IAD11P Integrated Telecom Circuits Parameter Rating Units Blocking Voltage 3 V P Load Current 1 ma rms / ma DC On-Resistance (max 3 Features 37V rms Input/Output Isolation Bidirectional Current Sensing Bidirectional Current Switching Replaces up to Three or Four Components Three Functions in One Package Small 16-Pin SOIC Package (PCMCIA Compatible FCC Compatible No EMI/RFI Generation Machine Insertable, Wave Solderable Tape & Reel Versions Available Applications Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Description The IAD11P Multifunction Telecom switch combines a 3V normally open (1-Form-A relay and two optocouplers in a single package. The relay uses optically coupled MOSFET technology to provide 37V rms of input to output isolation. The efficient MOSFET switch and photovoltaic die use IXYS Integrated Circuits Division s patented OptoMOS architecture. The optically coupled output is controlled by highly efficient GaAIAs infrared LEDs. The IAD11P enables telecom circuit designers to combine three discrete functions in a single component that uses less space than traditional discrete component solutions. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 1349 EN/IEC 69-1 Certified Component: TUV Certificate: B 12 11 82667 2 Ordering Information Part # IAD11P IAD11PTR Pin Configuration 1 (N/C 2 3 4 6 7 8 (N/C Description 16-Pin SOIC (/Tube 16-Pin SOIC (1/Reel 16 1(Form A 14 13 (N/C 12 11 1 9 1. (N/C 2. + LED - Relay Input 3. LED - Relay Input 4. Emitter - Phototransistor #1. Collector - Phototransistor #1 6. Emitter - Phototransistor #2 7. Collector - Phototransistor #2 8. (N/C 9. LED - Phototransistor +/ #2 1. LED - Phototransistor /+ #2 11. LED - Phototransistor +/ #1 12. LED - Phototransistor /+ #1 13. (N/C 14. Output - Relay 1. Common - Relay 16. Output - Relay Switching Characteristics of Normally Open Devices Form-A 9% I LOAD 1% t on t off DS-IAD11P_R www.ixysic.com 1
IAD11P Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Input Control Current, Relay ma Total Package Dissipation 1 1 W Isolation Voltage, Input to Output 37 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.67 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @2ºC: Relay Section Parameter Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage (Peak I L =1 A V L - - 3 V P Load Current Continuous - I L - - 1 ma rms / ma DC Peak t=1ms I LPK - - 3 ma P On-Resistance I L =1mA R ON - - 3 Off-State Leakage Current V L =3V, T J =2ºC I LEAK - - 1 A Switching Speeds Turn-On t =ma, V L =1V on - - 3 ms Turn-Off t off - - 3 ms Output Capacitance V L =V, f=1mhz C OUT - 2 - pf Input Characteristics Input Control Current to Activate I L =1mA - - ma Input Control Current to Deactivate I L =1mA.4 - - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Voltage - V R - - V Reverse Input Current V R =V I R - - 1 A Electrical Characteristics @2ºC: Detector Section Parameter Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Blocking Voltage I C =1 A BV CEO 2 - V Phototransistor Dark Current V CE =V, =ma I CEO - na Saturation Voltage I C =2mA, =16mA V SAT -.3. V Current Transfer Ratio =6mA, V CE =.V CTR 33 - - % Input Characteristics Input Control Current I C =2mA, V CE =.V - 2 6 ma Input Voltage Drop =ma V F.9 1.2 1.4 V Input Current (Detector Must be Off I C =1 A, V CE =V - 2 - A Capacitance, Input to Output V L =V, f=1mhz C I/O - 3 - pf Isolation, Input to Output - V I/O 37 - - V rms R 2 www.ixysic.com
IAD11P RELAY PERFORMANCE DATA* 3 Typical LED Forward Voltage Drop (N=, =ma 2 Typical Turn-On Time (N=, =ma, I L =1mA DC 2 Typical Turn-Off Time (N=, =ma, I L =1mA DC Device Count (N 3 2 2 1 1 Device Count (N 2 1 1 Device Count (N 2 1 1 1.17 1.19 1.21 1.23 1.2 LED Forward Voltage Drop (V.3.9 1. 2.1 2.7 3.3 3.9 Turn-On Time (ms..1.2.3.4..6 Turn-Off Time (ms 2 Typical for Switch Operation (N=, I L =1mA DC 2 Typical for Switch Dropout (N=, I L =1mA DC Typical On-Resistance Distribution (N=, =ma, I L =1mA DC 3 Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 3 2 2 1 1.39.6.91 1.17 1.43 1.69 1.9 LED Current (ma.39.6.91 1.17 1.43 1.69 1.9 LED Current (ma 18.7 19.8 2.9 22. 23.1 24.2 2.3 On-Resistance ( Typical Blocking Voltage Distribution (N= 3 3 Device Count (N 2 2 1 1 377. 388. 399. 41. 421. 432. 443. Blocking Voltage (V P LED Forward Voltage Drop (V 1.8 1.6 1.4 1.2 1. Typical LED Forward Voltage Drop =ma =3mA =2mA =1mA =ma.8-4 -2 2 4 6 8 1 12 Turn-On Time (ms Typical Turn-On Time vs. LED Forward Current =1mA DC 2. 1.8 1.6 1.4 1.2 1..8.6.4.2 1 1 2 2 3 3 4 4 LED Forward Current (ma Turn-Off Time (ms.7.6..4.3.2.1 Typical Turn-Off Time vs. LED Forward Current =1mA DC 1 1 2 2 3 3 4 4 Forward Current (ma * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R www.ixysic.com 3
IAD11P Turn-On Time (ms. 4. 4. 3. 3. 2. 2. 1. 1.. -4 Typical Turn-On Time =1mA DC =ma =1mA =2mA -2 2 4 6 8 1 RELAY PERFORMANCE DATA (cont.* Turn-Off Time (ms 1..9.8.7.6..4.3.2.1-4 Typical Turn-Off ( =ma, I L =1mA DC -2 2 4 6 8 1 Load Current (ma Maximum Load Current 18 16 14 12 1 8 6 4 2-4 -2 2 4 6 8 1 12 =2mA =1mA =ma 3. Typical for Switch Operation =1mA DC 3. Typical for Switch Dropout =1mA DC 6 Typical On-Resistance ( =ma, I L =1mA DC LED Current (ma 2. 2. 1. 1.. LED Current (ma 2. 2. 1. 1.. On-Resistance ( 4 3 2 1-4 -2 2 4 6 8 1-4 -2 2 4 6 8 1-4 -2 2 4 6 8 1 Load Current (ma 1 8 6 4 2-2 Typical Load Current vs. Load Voltage ( =ma -4-6 -8-1 -2. -2-1. -1 -.. 1 1. 2 2. Load Voltage (V Blocking Voltage (V P 43 42 42 41 41 4 4 39-4 Typical Blocking Voltage -2 2 4 6 8 1 Leakage ( A.16.14.12.1.8.6.4.2-4 Typical Leakage Measured across Pins 14&16-2 2 4 6 8 1 Load Current (A Energy Rating Curve 1..9.8.7.6..4.3.2.1 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R 4 www.ixysic.com
IAD11P DETECTOR PERFORMANCE DATA* Normalized CTR (% 2. 2. 1. 1.. Typical Normalized CTR vs. Forward Current (V CE =.8V Normalized CTR (% 3. 2. 2. 1. 1.. =1mA =2mA =ma =1mA =1mA =2mA Typical Normalized CTR (V CE =.8V Collector Current (ma 16 14 12 1 8 6 4 2 Typical Collector Current vs. Forward Current (V CE =.8V 2 4 6 8 1 12 14 16 18 Forward Current (ma 2-4 -2 2 4 6 8 1 2 4 6 8 1 12 14 16 18 2 Forward Current (ma * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R www.ixysic.com
IAD11P Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Rating IAD11P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device IAD11P Maximum Temperature x Time 26ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R 6 www.ixysic.com
IAD11P MECHANICAL DIMENSIONS IAD11P PIN 16 1.16±.381 (.4±.1.24 ±.127 (.1±. PCB Land Pattern 7.493±.127 (.29±. 1.363±.127 (.48±..63 X 4 (.2 X 4 1.16 TYP (.4 TYP 1.9 (.7 9.3 (.366 PIN 1 1.27 TYP (. TYP.46 TYP (.16 TYP 8.89 TYP (.3 TYP.8±.116 (.2±.4 2.7±.1 (.81±.2 Lead to Package Standoff: MIN:.24 (.1 MAX:.12 (.4.6 (.24 1.27 (. DIMENSIONS mm (inches NOTES: 1. Coplanarity =.116 (.4 max. 2. Leadframe thickness does not include solder plating (1 microinch maximum. IAD11PTR Tape & Reel 33.2 DIA. (13. DIA. Top Cover Tape Thickness.12 MAX. (.4 MAX. B =1.7 (.421 W=16 (.63 K =3.2 (.126 A =1.9 (.429 P=12. (.472 K 1 =2.7 (.16 Embossed Carrier Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 Dimensions mm (inches For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-IAD11P_R Copyright 213, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/27/213