Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr October 2016 - Version 1 - written by Romain Fraux DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. Company Profile 7 Texas Instruments 2. Physical Analysis 11 Package Package View & Dimensions Package Opening Package Cross-Section Die Die View & Dimensions Die Marking Die Delayering Main Blocks Identification Die Process (CMOS Transistors, SRAM) Die Cross-Section (Die thickness, Metal Layers, Transistor) Process Characteristics 3. Cost Analysis 35 Synthesis of the Cost Analysis Main Steps of Economical Analysis Yields Explanation Die Summary Front-End Summary Wafer Fabrication Unit Back-End: Probe Test, Backgrinding & Dicing Back-End: Package Assembly Back-End: Final Test Economic Analysis Hypotheses Yields Synthesis Wafer Cost Die Cost Packaging Cost Final Test Cost Component Cost 4. Selling Price Estimation 52 Definitions of Prices TI Financial Results & Correction Factors Selling Price Contact 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Texas Instruments DRA726. The Jacinto 6 Eco processor family address the entry- to mid-level segments by providing a cost effective solution with feature-rich in-vehicle infotainment. The DRA726 is a System-on-Chip (SoC) ables to deliver high-integrity audio, simultaneous multimedia streaming and device connectivity. It includes an ARM Cortex-A15 MPU, a C66x DSP, two ARM Cortex-M4 MPUs and many automotive interfaces to provide a cost-optimized BOM for automotive Tier 1s and car manufacturers. The SoC is based on enhanced OMAP architecture integrated on a 28nm technology and is provided in a 760-ball BGA package featuring TI s Via Channel Array (VCA) technology. It is AEC-Q100 qualified with automotive grade 1 temperature (-40 C to +125 C). The report provides a complete physical analysis of the DRA726 component with keys information on the packaging and the die (size, process, main blocks ). It also provides an estimation of its manufacturing cost and selling price with forecast for the coming years. 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3
The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured. The die is extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking. Removal of metal layers in order to identify the nature of the transistors and to measure the minimum dimensions. A cross section is realized in order to get the BEOL structure Set up of the manufacturing process. Costing analysis Setup of the manufacturing environment. Cost simulation of the process steps with different year and quantity scenarios. Selling price analysis Supply chain analysis. Analysis of the selling price. 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11
2016 by SYSTEM PLUS CONSULTING, all rights reserved. 12
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 13