CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

Similar documents
Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

not recommended for new design

Advance PTNC210604MD. Wideband LDMOS Two-stage Integrated Power Amplifier 20 W + 40 W, 28 V, MHz. Description. Features

PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics

not recommended for new design Efficiency (%) Characteristic Symbol Min Typ Max Unit Intermodulation Distortion IMD dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated

Preliminary GTVA126001EC/FC

PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated

PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

PTFC270101M. High Power RF LDMOS Field Effect Transistor 10 W, 28 V, MHz. Description. Features. RF Characteristics

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

Features. ficiency (%) Eff. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

Efficiency (%) c201202fc-v2-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

Drain Efficiency (%) c262157sh-gr1. Characteristic Symbol Min Typ Max Unit. Gain Gps db. Adjacent Channel Power Ratio ACPR 31.

Innogration (Suzhou) Co., Ltd.

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

Drain Efficiency (%) c270101m-2.1-gr1c. Characteristic Symbol Min Typ Max Unit

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

CGHV1J025D. 25 W, 18.0 GHz, GaN HEMT Die

Parameter 5.2 GHz 5.5 GHz 5.9 GHz Units. Small Signal Gain db. Output Power W. Efficiency

CGHV1J070D. 70 W, 18.0 GHz, GaN HEMT Die

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

Innogration (Suzhou) Co., Ltd.

CGH80030D. 30 W, 8.0 GHz, GaN HEMT Die. 2-Way Private Radio. Broadband Amplifiers. Cellular Infrastructure. Test Instrumentation

CGH35060F1 / CGH35060P1

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

IMD D3 (dbc) Characteristic Symbol Min Typ Max Unit. Input Return Loss IRL 15 db

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

= 25 C) Parameter 8.0 GHz 9.0 GHz 10.0 GHz 11.0 GHz Units Small Signal Gain db P OUT. = 25 dbm W Power P IN

Innogration (Suzhou) Co., Ltd.

CGH55030F2 / CGH55030P2

maintaining high gain and efficiency. Parameter 5.5 GHz 6.0 GHz 6.5 GHz Units Small Signal Gain db = 28 dbm

CGH55015F2 / CGH55015P2

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features

= 25 C) Parameter 2.7 GHz 2.9 GHz 3.1 GHz 3.3 GHz 3.5 GHz Units Small Signal Gain db

CGHV60040D. 40 W, 6.0 GHz, GaN HEMT Die. Cellular Infrastructure Class AB, Linear amplifiers suitable for OFDM, W-CDMA, LTE, EDGE, CDMA waveforms

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

PRELIMINARY = 25 C) Parameter GHz 14.0 GHz 14.5 GHz Units Small Signal Gain db P SAT. = 26 dbm W P 3dB

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.

CGH55030F1 / CGH55030P1

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.

BLF6G10LS-135R. 1. Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

BLF6G10LS Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

= 25 C) Parameter 5.5 GHz 6.5 GHz 7.5 GHz 8.5 GHz Units Small Signal Gain db P OUT

CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

RF Power GaN Transistor

= 25 C) Parameter 6.0 GHz 7.5 GHz 9.0 GHz 10.5 GHz 12.0 GHz Units Small Signal Gain db P OUT

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

Efficiency (%) Characteristic Symbol Min Typ Max Units

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

Innogration (Suzhou) Co., Ltd.

MQ1270VP LDMOS TRANSISTOR

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

RF Power GaN Transistor

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

350 W, MHz, 50-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems. = 25 C) of Demonstration Amplifier

BLF6G10-135RN; BLF6G10LS-135RN

CMPA1D1E025F. 25 W, GHz, 40 V, Ku-Band GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features.

well as multi-octave bandwidth amplifiers up to 4 GHz. The transistor is available in a 2-lead flange and = 25 C), 50 V

Watts W/ C Storage Temperature Range T stg 65 to +200 C Operating Junction Temperature T J 200 C. Test Conditions

MQ1470VP LDMOS TRANSISTOR

Transcription:

Advance GTRA364002FC Thermally-Enhanced High Power RF GaN on SiC HEMT 400 W, 48 V, 3400 3600 MHz Description The GTRA364002FC is a 400-watt (P SAT ) GaN on SiC high electron mobility transistor (HEMT) designed for use in multi-standard cellular power amplifier applications. It features input matching, high efficiency, and a thermally-enhanced package with earless flange. Features GaN on SiC HEMT technology Input Matched Typical Pulsed CW performance, 3600 MHz, 48 V, combined outputs - P SAT = 400 W - Efficiency = 50% - Gain = 11 db Pb-free and RoHS-compliant Advance Specification Data Sheets describe products that are being considered by Wolfspeed for development and market introduction. The target performance shown in Advance Specifications is not final and should not be used for any design activity. Please contact Wolfspeed about the future availability of these products. GTRA364002FC Package H-37248-4 Target RF Characteristics Single-carrier WCDMA Specifications (tested in Wolfspeed Doherty test fixture) V DD = 48 V, I DQ = 110 ma, P OUT = 47.7 W dbm avg, V GS(PEAK) = 5.5 V, ƒ = 3600 MHz, 3GPP signal, channel bandwidth = 3.84 MHz, peak/average = 10 db @ 0.01% CCDF CCharacteristic Symbol Min Typ Max Unit Linear Gain G ps 13 db Drain Efficiency h D 43 % Adjacent Channel Power Ratio ACPR 30 dbc Output PAR @ 0.01% CCDF OPAR 7 db All published data at T CASE = 25 C unless otherwise indicated ESD: Electrostatic discharge sensitive device observe handling precautions!

Advance GTRA364002FC 2 DC Characteristics Characteristic Conditions Symbol Min Typ Max Unit Drain-source Breakdown Voltage V GS = 8 V, I D = 10 ma V (BR)DSS 150 V Drain-source Leakage Current V GS = 8 V, V DS = 10 V I DSS 7 ma Gate Threshold Voltage V DS = 10 V, I D = 10 ma V GS(th) 2.5 3.0 3.5 V Recommended Operating Conditions Parameter Conditions Symbol Min Typ Max Unit Drain Operating Voltage V DD 0 55 V Gate Quiescent Voltage V DS = 50 V, I D = 140 ma V GS(Q) 3.0 V Absolute Maximum Ratings Parameter Symbol Value Unit Drain-source Voltage V DSS 125 V Gate-source Voltage V GS 10 to +2 V Gate Current I G 14 ma Drain Current I D 12 A Junction Temperature T J 225 C Storage Temperature Range T STG 65 to +150 C Operation above the maximum values listed here may cause permanent damage. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the component. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For reliable continuous operation, the device should be operated within the operating voltage range (V DD ) specified above. Thermal Chracteristics Parameter Symbol Value Unit Thermal Resistance, Junction to Case R qjc TBD C/W Ordering Information Type and Version Order Code Package Shipping GTRA364002FC V1 R0 TBD H-37248-4, earless flange Tape & Reel, 50 pcs GTRA364002FC V1 R2 TBD H-37248-4, earless flange Tape & Reel, 250 pcs

H-37248-4_pd_10-10-2012 Advance GTRA364002FC 3 Pinout Diagram (top view) S D1 G1 D2 G2 Pin Description D1 Drain device 1 D2 Drain device 2 G1 Gate device 1 G2 Gate device 2 S Source (flange)

H-37248-4_po_02_01-09-2013 Advance GTRA364002FC 4 Package Outline Specifications Package H-37248-4 2X 45 X 2.72 [45 X.107] (8.89 [.350]) C L (5.08 [.200]) 2X 4.83±0.51 [.190±0.020] D1 D2 4X R0.76 +0.13-0.38 +0.005 [ R.030-0.015 ] FLANGE 9.78 [.385] LID 9.40 [.370] C L 19.43±0.51 [.765±0.020] G1 G2 4X 3.81 [.150] 2X 12.70 [.500] SPH 1.57 [.062] 19.81±0.20 [.780±0.008] 1.02 [.040] 0.0381 [.0015] -A- 3.76±0.25 [.148±0.010] C L S 20.57 [.810] Diagram Notes unless otherwise specified: 1. Interpret dimensions and tolerances per ASME Y14.5M-1994. 2. Primary dimensions are mm. Alternate dimensions are inches. 3. All tolerances ± 0.127 [.005] unless specified otherwise. 4. Pins: D1, D2 drains; G1, G2 gates; S source. 5. Lead thickness: 0.10 + 0.076/ 0.025 mm [0.004+0.003/ 0.001 inch]. 6. Gold plating thickness: 1.14 ± 0.38 micron [45 ± 15 microinch].

Advance gtra364002fc 5 Revision History Revision Date Data Sheet Type Page Subjects (major changes since last revision) 01 2016-09-02 Preliminary All Data Sheet reflects preliminary specification 02 2017-07-24 Advance All Data Sheet reflects advance specification for product development 03 2018-05-01 Advance All 2 Converted to Wolfspeed Data Sheet Updated DC Characteristics and max ratings table format For more information, please contact: 4600 Silicon Drive Durham, North Carolina, USA 27703 www.wolfspeed.com/rf Sales Contact RFSales@wolfspeed.com RF Product Marketing Contact RFMarketing@wolfspeed.com 919.407.7816 Notes Disclaimer Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Cree products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. Copyright 2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Wolfspeed and the Wolfspeed logo are trademarks of Cree, Inc. www.wolfspeed.com