Schottky Diode Array for Four Data Line ESD Protection The NUP432MR6 is designed to protect high speed data line interface from ESD, EFT and lighting. Features Very Low Forward Voltage Drop Fast Switching PN Junction Guard Ring for Transient and ESD Protection ESD Rating of Class 3B (Exceeding 6 kv) per Human Body Model and Class C (Exceeding 4 V) per Machine Model IEC 6 4 2 Level 4 ESD Protection Flammability Rating: UL 94 V Pb Free Package is Available I/O GND 2 /O 3 PIN CONFIGURATION AND SCHEMATIC 6 I/O 5 V CC 4 I/O Applications Ultra High Speed Switching USB. and 2. Power and Data Line Protection Digital Video Interface (DVI) Monitors and Flat Panel Displays CASE 38G STYLE 2 MARKING DIAGRAM 67 M 67 = Specific Device Code M = Date Code = Pb Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Device Package Shipping NUP432MR6T 3/Tape & Reel NUP432MR6TG (Pb Free) 3/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. Semiconductor Components Industries, LLC, 26 March, 26 Rev. 3 Publication Order Number: NUP432MR6/D
MAXIMUM RATINGS (T J = 25 C unless otherwise noted) Rating Symbol Value Unit Peak Reverse Breakdown Voltage V BR 3 V Forward Power Dissipation (T A = 25 C) P F 225 mw Forward Continuous Current I F 2 ma Junction Operating Temperature T J 55 to +25 C Storage Temperature Range T stg 55 to +5 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (T J = 25 C unless otherwise noted) Parameter Symbol Conditions Min Typ Max Unit Reverse Breakdown Voltage V BR I R = A 3 V Reverse Leakage I R V R = 25 V 3 A Forward Voltage V F I F =. madc.28 V Forward Voltage V F I F =. madc.35 V Forward Voltage V F I F = madc.45 V Forward Voltage V F I F = madc. V Total Capacitance C T V R = V, f =. MHz, I/O to Ground V R = V, f =. MHz, I/O to I/O Reverse Recovery Time t rr I F = I R = ma, I R(REC) =. ma (Figure ) 5. ns 28 8 pf 82 + V 2 k. F H I F. F t r t p t % I F t rr t 5 OUTPUT PULSE GENERATOR DUT 5 INPUT SAMPLING OSCILLOSCOPE V R 9% INPUT SIGNAL I R i R(REC) = ma OUTPUT PULSE (I F = I R = ma; measured at i R(REC) = ma) Notes:. A 2. k variable resistor adjusted for a Forward Current (I F ) of ma. Notes: 2. Input pulse is adjusted so I R(peak) is equal to ma. Notes: 3. t p» t rr Figure. Recovery Time Equivalent Test Circuit 2
, I F, FORWARD CURRENT (ma) T A = 25 C 25 C 85 C I R, REVERSE CURRENT ( A) T A = 25 C 85 C 25 C.2.4.6.8.. 5 5 2 25 3 V F, FORWARD VOLTAGE (VOLTS) V R, REVERSE VOLTAGE (VOLTS) Figure 2. Forward Current as a Function of Forward Voltage; Typical Values Figure 3. Reverse Current as a Function of Reverse Voltage; Typical Values C D, DIODE CAPACITANCE (pf) 4 35 3 25 2 5 5 f = MHz T A = 25 C 5 5 2 25 3 V R, REVERSE VOLTAGE (VOLTS) Figure 4. Diode Capacitance as a Function of Reverse Voltage; Typical Values 3
PACKAGE DIMENSIONS CASE 38G 2 ISSUE P H E 6 D 5 4 2 3 E NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS..5 (.2) e A b A L SOLDERING FOOTPRINT* c MILLIMETERS DIM MIN NOM MAX MIN A.9...35 A..6.. b.25.38.5. c..8.26.4 D 2.9 3. 3..4 E.3.5.7.5 e.85.95.5.34 INCHES NOM MAX.39.43.2.4.4.2.7..8.22.59.67.37.4 L.2.4.6.8.6.24 HE 2.5 2.75 3..99.8.8 STYLE 2: PIN. I/O 2. GROUND 3. I/O 4. I/O 5. VCC 6. I/O 2.4.94.9.75.95.37.95.37.7.28..39 SCALE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 632, Phoenix, Arizona 8582 32 USA Phone: 48 829 77 or 8 344 386 Toll Free USA/Canada Fax: 48 829 779 or 8 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 8 282 9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2 9 Kamimeguro, Meguro ku, Tokyo, Japan 53 5 Phone: 8 3 5773 385 4 ON Semiconductor Website: Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUP432MR6/D
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