FDP75N08A 75V N-Channel MOSFET

Similar documents
FQPF12N60CT 600V N-Channel MOSFET

FQA11N90 900V N-Channel MOSFET

Description. TO-220 FCP Series. Symbol Parameter FDP61N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Description. Symbol Parameter FDAF69N25 Unit. (Note 2) Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

FDP79N15 / FDPF79N15 150V N-Channel MOSFET

FQA8N100C 1000V N-Channel MOSFET

Description. TO-3P FDA Series. Symbol Parameter FDA70N20 Unit. Maximum Lead Temperature for Soldering Purpose, 300 C 1/8 from Case for 5 Seconds

Features. TO-220F IRFS Series

UniFET TM. FDP18N50 / FDPF18N50 500V N-Channel MOSFET. FDP18N50 / FDPF18N50 500V N-Channel MOSFET. Description. Features. Absolute Maximum Ratings

FQP10N60C / FQPF10N60C 600V N-Channel MOSFET

QFET FQE10N20LC. Features. TO-126 FQE Series

FDB V N-Channel PowerTrench MOSFET

QFET FQP9N25C/FQPF9N25C

QFET TM FQP13N50C/FQPF13N50C

FQA11N90C FQA11N90C. 900V N-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted. Thermal Characteristics.

QFET FQA36P15. Features

Description. TO-220F FDPF Series. Symbol Parameter FDP20N50 FDPF20N50 Unit

FQP3N80C/FQPF3N80C 800V N-Channel MOSFET General Description These N-Channel enhancement mode power field effect transistors are

Features. TO-220F SSS Series

FQA11N90C_F V N-Channel MOSFET

QFET TM FQP17P10. Features. TO-220 FQP Series

QFET TM FQP4N90C/FQPF4N90C

QFET TM FQD18N20V2 / FQU18N20V2

Features. TO-220F IRFS Series

FDD V P-Channel PowerTrench MOSFET 40V, 32A, 27mΩ Features

Features. 13 A, 30 V. R DS(ON) = 11.3 V GS = 10 V R DS(ON) = 14.4 V GS = 4.5 V. RoHS Compliant. Symbol Parameter Ratings Units

FQH8N100C 1000V N-Channel MOSFET

Features. TO-220F SSS Series

Features. TO-3P IRFP Series

Features. TO-220F IRFS Series

QFET TM FQP13N06. Features G D. TO-220 FQP Series

FDN359BN N-Channel Logic Level PowerTrench TM MOSFET

FDP3651U N-Channel PowerTrench MOSFET 100V, 80A, 15mΩ Features

QFET TM FQL40N50. Features. TO-264 FQL Series

FDB8447L 40V N-Channel PowerTrench MOSFET 40V, 50A, 8.5mΩ Features

Features. TO-3PN IRFP Series

Features D D. I-PAK FQU Series

FDP V N-Channel PowerTrench MOSFET

QFET TM FQP20N06. Features G D. TO-220 FQP Series

Description. Symbol Parameter Ratings Units V DSS Drain to Source Voltage 60 V V GSS Gate to Source Voltage ±20 V

FDP V, 80A, 2.7mΩ. N-Channel PowerTrench MOSFET. FDP8441 N-Channel PowerTrench MOSFET. Applications. Features.

QFET TM FQT4N20L. Features. SOT-223 FQT Series

QFET TM FQP13N06L. Features G D. TO-220 FQP Series

QFET TM FQP85N06. Features G D. TO-220 FQP Series

QFET TM FQA65N20. Features. TO-3P FQA Series

FDP V N-Channel PowerTrench MOSFET

FDD8782/FDU8782 N-Channel PowerTrench MOSFET 25V, 35A, 11mΩ General Description

FDD8778/FDU8778 N-Channel PowerTrench MOSFET 25V, 35A, 14mΩ Features

FDP V, 80A, 3.1mΩ. N-Channel PowerTrench MOSFET. FDP8442 N-Channel PowerTrench MOSFET. Features. Applications. June 2007

FDMS8690 N-Channel PowerTrench MOSFET

FDD8780/FDU8780 N-Channel PowerTrench MOSFET 25V, 35A, 8.5mΩ General Description

Features. 175 C maximum junction temperature rating. T A =25 o C unless otherwise noted

FDB5800 N-Channel Logic Level PowerTrench MOSFET

Features. TO-3P FQA Series

Features. = 25 C unless otherwise noted

IRFS650B IRFS650B. 200V N-Channel MOSFET. Absolute Maximum Ratings T C = 25 C unless otherwise noted. Thermal Characteristics. November 2001.

Features. TA=25 o C unless otherwise noted

BAV23S Small Signal Diode

Features. I 2 -PAK FQI Series

Features. TA=25 o C unless otherwise noted

Features. TO-220 FQP Series

NDS0605 P-Channel Enhancement Mode Field Effect Transistor

Features. TO-220 FQP Series

Features GATE SOURCE. Symbol Parameter Ratings Units V DSS Drain to Source Voltage 400 V V GS Gate to Source Voltage ±30 V Drain Current

Features. Reduced r DS(ON) DRAIN GATE

Application TOP. Symbol Parameter Ratings Units V DS Drain to Source Voltage 20 V V GS Gate to Source Voltage ±12 V Drain Current -Continuous T

FDH15N50 / FDP15N50 / FDB15N50

onlinecomponents.com

Package Marking and Ordering Information T C = 25 o C unless otherwise noted Device Marking Device Package Reel Size Tape Width Quantity FDP2N50 FDP2N

Q1 D1 D2 Q P D (Note 1b) Power Dissipation for Single Operation (Note 1a)

Features G D. TO-220 FQP Series

N-Channel Logic Level Enhancement Mode Field Effect Transistor. Features. TA=25 o C unless otherwise noted

FQB7N65C 650V N-Channel MOSFET

Features. TO-220F FQPF Series

Features. TO-220F FQPF Series

Features I-PAK (TO-251AA) TA=25 o C unless otherwise noted

Features G D. TO-220 FQP Series

Features. TO-3P FQA Series

FDP047N10 N-Channel PowerTrench MOSFET 100V, 164A, 4.7mΩ Description

Features G D. TO-220 FQP Series

Features. (Note 1b) 1.2. (Note 1c) 1.0. (Note 1c) 125

Features. I-PAK FQU Series

Features. I-PAK FQU Series

RFP12N10L. Features. 12A, 100V, Ohm, Logic Level, N-Channel Power MOSFET. Ordering Information. Symbol. Packaging. Data Sheet April 2005

Features. TA=25 o C unless otherwise noted. (Note 1b) 0.9. (Note 1c) 0.7

Features. TA=25 o C unless otherwise noted


FDP150N10 N-Channel PowerTrench MOSFET 100V, 57A, 15mΩ Features

FEATURES BV DSS. Characteristic Value Units Drain-to-Source Voltage. 115 Continuous Drain Current (T C =100 )

FJC1386 PNP Epitaxial Silicon Transistor FJC1386 PNP Epitaxial Silicon Transistor

FFA60UP30DN Ultrafast Recovery Power Rectifier

KSC2881 NPN Epitaxial Silicon Transistor

FFA30UP20DN Ultrafast Recovery Power Rectifier

FDMJ1032C. Dual N & P-Channel PowerTrench MOSFET N-Channel: 20V, 3.2A, 90mΩ P-Channel: -20V, -2.5A, 160mΩ

FDS4410A Single N-Channel, Logic-Level, PowerTrench MOSFET

Features. Max r DS(on) = 50 V GS = -10 V, I D = -4A. Max r DS(on) = 75 V GS = -4.5 V, I D = -3.4A. RoHS Compliant

FFPF20UP20DP Ultrafast Recovery Power Rectifier

Features S 1. T A=25 o C unless otherwise noted. Symbol Parameter Ratings Units. Pulsed 6 Power Dissipation for Single Operation (Note 1a) 0.

ISL9R860P2, ISL9R860S2, ISL9R860S3ST

Features. Q1: N-Channel 7.0A, 30V. R DS(on) Q2: P-Channel. -5A, -30V R DS(on) = 25 C unless otherwise noted. Symbol Parameter Q1 Q2 Units

Transcription:

FDP75N08A 75V N-Channel MOSFET Features 75A, 75V, R DS(on) = 0.011Ω @ = 10 V Low gate charge ( typical 145nC) Low Crss ( typical 86pF) Fast switching Improved dv/dt capability Description July 2006 UniFET TM These N-Channel enhancement mode power field effect transistors are produced using Fairchild s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies, active power factor correction, electronic lamp ballast based on half bridge topology. D G G D S TO-220 FDP Series S Absolute Maximum Ratings Symbol Parameter FDP75N08A Units S Drain-Source Voltage 75 V Drain Current - Continuous (T C = 25 C) 75 A - Continuous (T C = 100 C) 47 A M Drain Current - Pulsed (Note 1) 300 A S Gate-Source Voltage ± 20 V E AS Single Pulsed Avalanche Energy (Note 2) 1738 mj I AR Avalanche Current (Note 1) 75 A E AR Repetitive Avalanche Energy (Note 1) 13.7 mj dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns P D Power Dissipation (T C = 25 C) 137 W - Derate above 25 C 1.09 W/ C T J, T STG Operating and Storage Temperature Range -55 to +150 C T L Maximum lead temperature for soldering purposes, 1/8 from case for 5 seconds 300 C Thermal Characteristics Symbol Parameter FDP75N08A Units R θjc Thermal Resistance, Junction-to-Case 0.91 C/W R θja Thermal Resistance, Junction-to-Ambient 62.5 C/W 2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDP75N08A FDP75N08A TO-220 -- -- 50 Electrical Characteristics T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BS Drain-Source Breakdown Voltage = 0 V, = 250 µa 75 -- -- V BS / T J Breakdown Voltage Temperature Coefficient = 250 µa, Referenced to 25 C -- 0.6 -- V/ C SS Zero Gate Voltage Drain Current = 75 V, = 0 V -- -- 1 µa = 60 V, T C = 125 C -- -- 10 µa I GSSF Gate-Body Leakage Current, Forward = 20 V, = 0 V -- -- 100 na I GSSR Gate-Body Leakage Current, Reverse = -20 V, = 0 V -- -- -100 na On Characteristics (th) Gate Threshold Voltage =, = 250 µa 2.0 -- 4.0 V R DS(on) Static Drain-Source On-Resistance = 10 V, = 37.5 A -- 9.4 11 mω g FS Forward Transconductance = 40 V, = 37.5 A (Note 4) -- 15 -- S Dynamic Characteristics C iss Input Capacitance = 25 V, = 0 V, -- 3437 4468 pf C oss Output Capacitance f = 1.0 MHz -- 738 959 pf C rss Reverse Transfer Capacitance -- 86 129 pf Switching Characteristics t d(on) t r Turn-On Delay Time Turn-On Rise Time V DD = 37.5 V, = 75A, R G = 25 Ω -- -- 43 212 95 434 ns ns t d(off) Turn-Off Delay Time -- 273 556 ns (Note 4, 5) t f Turn-Off Fall Time -- 147 303 ns Q g Total Gate Charge = 60 V, = 75A, -- 80 104 nc Q gs Gate-Source Charge = 10 V -- 20 -- nc Q gd Gate-Drain Charge (Note 4, 5) -- 24 -- nc Drain-Source Diode Characteristics and Maximum Ratings I S Maximum Continuous Drain-Source Diode Forward Current -- -- 75 A I SM Maximum Pulsed Drain-Source Diode Forward Current -- -- 300 A V SD Drain-Source Diode Forward Voltage = 0 V, I S = 75 A -- -- 1.4 V t rr Reverse Recovery Time = 0 V, I S = 75 A, -- 62 -- ns Q rr Reverse Recovery Charge di F / dt = 100 A/µs (Note 4) -- 145 -- nc NOTES: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 206µH, I AS =75A, V DD = 50V, R G = 25 Ω, Starting T J = 25 C 3. I SD 75A, di/dt 200A/µs, V DD BS, Starting T J = 25 C 4. Pulse Test : Pulse width 300µs, Duty cycle 2% 5. Essentially independent of operating temperature 2 www.fairchildsemi.com

Typical Performance Characteristics Figure 1. On-Region Characteristics 10 2 Top: 15.0V 9.0V 7.5V 7.0V 6.5v 6.0V 5.5V 5.0V Bottom : 4.5V * Note : 1. 250µs Pulse Test 2. T C =25 0 C 10 1 10 0 10 1, Drain-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 2. Transfer Characteristics 100 10 150 0 C 25 0 C -55 0 C * Note : 1. =40V 2. 250µs Pulse Test 1 2 4 6 8 10, Gate-Source Voltage [V] Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 0.012 R DS(ON) [Ω], Drain-Source On-Resistance 0.011 0.010 0.009 0.008 = 10V = 20V * Note : T J = 25 o C R, Reverse Drain Current [A] 10 2 10 1 150 0 C 25 0 C * Note : 1. =0V 2. 250µs Pulse Test 0.007 0 25 50 75 100 125 150 175 200 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6, Source-Drain Violtage [V] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics 6000 C oss C iss = C gs + C gd (C ds = shorted) C oss = C ds + C gd C rss = C gd 12 10 = 15V Capacitances [pf] 5000 4000 3000 2000 1000 C iss C rss * Note : 1. = 0 V 2. f = 1 MHz, Gate-Source Voltage [V] 8 6 4 2 = 37.5V = 60V * Note : = 75A 0 10-1 10 0 10 1, Drain-Source Voltage [V] 0 0 10 20 30 40 50 60 70 Q G, Total Gate Charge [nc] 3 www.fairchildsemi.com

Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature BS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 0.9 * Notes : 1. = 0 V 2. = 250 µa Figure 8. On-Resistance Variation vs. Temperature R DS(ON), (Normalized) Drain-Source On-Resistance 3.0 2.5 2.0 1.5 1.0 0.5 * Notes : 1. = 10 V 2. = 37.5 A 0.8-100 -50 0 50 100 150 200 T J, Junction Temperature [ o C] 0.0-100 -50 0 50 100 150 200 T J, Junction Temperature [ o C] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature 10 3 100 10 2 10 1 10 0 10-1 Operation in This Area is Limited by R DS(on) 1ms 10ms 100ms DC 100 µs * Notes : 1. T C = 25 o C 2. T J = 150 o C 3. Single Pulse 10 µs 10 0 10 1 10 2, Drain-SourceVoltage[V] 80 60 40 20 0 25 50 75 100 125 150 T C, Case Temperature [ o C] Figure 11. Transient Thermal Response Curve 10 0 D=0.5 Z? JC (t), Thermal Response 10-1 10-2 0.2 0.1 0.05 0.02 0.01 single pulse P DM t 1 t 2 * Notes : 1. Z θjc (t) = 0.91 0 C/W Max. 2. Duty Factor, D=t 1 /t 2 3. T JM - T C = P DM * Z θjc (t) 10-5 10-4 10-3 10-2 10-1 10 0 10 1 t 1, Square Wave Pulse Duration [sec] 4 www.fairchildsemi.com

Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms 5 www.fairchildsemi.com

Peak Diode Recovery dv/dt Test Circuit & Waveforms 6 www.fairchildsemi.com

Mechanical Dimensions TO-220 Dimensions in Millimeters 7 www.fairchildsemi.com

TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx ActiveArray Bottomless Build it Now CoolFET CROSSVOLT DOME EcoSPARK E 2 CMOS EnSigna FACT FAST FASTr FPS FRFET FACT Quiet Series GlobalOptoisolator GTO HiSeC I 2 C i-lo ImpliedDisconnect IntelliMAX ISOPLANAR LittleFET MICROCOUPLER MicroFET MicroPak MICROWIRE MSX MSXPro Across the board. Around the world. The Power Franchise Programmable Active Droop OCX OCXPro OPTOLOGIC OPTOPLANAR PACMAN POP Power247 PowerEdge PowerSaver PowerTrench QFET QS QT Optoelectronics Quiet Series RapidConfigure RapidConnect μserdes ScalarPump SILENT SWITCHER SMART START SPM Stealth SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TCM TinyBoost TinyBuck TinyPWM TinyPower TinyLogic TINYOPTO TruTranslation UHC UniFET UltraFET VCX Wire DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I20