CPC1510GSTR. 1-Form-A Solid State Relay with Integrated Current Limit
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- Griselda Floyd
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1 -Form-A Solid State Relay with Integrated Current Limit Parameter Rating Units Blocking Voltage V P Load Current ma Max R ON Ω Features Integrated Active Current-Limit Protection Thermal Shutdown Linear AC or DC Operation Low Power Consumption Clean, Bounce-free Switching High Surge Capability Low Power Drive Requirements Surface Mount version available Tape & Reel packaging available Applications General Telecom Switching Hook Switch Ringing Relay Dial Pulsing Ground Start Ground Fault Protection Instrumentation Automatic Tuning/Balancing Flying Capacitor Analog Multiplex Peripherals Automatic Tuning/Balancing Transducer Driver Security Medical Equipment Pin Configuration Description The is a -Form-A normally open Solid State Relay with an integrated current limit feature that can replace electromechanical relays while enhancing the robustness of wireline-interface applications. The relay is constructed using a GaAIAs LED for actuation control and an integrated monolithic die for the switch output. The die, fabricated in a high-voltage dielectrically isolated technology, is comprised of a photodiode array, switch control with active current limiting circuitry, and MOSFET switches. The active current limit circuitry in the also provides a thermal shutdown feature offering excellent power cross immunity for improved survivability in harsh environments. These enhancements greatly improves the robustness of end systems using this device compared to systems using relays without the integrated current limit. In addition, the active current limit circuitry enables the to pass FCC 8. and other regulatory voltage surge requirements when adequate overvoltage protection is provided. The relay may be used in both unidirectional DC applications as well as bi-directional AC applications. Approvals UL - File # E77 Ordering Information Part # G GS GSTR Description Pin." Wide, Through Hole (/Tube Pin." Wide, Surface Mount (/Tube Pin." Wide, Surface Mount (/Reel + Control Load Control Load + Control Control DC Only Configuration + Load Load Switching Characteristics of Normally Open (Form A Devices CONTROL ms LOAD + 9% % + % + T ON T OFF DS--R
2 Absolute Maximum Ratings Parameter Ratings Units Blocking Voltage V P Reverse Input Voltage V Input Control Current ma Peak (ms A Input Power Dissipation mw Total Power Dissipation 8 mw Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage Input to Output 7 V rms Operational Temperature - to +8 C Storage Temperature - to + C Derate Linearly. mw/ C Derate Linearly.7 mw/ C Electrical absolute maximum ratings are at C Electrical Characteristics Parameter Conditions Symbol Min Typ Max Units Output C Current Limit =ma, V L =±V, t=ms I DC Configuration LMT 7 9 ma On-Resistance =ma, I L =ma R DC Configuration ON..8.7 Ω Off-State Leakage Current V L =V I LEAK -. µa Switching Speeds Turn-On T =ma, I L =ma ON. - Turn-Off T OFF. ms Output Capacitance =ma, V L =.V =ma, V L =V C O pf Input C Input Control Current I L =ma - - ma Input Dropout Current I L =ma. - - ma LED Forward Voltage =ma V F..9. V Common C Input to Output Capacitance - C I/O - - pf R
3 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N= Ambient Temperature = ºC = ma DC LED Forward Voltage Drop (V Typical On-Resistance Distribution (N= Ambient Temperature = ºC (Load Current = ma DC ; = ma DC 8 9 On-Resistance (Ω Typical for Switch Operation (N= Ambient Temperature = ºC (Load Current = ma DC LED Current (ma Typical for Switch Dropout (N= Ambient Temperature = ºC LED Current (ma Typical Turn-On Time (N= Ambient Temperature = ºC (Load Current = ma DC ; = ma DC Turn-On (ms Typical Turn-Off Time (N= Ambient Temperature = ºC (Load Current = ma DC ; = ma DC Turn-Off (ms Load Current (ma Typical Load Current (N= Anbient Temperature = ºC DC Configuration Temperature (ºC = ma = ma = ma = ma Leakage (µa Typical Leakage (Measured across Pins & - 8 Temperature (ºC Turn-On (ms Typical Turn-On (Load Current = ma DC = ma = ma Temperature (ºC Turn-Off (ms Typical Turn-Off (Load Current = ma DC = ma - 8 Temperature (ºC LED Forward Voltage Drop (V Typical LED Forward Voltage Drop - 8 Temperature (ºC = ma = ma = ma Turn-On (ms Typical Turn-On vs.led Forward Current (Load Current = ma DC Forward Current (ma *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R
4 PERFORMANCE DATA* Typical Turn-Off vs. LED Forward Current (Load Current = ma DC. Typical On-Resistance (Load Current = Max rated at Temp. Typical On-Resistance (Load Current = Max rated at Temp. DC Configuration Turn-Off (ms On-Resistance (Ω = ma = ma On-Resistance (Ω = ma = ma LED Forward Current (ma Temperature (ºC Temperature (ºC. Typical for Switch Operation (Load Current = ma DC. Typical for Switch Dropout (Load Current = ma DC Typical Load Current vs. Load Voltage (Ambient Temperature = ºC = ma DC LED Current (ma..... LED Current (ma..... Load Current (ma Temperature (ºC Temperature (ºC Load Voltage (V *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R
5 Manufacturing Information Soldering Recommended soldering processes are limited to ºC component body temperature for seconds. Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated solvents. MECHANICAL DIMENSIONS Pin Through Hole (G. ±. (. ±. 7. ±. (. ±. 7.9 TYP (.8 TYP 8.8 ±.8 (. ±.. ±.7 (. ±. PC Board Pattern (Top View -.8 DIA. (-. DIA.. ±.7 (. ±.. ±.7 (. ±. 7. ±.7 (. ±.. TYP (. TYP 9. ±.8 (. ±.. ±.7 (. ±..8 ±.7 (. ±. Pin Surface Mount ( GS Suffix 7. ±. (. ±. 8.8 ±.8 (. ±.. ±.7 (. ±. PC Board Pattern (Top View. ±.7 (. ±.. ±. (. ±.. ±.7 (. ±.. ±.7 (.7 ±.. ±.7 (. ±..7 ±.7 (.8 ±. 9. ±. (.7 ±.. ±.7 (. ±..9 ±.7 (.7 ±..99 ±.7 (.9 ±. 8. ±.7 (.7 ±. Tape and Reel Packaging for Surface Mount Package. DIA. (. DIA. Top Cover Tape Thickness. MAX. (. MAX. W =. MAX (. MAX B =. (.98 Embossment Carrier Embossment Top Cover Tape K =.8 (. K =.9 (.9 For additional information please visit our website at: A =. (.98 Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. P =. (.7 User Direction of Feed Dimensions mm (inches Specification: DS--R Copyright, Clare, Inc. OptoMOS is a registered trademark of Clare, Inc. All rights reserved. Printed in USA. //
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