STTH3L06S. Turbo 2 ultrafast high voltage rectifier

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STTH3L6 Turbo 2 ultrafast high voltage rectifier Datasheet - production data Features K SMB A K A A Ultrafast switching Low forward voltage drop Low thermal resistance Low leakage current (platinum doping) K DO-21AD SMC Description This device uses ST Turbo 2 6 V technology, and is particularly suited as boost diode in discontinuous or critical mode power factor corrections. It is also intended for use as a freewheeling diode in power supplies and other power switching applications. Table 1: Device summary Symbol IF(AV) VRRM Value 3 A 6 V IR (max.) 1 µa Tj (max.) 175 C VF (typ.) trr (typ.).85 V 6 ns Table 2: Order codes Part number Marking STTH3L6 STTH3L6 STTH3L6U 3L6U STTH3L6S S6 April 216 DocID8322 Rev 4 1/11 This is information on a product in full production. www.st.com

Characteristics STTH3L6 1 Characteristics Table 3: Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 6 V IF(RMS) Forward rms current 1 A IF(AV) IFSM Average forward current δ =.5, square wave DO-21AD/SMC TI = 1 C SMB TI = 8 C Surge non repetitive forward current, tp = 1 ms sinusoidal 3 A DO-21AD 7 A SMB/SMC 6 A Tstg Storage temperature range -65 to +175 C Tj Maximum operating junction temperature +175 C Table 4: Thermal parameters Symbol Parameter Maximum Unit DO-21AD L = 1 mm 2 Rth(j-l) Junction to lead SMB 25 C/W SMC 2 Rth(j-a) Junction to ambient DO-21AD L = 1 mm 75 Table 5: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR VF Reverse leakage current Forward voltage drop Tj = 25 C - 3 VR = VRRM Tj = 15 C - 15 1 Tj = 25 C - 1.3 IF = 3 A Tj = 15 C -.85 1.5 µa V To evaluate the conduction losses use the following equation: P =.89 x IF(AV) +.55 IF 2 (RMS) Table 6: Dynamic characteristics Symbol Parameters Test conditions Min. Typ. Max. Unit trr tfr VFP Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25 C Tj = 25 C IF = 1 A; dif/dt = -5 A/μs; VR = 3 V IF = 3 A; dif/dt = 1 A/μs; VFR = 1.1 x VFmax - 6 85-1 IF = 3 A; dlf/dt = 1 A/µs - 7.5 V ns 2/11 DocID8322 Rev 4

STTH3L6 1.1 Characteristics (curves) 4.5 4. 3.5 3. 2.5 2. 1.5 1..5 Figure 1: Conduction losses versus average current P(W) δ =.5 δ =.1 δ =.2 δ =.5 δ = 1 I F(AV) (A)...5 1. 1.5 2. 2.5 3. 3.5 4. T δ= tp/t tp Characteristics Figure 2: Forward voltage drop versus forward current I FM (A) 1.E+2 1.E+1 1.E+ 1.E-1 T j = 15 C (Maximum values) T j = 15 C (Typical values) T j = 25 C (Maximum values) V FM (V) 1.E-2..5 1. 1.5 2. 2.5 3. 3.5 Figure 3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy printed circuit FR4, ecu = 35 µm) 1..9.8.7.6.5.4.3.2.1 Z th(j-a) /R th(j-a) DO-21AD L leads =1mm Single pulse t P (s). 1.E-1 1.E+ 1.E+1 1.E+2 1.E+3 2 18 16 14 12 1 8 6 4 2 Figure 4: Peak reverse recovery current versus dif/dt (typical values) I RM (A) V R = 4 V T j = 125 C I F =.25 x I F(AV) I F =.5 x I F(AV) I F = I F(AV) I F = 2 x I F(AV) dif/dt(a/µs) 5 1 15 2 25 3 35 4 45 5 6 5 4 3 2 1 Figure 5: Reverse recovery time versus dif/dt (typical values) t 7 RR (ns) I F = 2 x I F(AV) I F = I F(AV) I F =.5 x I F(AV) V R = 4 V T j = 125 C dif/dt(a/µs) 2 4 6 8 1 12 14 16 18 2 Figure 6: Reverse recovery charges versus dif/ dt (typical values) Q RR (nc) 5 45 4 35 3 25 2 15 1 5 V R = 4 V T j = 125 C I F = 2 x I F(AV) I F = I F(AV) I F =.5 x I F(AV) dif/dt(a/µs) 2 4 6 8 1 12 14 16 18 2 DocID8322 Rev 4 3/11

Characteristics 2. 1.8 1.6 1.4 1.2 1..8.6.4.2 Figure 7: Softness factor versus dif/dt (typical values) Sfactor I F = I F(AV) V R = 4 V T j = 125 C di F /dt(a/µs). 2 4 6 8 1 12 14 16 18 2 STTH3L6 Figure 8: Relative variations of dynamic parameters versus junction temperature 1 9 8 7 6 5 4 3 2 1 Figure 9: Transient peak forward voltage versus dif/dt (typical values) V FP (V) I F = I F(AV) T j = 125 C dif/dt(a/µs) 2 4 6 8 1 12 14 16 18 2 2 18 16 14 12 1 8 6 4 2 Figure 1: Forward recovery time versus dif/dt (typical values) t fr (ns) dl F /dt(a/µs) I F = I F(AV) V FR = 1.1 x V F max. T j = 125 C 2 4 6 8 1 12 14 16 18 2 Figure 11: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, ecu = 35 μm) (SMB / SMC) R th(j-a) (C /W) 1 9 8 7 6 5 4 3 2 1 SMB SMC SCu(cm²)..5 1. 1.5 2. 2.5 3. 3.5 4. 4.5 5. Figure 12: Thermal resistance versus lead length R 1 th ( C/W) 9 DO-21AD R 8 th(j-a) 7 6 5 4 R th(j-l) 3 2 1 Lleads(mm) 5 1 15 2 25 4/11 DocID8322 Rev 4

STTH3L6 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Epoxy meets UL94, V Band indicated cathode (DO-21AD) Bending method: see application note AN1471 (DO-21AD) 2.1 DO-21AD package information Figure 13: DO-21AD package outline Table 7: DO-21AD package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 9.5.374 B 25.4 1. C 5.3.287 D 1.3.512 E 1.25.492 DocID8322 Rev 4 5/11

Package information 2.2 SMC package information Figure 14: SMC package outline STTH3L6 Table 8: SMC package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.9 2.45.748.965 A2.5.2.2.79 b 2.9 3.2.1142.126 c.15.4.59.157 D 5.55 6.25.2185.2461 E 7.75 8.15.351.329 E1 6.6 7.15.2598.2815 E2 4.4 4.7.1732.185 L.75 1.5.295.591 6/11 DocID8322 Rev 4

STTH3L6 Figure 15: SMC recommended footprint 1.54 (.61) 5.11 (.21) Package information 1.54 (.61) 3.14 (.124) 8.19 (.323) millimeters (inches) DocID8322 Rev 4 7/11

Package information 2.3 SMB package information Figure 16: SMB package outline STTH3L6 Table 9: SMB package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.9 2.45.748.965 A2.5.2.2.79 b 1.95 2.2.768.867 c.15.4.59.157 D 3.3 3.95.1299.1556 E 5.1 5.6.28.225 E1 4.5 4.6.1594.1811 L.75 1.5.295.591 8/11 DocID8322 Rev 4

STTH3L6 Figure 17: SMB recommended footprint 1.62.64 2.6 (.12) Package information 1.62.64 2.18 (.86) 5.84 (.23) millimeters (inches) DocID8322 Rev 4 9/11

Ordering information STTH3L6 3 Ordering information Table 1: Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH3L6 STTH3L6 6 Ammopack DO-21AD 1.12 g STTH3L6-RL STTH3L6 19 Tape and reel STTH3L6U 3L6U SMB.11 g 25 Tape and reel STTH3L6S S6 SMC.243 g 25 Tape and reel 4 Revision history Table 11: Document revision history Date Revision Changes October-21 1 First issue 7-Sep-24 2 SMB, SMC and DPAK packages added. 14-Oct-25 3 29-Apr-216 4 Changed marking of STTH3L6U from 3L6U to 3L6U. Added ECOPACK statement. Removed DPAK package information. Minor text changes 1/11 DocID8322 Rev 4

STTH3L6 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 216 STMicroelectronics All rights reserved DocID8322 Rev 4 11/11