MQ1270VP LDMOS TRANSISTOR

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GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

Parameter 5.2 GHz 5.5 GHz 5.9 GHz Units. Small Signal Gain db. Output Power W. Efficiency

Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

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PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

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Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

not recommended for new design

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

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CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

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Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

CGH55030F2 / CGH55030P2

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350 W, MHz, 50-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems. = 25 C) of Demonstration Amplifier

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

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Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

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CPH6354. Power MOSFET 60V, 100mΩ, 4A, Single P-Channel. Features. Specifications

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

Watts W/ C Storage Temperature Range Tstg 65 to +150 C Operating Junction Temperature TJ 200 C

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

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BLF6G10LS-135R. 1. Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

= 25 C) Parameter 8.0 GHz 9.0 GHz 10.0 GHz 11.0 GHz Units Small Signal Gain db P OUT. = 25 dbm W Power P IN

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CGH35060F1 / CGH35060P1

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

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CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

BLF6G10-135RN; BLF6G10LS-135RN

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

= 25 C) Parameter 2.7 GHz 2.9 GHz 3.1 GHz 3.3 GHz 3.5 GHz Units Small Signal Gain db

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

CGH55015F2 / CGH55015P2

Өjc Thermal Resistance Pulse Width=128uS, Duty=10% 0.2 C/W Bias Condition: Vdd=+65V, Idq=1000mA peak current (Vgs= -2.0 ~ -4.

Product Data Sheet Rev. 2.2, 12/2017

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

PRELIMINARY = 25 C) Parameter GHz 14.0 GHz 14.5 GHz Units Small Signal Gain db P SAT. = 26 dbm W P 3dB

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

MCH6662. Power MOSFET 20V, 160mΩ, 2A, Dual N-Channel. Features. Specifications

CGH55030F1 / CGH55030P1

LDMOS RF Power Transistor HTN7G21P160H. 1. Features. 2. Applications. 3. Items for Ordering. Package:H2110S-6L. Pin Connections

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units

= 25 C) Parameter 6.0 GHz 7.5 GHz 9.0 GHz 10.5 GHz 12.0 GHz Units Small Signal Gain db P OUT

RF Power LDMOS Transistor High Ruggedness N--Channel Enhancement--Mode Lateral MOSFET

RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

Part Number: ILD1011M160HV

PD Characteristic Symbol Max Unit Thermal Resistance, Junction to Case RθJC 0.8 C/W

Analog Power AM3904N. Dual N-Channel Logic Level MOSFET

Transcription:

700W, 50V High Power RF LDMOS FETs Description The MQ1270VP is a 700-watt, high performance, internally matched LDMOS FET, designed for avionics applications with frequencies 960 to 1215MHz. It is featured for high power and high ruggedness. It is recommended to use this device under pulse condition only Typical long pulse Performance (on innogration wide band test fixture with device soldered): MQ1270VP Pulse width:100us, duty cycle: 10%, Vds = 50 V, Idq = 100 ma, TA = 25 C Freq(MHz) Pin(dBm) Pout(dBm) Pout(W) IDS(A) Gain(dB) Eff(%) 960 46.5 59 800 3.76 12.5 43 990 46.5 59.7 933 3.96 13.2 48 1010 46.5 60.2 1047 4.37 13.7 48 1040 46.5 58.9 776 3.81 12.4 41 1070 46.5 59.6 912 4.48 13.1 41 1100 46.5 58.8 750 4.37 12.3 35 1130 46.5 59.1 812 4.35 12.6 38 1160 46.5 59.4 870 4.44 12.9 40 1190 46.5 59 800 4 12.5 41 1215 46.5 59.4 870 4.2 12.9 42 Typical short pulse Performance (on innogration wide band test fixture with device soldered): Pulse width:24us, duty cycle: 2%, Vds = 50 V, Idq = 100 ma, TA = 25 C Freq(MHz) Pin(dBm) Pout(dBm) Pout(W) IDS(A) Gain(dB) Eff(%) 960 46.5 59.3 868 0.85 12.8 46 990 46.5 60 1000 0.92 13.5 48 1010 46.5 60.4 1106 1 13.9 49 1040 46.5 59.1 829 0.89 12.6 41 1070 46.5 59.9 986 1.01 13.4 43 1100 46.5 58.9 792 1 12.4 35 1130 46.5 59.4 883 1 12.9 39 1160 46.5 59.8 957 1.03 13.3 41 1190 46.5 59.3 858 0.95 12.8 40 1215 46.5 59.7 946 0.96 13.2 43 1 / 6

Features High Efficiency and Linear Gain Operations Integrated ESD Protection Internally Matched for Ease of Use Large Positive and Negative Gate/Source Voltage Range for Improved Class C Operation Excellent thermal stability, low HCI drift Compliant to Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS 115 Vdc Gate--Source Voltage VGS -10 to +10 Vdc Operating Voltage VDD +55 Vdc Storage Temperature Range Tstg -65 to +150 C Case Operating Temperature TC +150 C Operating Junction Temperature TJ +225 C Table 2. Thermal Characteristics Characteristic Symbol Value Unit Thermal Resistance, Junction to Case,Case Temperature 80 C, 870W Pout, Pulse width: 100us, duty cycle: 10%, Vds=50 V, IDQ = 100 ma Table 3. ESD Protection Characteristics Test Methodology R JC C/W Class Human Body Model (per JESD22--A114) Class 2 Table 4. Electrical Characteristics (TA = 25 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit DC Characteristics Drain-Source Breakdown Voltage (V GS=0V; I D=100uA) Zero Gate Voltage Drain Leakage Current (V DS = 50 V, V GS = 0 V) Gate--Source Leakage Current (V GS = 6 V, V DS = 0 V) Gate Threshold Voltage (V DS = 50V, I D = 600 ua) Gate Quiescent Voltage (V DD = 50 V, I DQ = 100 ma, Measured in Functional Test) VDSS 115 V IDSS 10 A IGSS 1 A VGS(th) 1.6 V VGS(Q) 3.14 V Functional Tests (In Innogration test fixture, 50 ohm system) :V DD = 50 Vdc, I DQ = 100 ma, f = 1215 MHz, Pulse CW Signal Measurements. (Pulse Width=100 s, Duty cycle=10%), Pin=46.5dBm Power Gain @ Pout Gp 12.9 db Output Power Pout 58.5 59.4 dbm 2 / 6

Drain Efficiency@Pout D 42.0 % Input Return Loss IRL -7 db Reference Circuit of Test Fixture Assembly Diagram (Layout file upon request) Figure 1. Test Circuit Component Layout Table 5. Test Circuit Component Designations and Values (Layout file upon request) 3 / 6

Pout(dBm) Eff(%) Pout(dBm) Gain(dB) MQ1270VP LDMOS TRANSISTOR TYPICAL CHARACTERISTICS Pulse width:100us, duty cycle: 10%, Vds = 50 V, Idq = 100 ma, TA = 25 C at fixed Pin=46.5dBm Figure 2: Power gain and Pout as a Function of frequency 60.5 16 60 14 12 59.5 59 10 8 6 58.5 4 2 58 960 990 1010 1040 1070 1100 1130 1160 1190 1215 Freq(MHz) 0 Pout(dBm) Gain(dB) Figure 3:Effiicen and Pout as a Function of frequency 60.5 60 60 50 59.5 59 40 30 20 58.5 10 58 960 990 1010 1040 1070 1100 1130 1160 1190 1215 Freq(MHz) 0 Pout(dBm) Eff(%) 4 / 6

Package Outline Flanged ceramic package; 2 mounting holes; 4 leads(1 2 DRAIN 3 4 GATE 5 SOURCE) UNIT A b c D D₁ e E E₁ F H H₁ L p Q q U₁ U₂ W₁ W₂ W₂ Mm 4.7 4.2 11.81 11.56 0.18 0.10 31.55 30.94 31.52 30.96 13.72 9.50 9.30 9.53 9.27 1.75 1.50 17.12 16.10 25.53 25.27 3.48 2.97 3.30 3.05 2.26 2.01 35.56 41.28 41.02 10.29 10.03 0.25 0.51 0.25 Inches 0.185 0.165 0.465 0.455 0.007 0.004 1.242 1.218 1.241 1.219 0.540 0.374 0.366 0.375 0.365 0.069 0.059 0.674 0.634 1.005 0.995 0.137 0.117 0.130 0.120 0.089 0.079 1.400 1.625 1.615 0.405 0.395 0.01 0.02 0.01 OUTLINE VERSION REFERENCE IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE PKG-D4E 03/12/2013 5 / 6

Revision history Table 6. Document revision history Date Revision Datasheet Status 2018/8/3 Rev 1.0 Preliminary Datasheet Creation Disclaimers Specifications are subject to change without notice. Innogration believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Innogration for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Innogration. Innogration makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Innogration in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Innogration products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Innogration product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. For any concerns or questions related to terms or conditions, pls check with Innogration and authorized distributors Copyright by Innogration (Suzhou) Co.,Ltd. 6 / 6