MR2003C LDMOS TRANSISTOR

Similar documents
MR2006C LDMOS TRANSISTOR

MQ1270VP LDMOS TRANSISTOR

MQ1470VP LDMOS TRANSISTOR

Innogration (Suzhou) Co., Ltd.

Innogration (Suzhou) Co., Ltd.

Innogration (Suzhou) Co., Ltd.

MQ1271VP LDMOS TRANSISTOR

Innogration (Suzhou) Co., Ltd.

Innogration (Suzhou) Co., Ltd.

NME6003H GaN TRANSISTOR

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

CGH55030F2 / CGH55030P2

GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

RF Power LDMOS Transistor High Ruggedness N--Channel Enhancement--Mode Lateral MOSFET

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

Parameter 5.2 GHz 5.5 GHz 5.9 GHz Units. Small Signal Gain db. Output Power W. Efficiency

PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics

CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

CGH55015F2 / CGH55015P2

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units

PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

well as multi-octave bandwidth amplifiers up to 4 GHz. The transistor is available in a 2-lead flange and = 25 C), 50 V

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

CGH55030F1 / CGH55030P1

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

CGH35060F1 / CGH35060P1

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

RF Power LDMOS Transistor High Ruggedness N--Channel Enhancement--Mode Lateral MOSFET

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

not recommended for new design

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated

CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

maintaining high gain and efficiency. Parameter 5.5 GHz 6.0 GHz 6.5 GHz Units Small Signal Gain db = 28 dbm

not recommended for new design Efficiency (%) Characteristic Symbol Min Typ Max Unit Intermodulation Distortion IMD dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

350 W, MHz, 50-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems. = 25 C) of Demonstration Amplifier

RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

Preliminary GTVA126001EC/FC

CGHV1J070D. 70 W, 18.0 GHz, GaN HEMT Die

CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

PTFC270101M. High Power RF LDMOS Field Effect Transistor 10 W, 28 V, MHz. Description. Features. RF Characteristics

RF Power LDMOS Transistor N--Channel Enhancement--Mode Lateral MOSFET

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

CGHV1J025D. 25 W, 18.0 GHz, GaN HEMT Die

CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features

ST W, 28 V RF Power LDMOS transistor from HF to 1.6 GHz. Datasheet. Features. Applications. Description

RF Power LDMOS Transistor N--Channel Enhancement--Mode Lateral MOSFET

RF Power LDMOS Transistor High Ruggedness N--Channel Enhancement--Mode Lateral MOSFET

RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

RF Power LDMOS Transistor N--Channel Enhancement--Mode Lateral MOSFET

Advance PTNC210604MD. Wideband LDMOS Two-stage Integrated Power Amplifier 20 W + 40 W, 28 V, MHz. Description. Features

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

RF Power LDMOS Transistors N--Channel Enhancement--Mode Lateral MOSFETs

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

Characteristic Symbol Value Unit Thermal Resistance, Junction-to-Case R θjc 6 C/W

Using a Linear Transistor Model for RF Amplifier Design

PRELIMINARY = 25 C) Parameter GHz 14.0 GHz 14.5 GHz Units Small Signal Gain db P SAT. = 26 dbm W P 3dB

CMPA1D1E025F. 25 W, GHz, 40 V, Ku-Band GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features.

Transcription:

18W, 12.5V High Power RF LDMOS FETs Description The MR2003C is a 18-watt, Push-Pull configuration, unmatched LDMOS FETs, designed for ISM and Mobile radio applications with frequencies under 2GHz. It can be used in Class AB/B and Class C for all typical modulation formats. It can also operate at 13.6V, 14V etc with increased power capability. Typical Performance (On Innogration fixture with device soldered): V DD = 12.5 Volts, I DQ = 150 ma, CW. MR2003C Freq(MHz) Pin(dBm) Pout(dBm) Pout(W) IDS(A) Gain(dB) Eff(%) 100 28 42.4 17.4 2.34 14.4 59.4% 150 26.8 42.5 17.8 2.4 15.7 59.3% 200 26.9 42.4 17.4 2.38 15.5 58.4% 250 28.8 42.8 19.1 2.45 14 62.2% 300 27.2 42.5 17.8 2.15 15.3 66.2% 350 25.4 42 15.8 1.89 16.6 67.1% 400 26.6 41.9 15.5 1.86 15.3 66.6% 450 28.3 42.4 17.4 2.31 14.1 60.2% 500 27.8 42.3 17.0 2.24 14.5 60.7% 550 27.7 42 15.8 2.12 14.3 59.8% Features High Efficiency and Linear Gain Operations Integrated ESD Protection Excellent thermal stability, low HCI drift Large Positive and Negative Gate/Source Voltage Range for Improved Class C Operation Pb-free, RoHS-compliant Suitable Applications HF Amplifier UHF Amplifier Vehicle radio VHF Amplifier Wideband Amplifier Beidou Navigation Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS +65 Vdc Gate--Source Voltage VGS -10 to +10 Vdc Operating Voltage VDD +28 Vdc Storage Temperature Range Tstg -65 to +150 C Case Operating Temperature TC +150 C Operating Junction Temperature TJ +225 C Table 2. Thermal Characteristics Characteristic Symbol Value Unit 1 / 5

Thermal Resistance, Junction to Case T C= 85 C, T J=200 C, DC test Table 3. ESD Protection Characteristics Test Methodology R JC 1.0 C/W Class Human Body Model (per JESD22--A114) Class 2 Table 4. Electrical Characteristics (T A = 25 unless otherwise noted) Characteristic Symbol Min Typ Max Unit DC Characteristics (per half section) Drain-Source Voltage V GS=0, I DS=1.0mA Zero Gate Voltage Drain Leakage Current (V DS = 28 V, V GS = 0 V) Gate--Source Leakage Current (V GS = 9 V, V DS = 0 V) Gate Threshold Voltage (V DS = 28V, I D = 600 A) Common Source Input Capacitance Common Source Output Capacitance Common Source Feedback Capacitance Common Source Input Capacitance Common Source Output Capacitance Common Source Feedback Capacitance V(BR)DSS 65 70 V IDSS 1 A IGSS 1 A VGS(th) 2.17 V C ISS 15.7 pf C OSS 6.0 pf C RSS 0.42 pf C ISS 16.0 pf C OSS 4.6 pf C RSS 0.38 pf Functional Tests (On Demo Test Fixture, 50 ohm system) V DD = 12.5 Vdc, I DQ = 150mA, f = 500 MHz,CW Signal Measurements, Pin=27.8dBm Power Gain Gp 14.5 db Drain Efficiency@Pout D 60 % Output Power P out 17 W Input Return Loss IRL -5 db Load Mismatch (In Innogration Test Fixture, 50 ohm system): V DD = 12.5 Vdc, I DQ = 150 ma, f = 500 MHz VSWR 10:1 at 18W pulse CW Output Power No Device Degradation 2 / 5

L1 MR2003C LDMOS TRANSISTOR TYPICAL CHARACTERISTICS Figure 1: Power gain and drain efficiency as function of Pulse output power 20 19 18 17 16 15 14 13 70.0% 65.0% 60.0% 55.0% 50.0% 45.0% 40.0% 35.0% 30.0% 25.0% 12 20.0% 30 32 34 36 38 40 42 44 100MHz Gain(dB) 300MHz Gain(dB) 500MHz Gain(dB) 100MHz EFF(%) 300MHz EFF(%) 500MHz EFF(%) (dbm) Figure 2: 108-512MHz wideband application circuit picture (PCB Materials: Roger 4350B, 30Mil, Layout file upon request) 110 Ohm 470uF T1 510 Ohm T2 0 Ohm 510 Ohm 4.7PF 0 Ohm T4 T3 110 Ohm BOM L1 T1,T4 T2,T3 6uH 5A air core inductance magnetic core: BN-61-102 RF cable: SF-086-50, 70mm length magnetic core: BN-61-102 RF cable: SFF-25-1.5, 70mm length 3 / 5

Package Outline Flanged ceramic package; 2 mounting holes; 4 leads OUTLINE VERSION REFERENCE IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE PKG-G4E 2018/01/19 Figure 1. Package Outline PKG-G4E 4 / 5

Revision history Table 5. Document revision history Date Revision Datasheet Status 2018/6/14 Rev 1.0 Preliminary Datasheet 2018/9/16 Rev 1.1 12.5V data added Disclaimers Specifications are subject to change without notice. Innogration believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Innogration for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Innogration. Innogration makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Innogration in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Innogration products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Innogration product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. For any concerns or questions related to terms or conditions, pls check with Innogration and authorized distributors Copyright by Innogration (Suzhou) Co.,Ltd. 5 / 5