Features Advanced Process Technology Ultra Low On-Resistance 175 C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax Lead-Free, RoHS Compliant Automotive Qualified * AUTOMOTIVE GRADE V DSS R DS(on) max. I D AUIRFZ44Z AUIRFZ44ZS HEXFET Power MOSFET D 55V 13.9m 51A Description Specifically designed for Automotive applications, this HEXFET Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175 C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications. S D G TO-220AB AUIRFZ44Z S G D 2 Pak AUIRFZ44ZS G D S Gate Drain Source Standard Pack Base part number Package Type Orderable Part Number Form Quantity AUIRFZ44Z TO-220 Tube 50 AUIRFZ44Z AUIRFZ44ZS D 2 Tube 50 AUIRFZ44ZS -Pak Tape and Reel Left 800 AUIRFZ44ZSTRL Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25 C, unless otherwise specified. Symbol Parameter Max. Units I D @ T C = 25 C Continuous Drain Current, V GS @ V 51 I D @ T C = 0 C Continuous Drain Current, V GS @ V (See Fig. 9) 36 A I DM Pulsed Drain Current 200 P D @T C = 25 C Maximum Power Dissipation 80 W Linear Derating Factor 0.53 W/ C V GS Gate-to-Source Voltage ± 20 V E AS Single Pulse Avalanche Energy (Thermally Limited) 86 E AS (tested) Single Pulse Avalanche Energy Tested Value 5 mj I AR Avalanche Current See Fig.15,16, 12a, 12b A E AR Repetitive Avalanche Energy mj T J Operating Junction and -55 to + 175 T STG Storage Temperature Range C Soldering Temperature, for seconds (1.6mm from case) 300 Mounting torque, 6-32 or M3 screw lbf in (1.1N m) Thermal Resistance Symbol Parameter Typ. Max. Units R JC Junction-to-Case 1.87 R CS Case-to-Sink, Flat, Greased Surface 0.50 R JA Junction-to-Ambient 62 R JA Junction-to-Ambient ( PCB Mount, steady state) 40 HEXFET is a registered trademark of Infineon. *Qualification standards can be found at www.infineon.com 1 2017-09-25 C/W
AUIRFZ44Z/ZS Static @ T J = 25 C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions V (BR)DSS Drain-to-Source Breakdown Voltage 55 V V GS = 0V, I D = 250µA V (BR)DSS / T J Breakdown Voltage Temp. Coefficient 0.054 V/ C Reference to 25 C, I D = 1mA R DS(on) Static Drain-to-Source On-Resistance 11.1 13.9 m V GS = V, I D = 31A V GS(th) Gate Threshold Voltage 2.0 4.0 V V DS = V GS, I D = 250µA gfs Forward Trans conductance 22 S V DS = 25V, I D = 31A I DSS Drain-to-Source Leakage Current 20 V DS = 55V, V GS = 0V µa 250 V DS = 55V,V GS = 0V,T J =125 C I GSS Gate-to-Source Forward Leakage 200 V GS = 20V na Gate-to-Source Reverse Leakage -200 V GS = -20V Dynamic Electrical Characteristics @ T J = 25 C (unless otherwise specified) Q g Total Gate Charge 29 43 I D = 31A Q gs Gate-to-Source Charge 7.2 11 nc V DS = 44V Q gd Gate-to-Drain Charge 12 18 V GS = V t d(on) Turn-On Delay Time 14 V DD = 28V t r Rise Time 68 I D = 31A ns t d(off) Turn-Off Delay Time 33 R G = 15 t f Fall Time 41 V GS = V Between lead, L D Internal Drain Inductance 4.5 6mm (0.25in.) nh from package L S Internal Source Inductance 7.5 and center of die contact C iss Input Capacitance 1420 V GS = 0V C oss Output Capacitance 240 V DS = 25V C rss Reverse Transfer Capacitance 130 ƒ = 1.0MHz,See Fig.5 pf C oss Output Capacitance 830 V GS = 0V, V DS = 1.0V ƒ = 1.0MHz C oss Output Capacitance 190 V GS = 0V, V DS = 44V ƒ = 1.0MHz C oss eff. Effective Output Capacitance 300 V GS = 0V, V DS = 0V to 44V Diode Characteristics Parameter Min. Typ. Max. Units Conditions Continuous Source Current MOSFET symbol I S 51 (Body Diode) showing the A Pulsed Source Current integral reverse I SM 200 (Body Diode) p-n junction diode. V SD Diode Forward Voltage 1.2 V T J = 25 C,I S = 31A,V GS = 0V t rr Reverse Recovery Time 23 35 ns T J = 25 C,I F = 31A, V DD = 28V Q rr Reverse Recovery Charge 17 26 nc di/dt = 0A/µs t on Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D ) Notes: Repetitive rating; pulse width limited by max. junction temperature. (See fig.11) Limited by T Jmax, starting T J = 25 C, L = 0.18mH, R G = 25, I AS = 31A, V GS =V. Part not recommended for use above this value. I SD 31A, di/dt 840A/µs, V DD V (BR)DSS, T J 175 C. Pulse width 1.0ms; duty cycle 2%. C oss eff. is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS. Limited by T Jmax, see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance. This value determined from sample failure population 0% tested to this value in production. This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G- Material ). For recommended footprint and soldering techniques refer to application note #AN-994. R is rated at TJ of approximately 90 C. 2 2017-09-25
I D, Drain-to-Source Current ) G fs, Forward Transconductance (S) I D, Drain-to-Source Current (A) I D, Drain-to-Source Current (A) AUIRFZ44Z/ZS 00 0 VGS TOP 15V V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 00 0 VGS TOP 15V V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 4.5V 4.5V 60µs PULSE WIDTH Tj = 25 C 1 0.1 1 0 V DS, Drain-to-Source Voltage (V) 60µs PULSE WIDTH Tj = 175 C 1 0.1 1 0 V DS, Drain-to-Source Voltage (V) Fig. 1 Typical Output Characteristics Fig. 2 Typical Output Characteristics 00 60 50 T J = 25 C 0 40 T J = 175 C T J = 25 C 30 20 T J = 175 C 1.0 V DS = 15V 60µs PULSE WIDTH 2 4 6 8 12 0 V DS = V 0 20 30 40 50 V GS, Gate-to-Source Voltage (V) I D,Drain-to-Source Current (A) Fig. 3 Typical Transfer Characteristics Fig. 4 Typical Forward Trans conductance vs. Drain Current 3 2017-09-25
I SD, Reverse Drain Current (A) I D, Drain-to-Source Current (A) C, Capacitance(pF) V GS, Gate-to-Source Voltage (V) AUIRFZ44Z/ZS 000 V GS = 0V, f = 1 MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd C oss = C ds + C gd 12.0.0 8.0 I D = 31A V DS = 44V V DS = 28V V DS = 11V C iss 00 6.0 C oss 4.0 C rss 2.0 0 1 0 0.0 0 5 15 20 25 30 V DS, Drain-to-Source Voltage (V) Q G Total Gate Charge (nc) Fig 5. Typical Capacitance vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage 00 0 T J = 175 C 00 0 OPERATION IN THIS AREA LIMITED BY R DS (on) 0µsec 1 T J = 25 C 0. V GS = 0V 0.01 0.0 0.5 1.0 1.5 2.0 V SD, Source-to-Drain Voltage (V) 1 0.1 Tc = 25 C Tj = 175 C Single Pulse 1msec msec 1 0 00 V DS, Drain-to-Source Voltage (V) Fig. 7 Typical Source-to-Drain Diode Forward Voltage Fig 8. Maximum Safe Operating Area 4 2017-09-25
I D, Drain Current (A) R DS(on), Drain-to-Source On Resistance (Normalized) AUIRFZ44Z/ZS 55 50 45 40 35 30 25 20 15 5 0 25 50 75 0 125 150 175 T C, Case Temperature ( C) 2.5 I D = 31A V GS = V 2.0 1.5 1.0 0.5-60 -40-20 0 20 40 60 80 0 120 140 160 180 T J, Junction Temperature ( C) Fig 9. Maximum Drain Current vs. Case Temperature Fig. Normalized On-Resistance vs. Temperature 1 D = 0.50 Thermal Response ( Z thjc ) 0.1 0.01 0.001 0.20 0. 0.05 0.02 0.01 R 1 R 2 R 3 R 1 R 2 R 3 J J 1 1 2 2 3 3 Ci= i Ri Ci= i Ri SINGLE PULSE ( THERMAL RESPONSE ) 0.3974 Notes: 0.01173 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 C C t 1, Rectangular Pulse Duration (sec) Ri ( C/W) i (sec) 0.8487 0.00044 0.6254 0.00221 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case 5 2017-09-25
V GS(th) Gate threshold Voltage (V) E AS, Single Pulse Avalanche Energy (mj) AUIRFZ44Z/ZS 15V V DS L DRIVER 400 R G 20V tp D.U.T I AS 0.01 + - V DD A 350 300 250 I D TOP 3.8A 5.5A BOTTOM 31A Fig 12a. Unclamped Inductive Test Circuit 200 tp V (BR)DSS 150 0 50 0 25 50 75 0 125 150 175 Starting T J, Junction Temperature ( C) I AS Fig 12b. Unclamped Inductive Waveforms Fig 12c. Maximum Avalanche Energy vs. Drain Current 4.0 Fig 13a. Gate Charge Test Circuit 3.0 I D = 250µA Vds Id Vgs 2.0 Vgs(th) 1.0-75 -50-25 0 25 50 75 0 125 150 175 200 T J, Temperature ( C ) Qgs1 Qgs2 Qgd Qgodr Fig 14. Threshold Voltage vs. Temperature Fig 13b. Gate Charge Waveform 6 2017-09-25
E AR, Avalanche Energy (mj) AUIRFZ44Z/ZS 0 Duty Cycle = Single Pulse Avalanche Current (A) 0.01 0.05 0. Allowed avalanche Current vs avalanche pulsewidth, tav assuming Tj = 25 C due to avalanche losses 1 0.1 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 tav (sec) Fig 15. Avalanche Current vs. Pulse width 0 80 60 40 20 TOP Single Pulse BOTTOM 1% Duty Cycle I D = 31A Notes on Repetitive Avalanche Curves, Figures 15, 16: (For further info, see AN-05 at www.infineon.com) 1. Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of Tjmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 12a, 12b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25 C in Figure 14, 15). tav = Average time in avalanche. D = Duty cycle in avalanche = tav f ZthJC(D, tav) = Transient thermal resistance, see Figures 13) 0 25 50 75 0 125 150 175 Starting T J, Junction Temperature ( C) P D (ave) = 1/2 ( 1.3 BV I av ) = T/ Z thjc I av = 2 T/ [1.3 BV Z th ] E AS (AR) = P D (ave) t av Fig 16. Maximum Avalanche Energy vs. Temperature 7 2017-09-25
AUIRFZ44Z/ZS Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET Power MOSFETs Fig 18a. Switching Time Test Circuit Fig 18b. Switching Time Waveforms 8 2017-09-25
AUIRFZ44Z/ZS TO-220AB Package Outline (Dimensions are shown in millimeters (inches)) TO-220AB Part Marking Information Part Number IR Logo AUFZ44Z YWWA XX XX Date Code Y= Year WW= Work Week Lot Code 9 2017-09-25
AUIRFZ44Z/ZS D 2 Pak (TO-263AB) Package Outline (Dimensions are shown in millimeters (inches)) D 2 Pak (TO-263AB) Part Marking Information Part Number IR Logo AUFZ44ZS YWWA XX XX Date Code Y= Year WW= Work Week Lot Code 2017-09-25
AUIRFZ44Z/ZS D 2 Pak (TO-263AB) Tape & Reel Information (Dimensions are shown in millimeters (inches)) TRR 1.60 (.063) 1.50 (.059) 4. (.161) 3.90 (.153) 1.60 (.063) 1.50 (.059) 0.368 (.0145) 0.342 (.0135) FEED DIRECTION TRL 1.85 (.073) 1.65 (.065) 11.60 (.457) 11.40 (.449) 15.42 (.609) 15.22 (.601) 24.30 (.957) 23.90 (.941).90 (.429).70 (.421) 16. (.634) 15.90 (.626) 1.75 (.069) 1.25 (.049) 4.72 (.136) 4.52 (.178) FEED DIRECTION 13.50 (.532) 12.80 (.504) 27.40 (1.079) 23.90 (.941) 4 330.00 (14.173) MAX. 60.00 (2.362) MIN. NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ HUB. 4. INCLUDES FLANGE DISTORTION @ OUTER EDGE. 26.40 (1.039) 24.40 (.961) 3 30.40 (1.197) MAX. 4 11 2017-09-25
AUIRFZ44Z/ZS Qualification Information Qualification Level Moisture Sensitivity Level Machine Model ESD Human Body Model Charged Device Model RoHS Compliant Automotive (per AEC-Q1) Comments: This part number(s) passed Automotive qualification. Infineon s Industrial and Consumer qualification level is granted by extension of the higher Automotive level. TO-220 Pak N/A D 2 -Pak MSL1 Class M2 (+/- 200V) AEC-Q1-002 Class H1A (+/- 500V) AEC-Q1-001 Class C5 (+/- 1125V) AEC-Q1-005 Yes Highest passing voltage. Revision History Date Updated datasheet with corporate template 12/4/2015 Corrected ordering table on page 1. Comments 09/25/17 Corrected typo error on part marking on pages 9,. Published by Infineon Technologies AG 81726 München, Germany Infineon Technologies AG 2015 All Rights Reserved. IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer s products and any use of the product of Infineon Technologies in customer s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 12 2017-09-25