Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Re sis tors Type: ER PA, P3, PA3, P, P8, P4 Fetures ESD surge chrcteristics superior to stndrd metl fi lm resistors High relibility Metl glze thick fi lm resistive element nd three lyers of electrodes Suitble for both refl ow nd fl ow soldering High power. W : 4 inch / 5 mm size (ERPA), 3 inch / 8 mm size (ERP3).5 W : 3 inch / 8 mm size (ERPA3).5 W : 85 inch / mm size (ERP), inch / 35 mm size (ERP4). W : inch / 3 mm size (ERP8) Reference Stndrds IEC 5-8, IS C 5-8, EIA RC-34B AEC-Q qulifi ed RoHS complint As for Pckging Methods, Lnd Pttern, Soldering Conditions nd Sfety Precutions, Plese see Dt Files Explntion of Prt Numbers 3 4 5 7 8 9 E R P D Product Thick Film Chip Resistors Size, Power Rting PA P3 PA3 P P8 P4 Inch 4 3 3 85 Power R.. W. W.5 W.5 W. W.5 W D F ±.5 % ± % ± 5 % The first two or three digits re significnt figures of resistnce nd the third or 4th one denotes number of zeros following. Three digit type (±), four digit type (±%, ±.) Exmple:. kω, kω U Pckging Methods Pckging X mm pitch,, pcs. 4 mm pitch, 5, pcs. Embossed Crrier Tping 4 mm pitch, 5, pcs. ERPA ERP3 ERPA3 ERP ERP8 ERP4 Construction Dimensions in mm (not to scle) L Protective coting Electrode (Inner) W Alumin substrte t Thick fi lm resistive element Electrode (Between) Electrode (Outer) ERPA (4) ERP3 (3) ERPA3 (3) ERP (85) ERP8 () ERP4 () b Dimensions (mm) L W b t Mss (Weight) [g/ pcs.]. ±.5.5 ±.5.5 ±..5 ±.5.35 ±.5.8. ±.5.8 +.5.5 +.5.3 ±.5.45 ±..5.. ±.5.8 +.5.5 +.5.5 ±..45 ±..5.. ±..5 ±..5 ±..4 ±.. ±. 4 3. +.5.. +.5.5.4 ±..5 ±.. ±. 3. ±..5 ±..35 ±..5 ±.. ±. 9 un. 5
Anti-Surge Thick Film Chip Resistors Rtings ERPA (4) ERP3 (3) ERPA3 (3) ERP (85) ERP8 () ERP4 () Power Rting (3) t 7 C (W) () Rted Continuous Working oltge (RCW) shll be de ter mined from RCW= Power Rting Re sis tnce lues, or Element oltge list ed bove, whichever less. () Overlod (Short-time Overlod) Test oltge (SOT) shll be de termined from SOT=.5 RCW or mx. Over lod olt ge list ed bove which ev er less. (3) Use it on the condition tht the cse temperture is below 55 C. Power Derting Curve For resistors operted in mbient tempertures bove 7 C, power rting shll be derted in ccordnce with the fi gure on the right. When the temperture of ERP4 is 55 C or less, the derting strt temperture cn be chnged to 5 C. (See the dotted line) ESD Chrcteristic Element oltge () Mximum Overlod oltge (). 5. 5.5 5.5 4. 5.5 4 R=Ω(<.5 kω)/5ω(>.5 kω) (%) Rted Lod (%) 55 C 8 4 (Ω) T.C.R. ( / C) ±.5, ± tom (E4, E9) ± ±5 tom (E4) ± ±.5 tom (E4, E9) ±5 ± tom (E4, E9) ± ±5 tom (E4) R < Ω : 5 to +4 Ω < R : ± ±.5, ± tom (E4, E9) ± ±5 to.5m (E4) ± ±.5, ± tom (E4, E9) R < 33 Ω : ±3 33 Ω < R : ± R < Ω : to + ±5 to 3.3M (E4) Ω < R < 33 Ω : ±3 33 Ω < R : ± ±.5, ± tom (E4, E9) ± ±5 tom (E4) R < Ω : to + Ω < R : ± ±.5, ± tom (E4, E9) ± ±5 tom (E4) R < Ω : to + Ω < R : ± 7 C ER PA, P3, PA3, P4 Ctegory Temperture ( C) 5 C ER P, P8 55 C 4 4 8 4 8 Ambient Temperture ( C) ±3.k C=5pF Smple Anti-Surge Thick Film Chip Resistors(ERP Type) Thick Film Chip Resistors(ER Type) % -% -% -3% Ω ERP3, PA3(8 (3) size) Ω ERPA3 ERP3 ER3G -% -3% kω kω kω MΩ Ω % -% ERP ( (85) size) ERP ERG Ω kω kω kω MΩ % -% -% -3% Ω ERP8(3 () size) ERP8 ER8G -% -3% Ω kω kω kω MΩ Ω % -% ERP4(35 () size) ERP4 ER4 Ω kω kω kω MΩ 9 un. 5
Anti-Pulse Thick Film Chip Resistors Anti-Pulse Thick Film Chip Re sis tors Type: ER T, T8, T4 Fetures Anti-Pulse chrcteristics High pulse chrcteristics chieved by the optimized trimming specifi ctions High relibility Metl glze thick fi lm resistive element nd three lyers of electrodes Suitble for both refl ow nd fl ow soldering High power.5w : 85 inch / mm size (ERT).33W : inch / 3 mm size (ERT8).5W : inch / 35 mm size (ERT4) Reference Stndrds IEC 5-8, IS C 5-8, EIA RC-34B AEC-Q qulifi ed RoHS complint As for Pckging Methods, Lnd Pttern, Soldering Conditions nd Sfety Precutions, Plese see Dt Files Explntion of Prt Numbers 3 4 5 7 8 9 E R T Product Thick Film Chip Resistors T T8 T4 Size, Power Rting Inch 85 Power R..5 W.33 W.5 W ± 5 % U Pckging Methods Pckging 4 mm pitch, 5, pcs. Embossed Crrier Tping 4 mm pitch, 5, pcs. ERT ERT8 ERT4 The first two digits re significnt figures of resistnce nd the third one denotes number of zeros following. Exmple:. kω Construction Dimensions in mm (not to scle) Protective coting Alumin substrte Electrode (Inner) W L t Electrode (Between) b ERT (85) Dimensions (mm) L W b t Mss (Weight) [g/ pcs.]. ±..5 ±..5 ±..4 ±.. ±. 4 Thick fi lm resistive element Electrode (Outer) ERT8 () ERT4 () 3. +.5.. +.5.5.4 ±..5 ±.. ±. 3. ±..5 ±..35 ±..5 ±.. ±. 5 Apr. 5
Anti-Pulse Thick Film Chip Resistors Rtings ERT (85) Power Rting t 7 C (W) Element oltge () Mximum Overlod oltge () (%).5 5 ±5 (Ω) to M (E4) T.C.R. ( / C) Less thn Ω : to + Less thn 33 Ω : ±3 More thn 33 Ω : ± Ctegory Temperture ( C) ERT8 ().33 4 ±5 to M (E4) Less thn Ω : to + More thn Ω : ± ERT4 ().5 4 ±5 to M (E4) Less thn Ω : to + More thn Ω : ± () Rted Continuous Working oltge (RCW) shll be de ter mined from RCW= Power Rting Re sis tnce lues, or Element oltge list ed bove, whichever less. () Overlod (Short-time Overlod) Test oltge (SOT) shll be de termined from SOT=.5 RCW or mx. Over lod olt ge list ed bove which ev er less. Power Derting Curve For resistors operted in mbient tempertures bove 7 C, power rting shll be derted in ccordnce with the figure on the right. Rted Lod (%) 55 C 7 C 8 4 55 C 4 4 8 4 8 Ambient Temperture ( C) Power Curve In rush pulse Chrcteristic Pp Power Pulse durtion : t Period time : s Test cycle : cycles Spec : vlue = within ± : Anti-Pulse Thick Film Chip Resistors (ERT Type) : Thick Film Chip Resistors (ER Type) ERT (85 inch/ mm size) ERT8 ( inch/3 mm size) ERT4 ( inch/35 mm size) Power : Pp (W) Pulse durtion t (msec) Power : Pp (W) Pulse durtion t (msec) Power : Pp (W) Pulse durtion t (msec) 5 Apr. 5
Anti-Surge Thick Film Chip Resistors (Double-sided resistive elements structure) Anti-Surge Thick Film Chip Re sis tors (Double-sided resistive elements structure) 85 Type: ER PW Fetures ESD surge chrcteristics superior to stndrd metl fi lm resistors High relibility Metl glze thick fi lm resistive element nd three lyers of electrodes Suitble for both refl ow nd fl ow soldering High power.5 W : (85) size(erpw) High pulse chrcteristics.5 times higher thn 85 inch size Anti-Surge Thick Film Chip Resistors (ERP) Reference Stndrds IEC 5-8, IS C 5-8, EIA RC-34B AEC-Q qulifi ed RoHS complint Pckging Methods, Lnd Pttern, Soldering Conditions nd Sfety Precutions Plese see Dt Files Explntion of Prt Numbers 3 4 5 7 8 9 Product Thick Film Chip Resistors Size, Power Rting Type: inch Power R. PW : 85.5 W F ± % ± 5 % The first two or three digits re significnt figures of resistnce nd the third or 4th one denotes number of zeros following. Three digit type (±), four digit type (±%) Exmple:. k, k Pckging Methods Pckging 4 mm pitch, 5, pcs. Construction Dimensions in mm (not to scle) Protective coting Electrode (Inner) L Alumin substrte W Electrode (Between) t Electrode (Outer) Thick fi lm resistive element Bottom side element Type ERPW (85) Dimensions (mm) L W t Mss (Weight) [g/ pcs.]. ±..5 ±..35 ±..5 ±. Feb. 4
Anti-Surge Thick Film Chip Resistors (Double-sided resistive elements structure) Rtings Type ERPW (85) Power Rting (3) t 7 C (W) Element oltge () Mximum Overlod oltge ().5 5 (%) ± ±5 (Ω) to M (E4, E9) to M (E4) T.C.R. ( / C) ± R < Ω to + Ω < R± Ctegory Temperture ( C) () Rted Continuous Working oltge (RCW) shll be de ter mined from RCW= Power Rting Re sis tnce lues, or Element oltge list ed bove, whichever less. () Overlod (Short-time Overlod) Test oltge (SOT) shll be de termined from SOT=.5 Power Rting or mx. Over lod olt ge list ed bove which ev er less. (3) Use it on the condition tht the cse temperture is below 55 C. Power Derting Curve For resistors operted in mbient tempertures bove 7 C, power rting shll be derted in ccordnce with the fi gure on the right. ESD Chrcteristic R=(.5 k)/5(>.5 k) Rted Lod (%) 55 C 7 C 8 4 55 C 4 4 8 4 8 Ambient Temperture ( C) ±3.k C=5pF Smple Anti-Surge Thick Film Chip Resistors(ERPW Type) Thick Film Chip Resistors(ERG Type) % -% -% -3% k k k M Power Curve In rush pulse Chrcteristic Pp Power Pulse durtion : t Test cycle : cycles Spec : vlue = within ±% Anti-Surge Thick Film Chip Resistors(ERPW Type) Anti-Surge Thick Film Chip Resistors(ERP Type) Power : Pp (W) Pulse durtion t (msec) Feb. 4