CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

Similar documents
= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.

CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

Parameter 5.2 GHz 5.5 GHz 5.9 GHz Units. Small Signal Gain db. Output Power W. Efficiency

CMPA1D1E025F. 25 W, GHz, 40 V, Ku-Band GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features.

= 25 C) Parameter 6.0 GHz 7.5 GHz 9.0 GHz 10.5 GHz 12.0 GHz Units Small Signal Gain db P OUT

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

CGH55015F2 / CGH55015P2

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

350 W, MHz, 50-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems. = 25 C) of Demonstration Amplifier

CGH55030F2 / CGH55030P2

well as multi-octave bandwidth amplifiers up to 4 GHz. The transistor is available in a 2-lead flange and = 25 C), 50 V

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units

CGH55030F1 / CGH55030P1

CGH35060F1 / CGH35060P1

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

maintaining high gain and efficiency. Parameter 5.5 GHz 6.0 GHz 6.5 GHz Units Small Signal Gain db = 28 dbm

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

PRELIMINARY = 25 C) Parameter GHz 14.0 GHz 14.5 GHz Units Small Signal Gain db P SAT. = 26 dbm W P 3dB

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

= 25 C) Parameter 2.7 GHz 2.9 GHz 3.1 GHz 3.3 GHz 3.5 GHz Units Small Signal Gain db

= 25 C) Parameter 5.5 GHz 6.5 GHz 7.5 GHz 8.5 GHz Units Small Signal Gain db P OUT

= 25 C) Parameter 8.0 GHz 9.0 GHz 10.0 GHz 11.0 GHz Units Small Signal Gain db P OUT. = 25 dbm W Power P IN

CGHV1J025D. 25 W, 18.0 GHz, GaN HEMT Die

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

CGHV1J070D. 70 W, 18.0 GHz, GaN HEMT Die

CGHV60040D. 40 W, 6.0 GHz, GaN HEMT Die. Cellular Infrastructure Class AB, Linear amplifiers suitable for OFDM, W-CDMA, LTE, EDGE, CDMA waveforms

CGH80030D. 30 W, 8.0 GHz, GaN HEMT Die. 2-Way Private Radio. Broadband Amplifiers. Cellular Infrastructure. Test Instrumentation

DESCRIPTION. APPLICATIONS Microwave Radios Military Radios VSAT Telecom Infrastructure Test Equipment

GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

NME6003H GaN TRANSISTOR

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

MQ1470VP LDMOS TRANSISTOR

MR2003C LDMOS TRANSISTOR

Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Preliminary GTVA126001EC/FC

Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated

PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics

Part Number: IGN2735M250

Innogration (Suzhou) Co., Ltd.

Innogration (Suzhou) Co., Ltd.

MQ1270VP LDMOS TRANSISTOR

MR2006C LDMOS TRANSISTOR

PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics

Innogration (Suzhou) Co., Ltd.

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

PTFC270101M. High Power RF LDMOS Field Effect Transistor 10 W, 28 V, MHz. Description. Features. RF Characteristics

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Innogration (Suzhou) Co., Ltd.

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

25W Power Packaged Transistor. GaN HEMT on SiC

MQ1271VP LDMOS TRANSISTOR

not recommended for new design

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated

not recommended for new design Efficiency (%) Characteristic Symbol Min Typ Max Unit Intermodulation Distortion IMD dbc

15W Power Packaged Transistor. GaN HEMT on SiC

TGM2635-CP X-Band 100 W GaN Power Amplifier

40W Power Packaged Transistor. GaN HEMT on SiC

MAGX MAGX S

TGM2635-CP X-Band 100 W GaN Power Amplifier

GaAs, phemt, MMIC, Single Positive Supply, DC to 7.5 GHz, 1 W Power Amplifier HMC637BPM5E

Transcription:

CMPA801B025 25 W, 8.5-11.0 GHz, GaN MMIC, Power Amplifier Cree s CMPA801B025 is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior properties compared to silicon or gallium arsenide, including higher breakdown voltage, higher saturated electron drift velocity and higher thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC is available in a 10-lead metal/ceramic flanged package (CMPA801B025F) or small formfactor pill package (CMPA801B025P) for optimal electrical and thermal performance. PN: CMPA801B025F/ CMPA801B025P Package Type: 440213 / 440216 Typical Performance Over 8.5-11.0 GHz (T C = 25 C) Parameter 8.5 GHz 10.0 GHz 11.0 GHz Units Output Power 1 38.0 37.0 35.5 W Output Power 1 45.8 45.7 45.5 dbm Power Added Efficiency 1 37.0 36.0 35.0 % Note 1 : Measured in CMPA801B025F-AMP under 100 us pulse width, 10% duty. Features Applications 8.5-11.0 GHz Operation 37 W P OUT typical 16 db Power Gain Marine Radar Communications Satellite Communication Uplink 36 % Typical PAE 50 Ohm internally matched Rev 4.0 May 2017 <0.1 db Power droop Subject to change without notice. 1

Absolute Maximum Ratings (not simultaneous) Parameter Symbol Rating Units Conditions Drain-source Voltage V DSS 84 V DC 25 C Gate-source Voltage V GS -10, +2 V DC 25 C Power Dissipation P DISS 77 W Storage Temperature T STG -55, +150 C Operating Junction Temperature T J 225 C Maximum Forward Gate Current I GMAX 13 ma 25 C Soldering Temperature 1 T S 245 C Screw Torque τ 40 in-oz Thermal Resistance, Junction to Case R θjc 1.22 C/W Pulse Width = 100 µs, Duty Cycle = 10%, P DISS = 55 W Thermal Resistance, Junction to Case R θjc 1.80 C/W CW, P DISS = 55 W, 85 C Case Operating Temperature T C -40, +130 C Pulse Width = 100 µs, Duty Cycle = 10%, P DISS = 55 W Case Operating Temperature T C -40, +90 C CW, P DISS = 55 W Note: 1 Refer to the Application Note on soldering at www.cree.com/rf/document-library Electrical Characteristics (Frequency = 8.5 GHz to 11.0 GHz unless otherwise stated; T C = 25 C) Characteristics Symbol Min. Typ. Max. Units Conditions DC Characteristics 1 Gate Threshold V GS(TH) -3.8-3.0-2.3 V V DS = 10 V, I D = 13.2 ma Gate Quiscent Voltage V Q -2.7 V V DS = 28 V, I D = 1.2 A Saturated Drain Current 2 I DS 10.6 13.0 A V DS = 6.0 V, V GS = 2.0 V Drain-Source Breakdown Voltage V BD 84 100 V V GS = -8 V, I D = 13.2 ma RF Characteristics 3 Small Signal Gain S21 20 24 db V DD = 1.2 A, P IN = -20 dbm Input Return Loss S11 6.0 db V DD = 1.2 A Output Return Loss S22 6.0 db V DD = 1.2 A Output Mismatch Stress VSWR 5:1 Y Notes: 1 Measured on-wafer prior to packaging. 2 Scaled from PCM data. 3 Measured in the CMPA801B025F-AMP. No damage at all phase angles, V DD = 28 V, I DQ = 1.2 A, Pulse Width = 100 µs, Duty Cycle = 10%, P IN Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 2 CMPA801B025 Rev 4.0

Electrical Characteristics Continued... (T C = 25 C) Characteristics Symbol Min. Typ. Max. Units Conditions RF Characteristics 1,2 Output Power P OUT1 44.75 45.8 dbm V DD = 1.2 A, Frequency = 8.5 GHz, P IN Output Power P OUT2 44.75 45.7 dbm V DD = 1.2 A, Frequency = 10.0 GHz, P IN Output Power P OUT3 44.35 45.5 dbm V DD = 1.2 A, Frequency = 11.0 GHz, P IN Power Gain G 1 14.75 15.8 db V DD = 1.2 A, Frequency = 8.5 GHz, P IN Power Gain G 2 14.75 15.7 db V DD = 1.2 A, Frequency = 10.0 GHz, P IN Power Gain G 3 14.35 15.5 db V DD = 1.2 A, Frequency = 11.0 GHz, P IN Power Added Efficiency PAE 1 29 37 % V DD = 1.2 A, Frequency = 8.5 GHz, P IN Power Added Efficiency PAE 2 29 36 % V DD = 1.2 A, Frequency = 10.0 GHz, P IN Power Added Efficiency PAE 3 27 35 % V DD = 1.2 A, Frequency = 11.0 GHz, P IN Pulse Amplitude Droop D 0.1 db V DD = 1.2 A, Frequency = 8.5-11.0 GHz, P IN Notes: 1 Pulse Width = 100 μs, Duty Cycle = 10 %. 2 Measured in CMPA801B025F-AMP. Electrostatic Discharge (ESD) Classifications Parameter Symbol Class Test Methodology Human Body Model HBM 1A (> 250 V) JEDEC JESD22 A114-D Charge Device Model CDM II (200 < 500 V) JEDEC JESD22 C101-C Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 3 CMPA801B025 Rev 4.0

CMPA801B025F Typical Performance Figure 1. - Output Power, Gain and Power Added Efficiency vs. Frequency V DD = 28 V, P IN, I DQ = 1.2 A Pulse Width = 100 μs, Duty Cycle = 10 % 50 50% 45 45% 40 40% (W, dbm) Gain (db) Power ( 35 30 25 20 15 35% 30% 25% 20% 15% Efficiency (%) 10 5 Output Power (W) Gain (db) Output Power (dbm) PAE (%) 10% 5% 0 0% 7500 8000 8500 9000 9500 10000 10500 11000 11500 Frequency (MHz) Figure 2. - Output Power, Gain and Power Added Efficiency vs. Frequency V DD = 1.2 A, CW P SAT (I G 1.5mA) 50 50% 45 45% 40 40% dbm) Gain (db) Power (W, 35 30 25 20 15 35% 30% 25% 20% 15% ficiency (%) Eff 10 10% CW Psat Power (W) 5 CW Psat Power (dbm) CW Psat Gain (db) 5% CW Psat PAE (%) 0 0% 7500 8000 8500 9000 9500 10000 10500 11000 11500 Frequency (MHz) Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 4 CMPA801B025 Rev 4.0

CMPA801B025F Typical Performance 50 Figure 3. - Output Power, Gain and Power Added Efficiency vs. Input Power V DD = 1.2 A, Frequency = 11 GHz 50% 45 45% 40 40% Power (W, dbm) Gain (db) 35 30 25 20 15 10 Output Power (dbm) Output Power (W) 35% 30% 25% 20% 15% 10% Efficiency % Gain (db) 5 5% PAE % 0 0% 16 18 20 22 24 26 28 30 32 Input Power (dbm) 30 Figure 4. - Small Signal S-Parameters vs. Frequency 20 ), S21 (db), S22 (db) S11 (db) 10 0-10 -20 S(2,1) S(1,1) S(2,2) -30 6000 7000 8000 9000 10000 11000 12000 Frequency (MHz) Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 5 CMPA801B025 Rev 4.0

CMPA801B025F Typical Performance 90 Figure 5. - Power Dissipation Derating Curve 80 70 Power Dissipation (W) 60 50 40 30 Derating Curve Pulsed 10% 100uS Derating Curve CW Note 1 20 ` 10 0 0 25 50 75 100 125 150 175 200 225 250 Maximum Case Temperature ( C) Note 1. Area exceeds Maximum Case Operating Temperature (See Page 2). Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 6 CMPA801B025 Rev 4.0

CMPA801B025F-AMP Demonstration Amplifier Circuit Bill of Materials Designator Description Qty C15 CAP ELECT 100UF 80V AFK SMD 1 R1, R2 RES 0.0 OHM 1/16W 0402 SMD 2 W1 WIRE, BLACK, 22 AWG ~ 1.50 1 W2 WIRE, BLACK, 22 AWG ~ 1.75 1 W3 WIRE, BLACK, 22 AWG ~ 2.0 1 J1,J2 CONNECTOR, SMA, PANEL MOUNT JACK, FLANGE, 4-HOLE, BLUNT POST, 20MIL J3 CONNECTOR, HEADER, RT>PLZ.1CEN LK 9POS 1 J4 CONNECTOR, SMB-U SURFACE MOUNT 1 - PCB, TEST FIXTURE, TACONICS RF35P, 20 MILS, 440208 PKG - 2-56 SOC HD SCREW 1/4 SS 4 - #2 SPLIT LOCKWASHER SS 4 Q1 CMPA801B025F 1 2 1 CMPA801B025F-AMP Demonstration Amplifier Circuit Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 7 CMPA801B025 Rev 4.0

CMPA801B025F-AMP Demonstration Amplifier Circuit Schematic CMPA801B025F-AMP Demonstration Amplifier Circuit Outline Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 8 CMPA801B025 Rev 4.0

CMPA801B025F-AMP Demonstration Amplifier Circuit Schematic To configure the CMPA801B025F test fixture to enable independent V G1 / V G2 control of the device, a cut must be made to the microstrip line just above the R1 resistor as shown. Pin 9 will then supply V G1 and Pin 8 will supply V G2. CMPA801B025F Typical Performance Theta JC (⁰C/W) Figure 7. - Transient Thermal Performance T CASE = 85 C 1.90 1.85 1.80 1.75 1.70 1.65 1.60 1.55 1.50 1.45 1.40 1.35 1.30 1.25 1.20 1.15 1.10 1.05 10% Duty Cycle 1.00 0.95 20% Duty Cycle 0.90 50% Duty Cycle 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 1.00E-06 1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 Time (seconds) Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 9 CMPA801B025 Rev 4.0

Product Dimensions CMPA801B025F (Package Type 440213) Pin Number Qty 1 Gate Bias for Stage 2 2 Gate Bias for Stage 2 3 RF In 4 Gate Bias for Stage 1 5 Gate Bias for Stage 1 6 Drain Bias 7 Drain Bias 8 RF Out 9 Drain Bias 10 Drain Bias 11 Source Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 10 CMPA801B025 Rev 4.0

Product Dimensions CMPA801B025P (Package Type 440216) Pin Number Qty 1 Gate Bias for Stage 2 2 Gate Bias for Stage 2 3 RF In 4 Gate Bias for Stage 1 5 Gate Bias for Stage 1 6 Drain Bias 7 Drain Bias 8 RF Out 9 Drain Bias 10 Drain Bias 11 Source Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 11 CMPA801B025 Rev 4.0

Part Number System CMPA801B025F Package Power Output (W) Upper Frequency (GHz) Lower Frequency (GHz) Cree MMIC Power Amplifier Product Line Parameter Value Units Lower Frequency 8.5 GHz Upper Frequency 1 11.0 GHz Power Output 25 W Package Flange - Table 1. Note 1 : Alpha characters used in frequency code indicate a value greater than 9.9 GHz. See Table 2 for value. Character Code Code Value A 0 B 1 C 2 D 3 E 4 F 5 G 6 H 7 J 8 K 9 Examples: 1A = 10.0 GHz 2H = 27.0 GHz Table 2. Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 12 CMPA801B025 Rev 4.0

Product Ordering Information Order Number Description Unit of Measure Image CMPA801B025F GaN HEMT Each CMPA801B025P GaN HEMT Each CMPA801B025F-TB Test board without GaN HEMT Each CMPA801B025F-AMP Test board with GaN HEMT installed Each Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 13 CMPA801B025 Rev 4.0

Disclaimer Specifications are subject to change without notice. believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Cree for its use or for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different applications, and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Cree products are not designed, intended, or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or death, or in applications for the planning, construction, maintenance or direct operation of a nuclear facility. CREE and the CREE logo are registered trademarks of For more information, please contact: www.cree.com/rf Sarah Miller Marketing Cree, RF Components 1.919.407.5302 Ryan Baker Marketing & Sales Cree, RF Components 1.919.407.7816 Tom Dekker Sales Director Cree, RF Components 1.919.407.5639 Copyright 2011-2017 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Other trademarks, product and company names are the property of their respective owners and do not imply specific 14 CMPA801B025 Rev 4.0