TS118STR. Multifunction Telecom Switch
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- Eleanor Hensley
- 6 years ago
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1 Multifunction Telecom Switch Units Load Voltage 3 V Load Current 12 ma Max R ON 3 Ω Description is a 3V, 12mA, 3Ω 1-Form-B relay with an optocoupler in a single package. It provides a solution in telecom applications where a normally closed relay is preferred. Features Small 8 Pin DIP Package Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits 37V RMS Input/Output Isolation FCC Compatible VDE Compatible No EMI/RFI Generation Machine Insertable, Wave Solderable Surface Mount and Tape & Reel Versions Available Approvals UL Recognized: File Number E7627 CSA Certified: File Number LR BSI Certified: BS EN 69:1992 (BS72:1992) Certificate #:7344 BS EN 413:1993 Certificate #:7344 Applications Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hookswitch Dial Pulsing Ground Start Ringer Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Ordering Information Part # P PTR S STR Pin Configuration 1 + LED - Relay 2 LED - Relay 3 Collector - Phototransistor 4 Emitter - Phototransistor Description 8 Pin DIP (/Tube) 8 Pin Flatpack (/Tube) 8 Pin Flatpack Tape & Reel (/Tube) 8 Pin Surface Mount (/Tube) 8 Pin Surface Mount Tape & Reel (/Tube) Pinout 8 Load - Relay (MOSFET Output) 7 Load - Relay (MOSFET Output) 6 LED - Phototransistor /+ LED - Phototransistor +/ DS--R4 1
2 Absolute Maximum Ratings 2 C) Parameter Min Typ Max Units Input Power Dissipation mw Input Control Current - - ma Peak (1ms) A Reverse Input Voltage - - V Total Power Dissipation mw Isolation Voltage Input to Output V RMS Operational Temperature C Storage Temperature C Soldering Temperature DIP Package C Flatpack/Surface Mount Package C (1 Seconds Max.) 1 Derate Linearly 1.33 mw/ C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and effect its reliability. 2 Derate Linearly 6.67 mw/ C Electrical Characteristics Parameter Conditions Symbol Min Typ Max Units Relay Portion (Pins 7, 8) Output 2 C Load Voltage (Peak) - V L V Load Current (Continuous) - I L ma Peak Load Current 1ms I LPK ma On-Resistance I L =12mA R ON Ω Off-State Leakage Current V L =3V I LEAK µa Switching Speeds Turn-On I F =ma, V L =1V T ON ms Turn-Off I F =ma, V L =1V T OFF ms Output Capacitance V; f=1mhz C OUT pf Relay Portion (Pins 1, 2) Input 2 C Input Control Current I L =12mA I F - ma Input Dropout Current - I F ma Input Voltage Drop I F =ma V F V Reverse Input Voltage - V R - - V Reverse Input Current V R =V I R µa 2
3 Electrical Characteristics (Continued) Parameter Conditions Symbol Min Typ Max Units Detector Portion (Pins 3, 4) Output 2 C Phototransistor Blocking Voltage I C =1µA BV CEO 2 - V Phototransistor Output Current V CE =V, I F =ma I CEO - na Saturation Voltage I C =2mA, I F =16mA V SAT -.3. V Current Transfer Ratio I F =6mA, V CE =.V CTR % Detector Portion (Pins, 6) Input 2 C Input Control Current I C =2mA, V CE =.V I F ma Input Voltage Drop I F =ma V F V Input Current I C =1µA, I F 2 - µa (Detector must be off) V CE =V Input to Output Capacitance - C I/O pf (Relay Only) Capacitance Input to Output pf Input to Output Isolation - V I/O V RMS 3
4 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N= Ambient Temperature = 2 C; I F = madc) LED Forward Voltage Drop (V) Typical On-Resistance Distribution (N= Ambient Temperature = 2 C) (Load Current = 12mADC; I F = madc) ON Resistance (Ω) Typical Blocking Voltage Distribution (N= Ambient Temperature = 2 C) Blocking Voltage (V) 2 Typical I F for Switch Operation (N= Ambient Temperature = 2 C) (Load Current = 12mADC) Typical I F for Switch Dropout (N= Ambient Temperature = 2 C) (Load Current = 12mADC) 2 Typical Turn-On Time (N= Ambient Temperature = 2 C) (Load Current = 12mADC; I F = madc) LED Current (ma) LED Current (ma) Turn-On (ms) Typical Turn-Off Time (N= Ambient Temperature = 2 C) (Load Current = 12mADC; I F = madc) Turn-Off (ms) Load Current (ma) Typical Load Current vs. Temperature ma Leakage (µa) Typical Leakage vs. Temperature (Measured across Pins 7 & 8) Blocking Voltage (V RMS ) Typical Blocking Voltage vs. Temperature Turn-On (ms) Typical Turn-On vs. Temperature (Load Current = 12mADC) ma Turn-Off (ms) Typical Turn-Off vs. Temperature (Load Current = 12mADC) ma 1mA 2mA *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4
5 PERFORMANCE DATA* LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature ma 3mA 2mA 1mA ma Turn-On (ms) Typical Turn-On vs. LED Forward Current (Load Current = 12mADC) LED Forward Current (ma) Turn-Off (ms) Typical Turn-Off vs. LED Forward Current (Load Current = 12mADC) LED Forward Current Typical On-Resistance vs. Temperature (Load Current = 12mADC; I F = madc) 6 Typical I F for Switch Operation vs. Temperature (Load Current = 12mADC) 3. Typical I F for Switch Dropout vs. Temperature (Load Current = 12mADC) 3. On-Resistance (Ω) LED Current (ma) LED Current (ma) Load Current (ma) Typical Load Current vs. Load Voltage (Ambient Temperature = 2 C; I F = ma) Load Voltage (V) Load Current (A) Energy Rating Curve 1µs 1µs 1ms 1ms 1ms 1s 1s 1s Time Normalized CTR (%) Typical Normalized CTR vs. Forward Current (V CE =.V) I F (ma) Normalized CTR (%) Typical Normalized CTR vs. Temperature (V CE =.V) mA 2mA ma 1mA 1mA 2mA I C (ma) Typical Collector Current vs. Forward Current (V CE =.V) I F (ma) The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
6 Mechanical Dimensions 8 Pin DIP Through Hole (Standard) 7.62 ±.24 (.3 ±.1) 9.62 ±.381 (.38 ±.1) 2.4 ±.127 (.1 ±.) PC Board Pattern (Top View) 8-.8 DIA. (8-.31 DIA.) 2.4 ±.127 (.1 ±.) TYP. (.28) 3.32 (.13) TYP. (.36) 6.3 ±.127 (.2 ±.).47 ±.76 (.18 ±.3) 8.77 ±.127 (.318 ±. ) ±.8 (.36 ±.2) 6.3 ±.127 (.2 ±.) 7.62 ±.127 (.3 ±.) 7.62 ±.127 (.3 ±.) 8 Pin DIP Surface Mount ( S Suffix) 9.62 ±.381 (.38 ±.1) 7.62 ±.24 (.3 ±.1) 2.4 ±.127 (.1 ±.) PC Board Pattern (Top View) 2.4 ±.127 (.1 ±.) 4.44 ±.127 (.17 ±.) 3.32 (.13).63 TYP. (.2).24 TYP. (.1) 6.3 ±.127 (.2 ±.).47 ±.76 (.18 ±.3) 8.77 ±.127 (.318 ±.) 9.2 ±.24 (.37 ±.1) 1.9 ±.127 (.7 ±.) ±.127 (.9 ±.) 8.3 ±.127 (.327 ±.) 8 Pin Flatpack ( P Suffix) 2.19 TYP. (.8) MAX. (.9).63 ±.127 (.2) 7.62 ±.24 (.3 ±.1).23 (.8) 6.3 ±.127 (.2 ±.) 9.62 ±.381 (.38 ±.1) 2.4 ±.127 (.1 ±.).47 ±.76 (.18 ±.3) 8.77 ±.127 (.318 ±.) ±.127 (.37 ±.) PC Board Pattern (Top View) (.47) 2.4 ±.127 (.1 ±.).787 (.31) ±.127 (.34 ±.) Dimensions mm (inches) 6
7 Mechanical Dimensions Tape and Reel Packaging for 8 Pin Surface Mount Package 33.2 DIA. (13.) Top Cover Tape Thickness.12 MAX. (.4) 12.9 (.476) MAX ±.12 (.26) (.69 ±.4).46 MAX. (.16) (.192) ±.12 (.29 ±.4) 2.7 ± ±.12 (.79 ±.4) (.9 ±.4) ±.12 (.17 ±.4) ±.3 (.63 ±.12) 1.3 (.4) Embossed Carrier Top Cover Tape.R TYP ±.12 (.472 ±.4) 1.3 ±.12 (.4 ±.4) 1.49 ±.12 (.61 ±.4) Embossment User Direction of Feed Tape and Reel Packaging for 8 Pin Surface Mount Package 33.2 DIA. (13.) Top Cover Tape Thickness.12 MAX. (.4) 12.9 (.476) MAX ±.12 (.26) (.69 ±.4).46 MAX. (.16) (.192) ±.12 (.29 ±.4) 2.7 ± ±.12 (.79 ±.4) (.9 ±.4) ±.12 (.17 ±.4) ±.3 (.63 ± (.4) Embossed Carrier Top Cover Tape.R TYP ±.12 (.472 ±.4) 1.3 ±.12 (.4 ±.4) 1.49 ±.12 (.61 ±.4) Embossment User Direction of Feed Dimensions mm (inches) 7
8 For additional information please visit our website at: Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS--R4. Copyright 22, Clare, Inc. All rights reserved. Printed in USA. 6/2/2
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CPC176 Single-Pole, Normally Open 4-Pin OptoMOS DC Power SIP Relay Parameter Rating Units Blocking Voltage 6 V P Load Current 4 A DC On-Resistance (max).9 Features Handle Load Currents Up to 4A DC 2V rms
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CPC1N V Normally-Open Single-Pole 4-Pin SOP OptoMOS Relay Parameter Rating Units Blocking Voltage V P Load Current 7 ma rms / ma DC On-Resistance (max) 1 LED Current to operate. ma Features Designed for
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