PV and semiconductor industry all over the world, multi-wire saws is more and more widely used. However, currently there is no common industrial standard available in this field, thus customers can t effectively verify machine s performance. To solve the above problem, the research group developed a basic testing method based on mass production and usage data collected from many research institutes and enterprises. Performance of multi-wire saws can be effectively verified by the method. Review and Adjudication Information Task Force Review Committee Adjudication Group: Multi-wire Saws Task Force China Photovoltaic Committee Date: March 2 nd, 2015 March 17 th, 2015 Time &Timezone: 9:00--12:00 9:30--18:00 Location: CETC 48 th Institute Pudong Ballroom 4, Kerry Hotel, Pudong, Shanghai City, State/Country: Changsha, China Shanghai, China Leader(s): Honglin Sui(CETC 48 th Institute) Guangchun Zhang(CanadianSolar) Jun Liu(CESI) Standards Staff: Kris Shen(SEMI China) kshen@semi.org Kris Shen(SEMI China) kshen@semi.org Meeting date and time are subject to change, and additional TF review sessions may be scheduled if necessary. Contact the task force leaders or Standards staff for confirmation.checkwww.semi.org/standards for the latest schedule. If you have any questions, please contact the ballot author at: Honglin Sui/ CETC 48 th Institute Tel: suihl@cs48.com

2 SEMI Draft Document 5728 ew Standard: Test Method for the Wire Tension of Multi-wire Saws 1 Purpose 1.1 The document provides a test method for the wire tension of multi-wire saws, which helps the customers to confirm the ability of controlling wire tension and provides a reliable basis for wire tension calibration. 1.2 The document includes test principles, test equipments, test procedures and calculation for the effective control range of wire tension. 2 Scope 2.1 The document provides a test method for the wire tension of multi-wire saws. 2.2 The document is applicable to tension test of brick master and other wire cutting equipments. OTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use. 3 Referenced Standards and Documents 3.1 one 4 Terminology 4.1 Refer to the SEMI Standards Compilation of Terms (COTs) for a list of the current Abbreviations, Acronyms, Definitions, and Symbols. 4.2 Definitions T si The i th set value of the wire tension (i= 1, 2, 3... n) T pij The j th practical value of the wire tension when the set value is T si (j = 1, 2, 3... m) T pi The average of practical values when the set value is T si ΔT The allowable deviation of practical value T max_i The maximum allowable value of T pi when the set value is T si T min_i The minimum allowable value of T pi when the set value is T si T up The upper limit value of the control range for wire tension, determined by the performance parameters of equipment T low The lower limit value of the control range for wire tension, determined by the performance parameters of equipment. 5 Summary of Test Method 5.1 This test method uses a single-point measurement. Schematic diagram is shown in Figure 1. Select a point between the winding wheel and the main roller, than wire tension values can be measured with a strain-gauge tension meter. With the comparison of practical value and set value, the effective control range of wire tension could be calculated. Page 1

Figure 1 Schematic diagram of the wire tension test of multi-wire saws 6 Test Conditions 6.1 The test conditions must meet the following requirements: 6.1.1 Ambient temperature: 18 ~28. 6.1.2 Relative humidity <75%.

5%, the maximum wire speed 1000m / min). 7.1.2 Wire for test. The maximum tension value of wire should be higher than T up. 8

3 Figure 1 Schematic diagram of the wire tension test of multi-wire saws 6 Test Conditions 6.1 The test conditions must meet the following requirements: Ambient temperature: 18 ~ Relative humidity <75% Voltage fluctuations do not exceed rating of ±10%. 7 Apparatus 7.1 Test devices must be approved by a professional metrology institute and certified within the validity period Strain-gauge tension meter with wire diameter compensator (accuracy better than 0.5%, the maximum wire speed 1000m / min) Wire for test. The maximum tension value of wire should be higher than T up. 8 Procedure 8.1 The multi-wire saws is set and wired. 8.2 Place the strain-gauge tension meter on a point between the winding wheel and the main roller. Measurement is shown in Figure 2. Figure 2 Schematic diagram of tension test 8.3 The selection of set value T si Select T low as the first set value T s1, T s1 =T low. Page 2

4 8.3.2 The rest set values can be calculated by the formula T si = T s1 + (i-1) 2(2 is the recommended increase step size) The selection for T sn : When T si = T s1 + (i-1) 2 T up, set n=i, T sn =T up. 8.4 Set the wire speed of the multi-wire saws to process speed. When the set value is T si, T pij (j=1,2,3 m) should be recorded every few seconds, the test procedure of T pi is shown in Figure 3 (recommended interval time is 10s, m = 5, ΔT=0.3). i=1 T si T pij, j=1,2...m T pi m T pij j 1 m T pi -ΔT<T pij <T pi +ΔT loops<3 Record T pi Equipment maintenance i=i+1 i<n End Figure 3 The Test Procedure of T pi 9 Calculation for the Effective Control Range of Wire Tension 9.1 According tot p1, T p2... T pn, test curve is plotted as shown in Figure According to Figure 4, the range of T pi between T min_i and T max_i is [T s2, T s21 ], which is the effective control range of wire tension (recommended T max_i =T si +1, T min_i =T si -1). Page 3

5 Figure 4 The Test Curve of T pi 10 Test Report 10.1 The test report should include at least the following elements: The model name of multi-wire saws; The type and model name of the detection equipment; The test environment and conditions; Test basis; Test results; Test dates and personnel; Authorized stamp of testing units. OTICE: SEMI makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice. By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of anypatentrights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users ofthis Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights,and the risk of infringement of such rights are entirely their own responsibility. Page 4

Background Statement for SEMI Draft Document 5530 NEW STANDARD: SPECIFICATION FOR ORIENTATION FIDUCIAL MARKS FOR PV SILICON WAFERS

Background Statement for SEMI Draft Document 5530 NEW STANDARD: SPECIFICATION FOR ORIENTATION FIDUCIAL MARKS FOR PV SILICON WAFERS Notice: This background statement is not part of the balloted item. It