MQ1271VP LDMOS TRANSISTOR

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GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

Preliminary GTVA126001EC/FC

PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics

not recommended for new design

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

not recommended for new design Efficiency (%) Characteristic Symbol Min Typ Max Unit Intermodulation Distortion IMD dbc

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

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transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

350 W, MHz, 50-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems. = 25 C) of Demonstration Amplifier

Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated

CGH55030F2 / CGH55030P2

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

PTFC270101M. High Power RF LDMOS Field Effect Transistor 10 W, 28 V, MHz. Description. Features. RF Characteristics

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

Watts W/ C Storage Temperature Range Tstg 65 to +200 C Operating Junction Temperature TJ 200 C. Test Conditions

well as multi-octave bandwidth amplifiers up to 4 GHz. The transistor is available in a 2-lead flange and = 25 C), 50 V

BLF6G10LS-135R. 1. Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

BLF6G10LS Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

Product Data Sheet Rev. 2.2, 12/2017

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

Watts W/ C Storage Temperature Range Tstg 65 to +150 C Operating Junction Temperature TJ 200 C

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

Advance PTNC210604MD. Wideband LDMOS Two-stage Integrated Power Amplifier 20 W + 40 W, 28 V, MHz. Description. Features

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

BLF6G10-135RN; BLF6G10LS-135RN

= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features

CGH35060F1 / CGH35060P1

TGA2818-SM S-Band 30 W GaN Power Amplifier

FEATURES PACKAGE TYPICAL PERFORMANCE DESCRIPTION ORDERING INFORMATION

CGH55015F2 / CGH55015P2

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

= 25 C) Parameter 8.0 GHz 9.0 GHz 10.0 GHz 11.0 GHz Units Small Signal Gain db P OUT. = 25 dbm W Power P IN

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

CPH6354. Power MOSFET 60V, 100mΩ, 4A, Single P-Channel. Features. Specifications

RF Power LDMOS Transistor N--Channel Enhancement--Mode Lateral MOSFET

IMD D3 (dbc) Characteristic Symbol Min Typ Max Unit. Input Return Loss IRL 15 db

CGH55030F1 / CGH55030P1

Efficiency (%) c201202fc-v2-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

= 25 C) Parameter 2.7 GHz 2.9 GHz 3.1 GHz 3.3 GHz 3.5 GHz Units Small Signal Gain db

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

T1G FS 30W, 28V, DC 6 GHz, GaN RF Power Transistor

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

RF Power LDMOS Transistor N--Channel Enhancement--Mode Lateral MOSFET

LDMOS RF Power Transistor HTN7G21P160H. 1. Features. 2. Applications. 3. Items for Ordering. Package:H2110S-6L. Pin Connections

RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs

Transcription:

700W, 50V High Power RF LDMOS FETs Description The MQ1271VP is a 700-watt, high performance, internally matched LDMOS FET, designed for multiple applications with frequencies 960 to 1215MHz. It is featured for high power and high ruggedness, suitable for Industrial, Scientific and Medical application, as well as Avionics applications. It is recommended to use this device under pulse condition only. Typical Performance (on innogration s test fixture with device soldered): Vds = 50 V, Idq = 100 ma, Pulse width:100us, duty cycle: 10%, MQ1271VP Freq(MHz) P3dB(dBm) Gain(dB) EFF(%) 960 60.4 13.8 46.1 1000 60.6 15.1 51.3 1030 60.4 15.2 53.5 1050 60.2 15.1 53.9 1090 59.7 14.6 52.4 1100 59.6 14.4 52.1 1150 59.3 13.7 48.3 1200 59.3 13.6 46.9 1215 59.2 13.7 46.0 Features High Efficiency and Linear Gain Operations Integrated ESD Protection Internally Matched for Ease of Use Large Positive and Negative Gate/Source Voltage Range for Improved Class C Operation Excellent thermal stability, low HCI drift Compliant to Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS 115 Vdc Gate--Source Voltage VGS -10 to +10 Vdc Operating Voltage VDD +55 Vdc Storage Temperature Range Tstg -65 to +150 C Case Operating Temperature TC +150 C Operating Junction Temperature TJ +225 C Table 2. Thermal Characteristics Characteristic Symbol Value Unit Thermal Resistance, Junction to Case,Case Temperature 80 C, 1000W Pout, Pulse width: 100us, duty cycle: 10%, R JC C/W Vds=50 V, IDQ = 100 ma Table 3. ESD Protection Characteristics 1 / 6

Test Methodology Class Human Body Model (per JESD22--A114) Class 2 Table 4. Electrical Characteristics (TA = 25 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit DC Characteristics Drain-Source Breakdown Voltage (V GS=0V; I D=100uA) Zero Gate Voltage Drain Leakage Current (V DS = 50 V, V GS = 0 V) Gate--Source Leakage Current (V GS = 6 V, V DS = 0 V) Gate Threshold Voltage (V DS = 50V, I D = 600 ua) Gate Quiescent Voltage (V DD = 50 V, I DQ = 600 ma, Measured in Functional Test) VDSS 115 V IDSS 10 A IGSS 1 A VGS(th) 1.6 V VGS(Q) 2.85 V Functional Tests (In Innogration test fixture, 50 ohm system) :V DD = 50 Vdc, I DQ = 100 ma, f = 1030 MHz, Pulse CW Signal Measurements. (Pulse Width=100 s, Duty cycle=10%) Power Gain @ P3dB Gp 15.2 db 3dB Compression Point P3dB 60.4 dbm Drain Efficiency@P3dB D 53.5 % Input Return Loss IRL -4 db 2 / 6

Reference Circuit of Test Fixture Assembly Diagram 40 40 C28 C20 C21 C6 R1 C9 C11 C22 C23 C4 C13 C1 C2 C15 C19 50 C3 C17 50 C16 C18 C24 C25 C5 C7 C8 R2 C10 C14 C12 C26 C27 C29 Figure 1. Test Circuit Component Layout Table 1. Test Circuit Component Designations and Values Component Description Suggested Manufacturer C1 2.0pF ATC800B C2 3.0pF ATC800B C3,C17,C22,C26 39 pf ATC800B C4,C5 3.3 pf ATC800B C6,C7 2.2 pf ATC800B C8,C9,C10 5.6 pf ATC800B C11,C12,C13,C14 3.9 pf ATC800B C15,C16,C18, 2.7 pf ATC800B C19 2.4 pf ATC800B C21,C25 33 pf ATC600F C20,C23,C24,C27 R1,R2 C28,C29 PCB Electrolytic Capacitor,10uF,50V Chip Resistor,10Ω,0805 Electrolytic Capacitor,470uF,63V 0.762mm [0.030 ] thick, εr=3.48, Rogers RO4350B, 1 oz. copper 3 / 6

Condition:Vds = 50 V, Idq = 100 ma, Pulse width:100us, duty cycle: 10%. TYPICAL CHARACTERISTICS Figure 2.Power Gain and Drain Efficiency as Function of Pulse Output Power(960-1215MHz) 4 / 6

Package Outline Flanged ceramic package; 2 mounting holes; 4 leads(1 2 DRAIN 3 4 GATE 5 SOURCE) UNIT A b c D D₁ e E E₁ F H H₁ L p Q q U₁ U₂ W₁ W₂ W₂ Mm 4.7 4.2 11.81 11.56 0.18 0.10 31.55 30.94 31.52 30.96 13.72 9.50 9.30 9.53 9.27 1.75 1.50 17.12 16.10 25.53 25.27 3.48 2.97 3.30 3.05 2.26 2.01 35.56 41.28 41.02 10.29 10.03 0.25 0.51 0.25 Inches 0.185 0.165 0.465 0.455 0.007 0.004 1.242 1.218 1.241 1.219 0.540 0.374 0.366 0.375 0.365 0.069 0.059 0.674 0.634 1.005 0.995 0.137 0.117 0.130 0.120 0.089 0.079 1.400 1.625 1.615 0.405 0.395 0.01 0.02 0.01 OUTLINE VERSION REFERENCE IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE PKG-D4E 03/12/2013 5 / 6

Revision history Table 6. Document revision history Date Revision Datasheet Status 2018/10/12 Rev 1.0 Preliminary Datasheet Creation Disclaimers Specifications are subject to change without notice. Innogration believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Innogration for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Innogration. Innogration makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Innogration in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Innogration products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Innogration product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. For any concerns or questions related to terms or conditions, pls check with Innogration and authorized distributors Copyright by Innogration (Suzhou) Co.,Ltd. 6 / 6