Features. Description. AM15572v1. Table 1. Device summary. Order codes Marking Package Packaging. STD13N65M2 13N65M2 DPAK Tape and reel

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N-channel 650 V, 0.37 Ω typ., 10 A MDmesh M2 Power MOSFET in a DPAK package Features Datasheet production data TAB 2 3 1 DPAK Figure 1. Internal schematic diagram, TAB Order code V DS R DS(on) max I D STD13N65M2 650 V 0.43 Ω 10 A Extremely low gate charge Excellent output capacitance (C oss ) profile 100% avalanche tested Zener-protected Applications Switching applications Description This device is an N-channel Power MOSFET developed using MDmesh M2 technology. Thanks to its strip layout and an improved vertical structure, the device exhibits low on-resistance and optimized switching characteristics, rendering it suitable for the most demanding high efficiency converters. AM15572v1 Table 1. Device summary Order codes Marking Package Packaging STD13N65M2 13N65M2 DPAK Tape and reel December 2014 DocID027324 Rev 1 1/16 This is information on a product in full production. www.st.com

Contents STD13N65M2 Contents 1 Electrical ratings............................................ 3 2 Electrical characteristics..................................... 4 2.1 Electrical characteristics (curves)................................ 6 3 Test circuits.............................................. 8 4 Package mechanical data..................................... 9 5 Packaging mechanical data.................................. 13 2/16 DocID027324 Rev 1

Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V GS Gate-source voltage ± 25 V I D Drain current (continuous) at T C = 25 C 10 A I D Drain current (continuous) at T C = 100 C 6.3 A I (1) DM Drain current (pulsed) 40 A P TOT Total dissipation at T C = 25 C 110 W dv/dt (2) Peak diode recovery voltage slope 15 V/ns dv/dt (3) MOSFET dv/dt ruggedness 50 V/ns T stg Storage temperature - 55 to 150 T j Max. operating junction temperature 150 C 1. Pulse width limited by safe operating area. 2. I SD 10 A, di/dt 400 A/µs; V DS peak < V (BR)DSS, V DD =400 V. 3. V DS 520 V Table 3. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case max 1.14 C/W R thj-pcb Thermal resistance junction-pcb max (1) 50 C/W 1. When mounted on 1 inch² FR-4, 2 Oz copper board Table 4. Avalanche characteristics Symbol Parameter Value Unit I AR E AS Avalanche current, repetitive or not repetitive (pulse width limited by T jmax ) Single pulse avalanche energy (starting T j =25 C, I D =I AR ; V DD =50V) 1.8 A 350 mj DocID027324 Rev 1 3/16 16

Electrical characteristics STD13N65M2 2 Electrical characteristics (T C = 25 C unless otherwise specified) Table 5. On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS Drain-source breakdown voltage Zero gate voltage drain current V GS = 0 V, I D = 1 ma 650 V V GS = 0 V, V DS = 650 V 1 µa V GS = 0 V, V DS = 650 V, T C =125 C 100 µa I GSS Gate-body leakage current V DS = 0 V, V GS = ± 25 V ±10 µa V GS(th) Gate threshold voltage V DS = V GS, I D = 250 µa 2 3 4 V R DS(on) Static drain-source on-resistance V GS = 10 V, I D = 5 A 0.37 0.43 Ω Table 6. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 590 - pf C oss Output capacitance V GS = 0 V, V DS = 100 V, - 27.5 - pf C rss f = 1 MHz Reverse transfer capacitance - 1.1 - pf (1) Equivalent output C oss eq. capacitance V GS = 0 V, V DS = 0 to 520 V - 168.5 - pf R G Intrinsic gate resistance f = 1 MHz open drain - 6.5 - Ω Q g Total gate charge - 17 - nc Q gs Gate-source charge V DD = 520 V, I D = 10 A, V GS =10V (seefigure 15) - 3.3 - nc Q gd Gate-drain charge - 7 - nc 1. C oss eq. is defined as a constant equivalent capacitance giving the same charging time as C oss when V DS increases from 0 to 80% V DSS 4/16 DocID027324 Rev 1

Electrical characteristics Table 7. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time - 11 - ns t V DD = 325 V, I D = 5 A, r Rise time - 7.8 - ns R G =4.7Ω, V GS = 10 V t d(off) Turn-off delay time (see Figure 14 and 19) - 38 - ns t f Fall time - 12 - ns Table 8. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD Source-drain current - 10 A I (1) SDM Source-drain current (pulsed) - 40 A V (2) SD Forward on voltage V GS =0 V, I SD =10 A - 1.6 V t rr Reverse recovery time - 312 ns Q rr Reverse recovery charge I SD = 10 A, di/dt = 100 A/µs V DD =60V (seefigure 16) - 2.7 µc I RRM Reverse recovery current - 17.5 A t rr Reverse recovery time I SD = 10 A, di/dt = 100 A/µs - 464 ns Q rr Reverse recovery charge V DD = 60 V, T j = 150 C - 4.1 µc I RRM Reverse recovery current (see Figure 16) - 17.5 A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID027324 Rev 1 5/16 16

Electrical characteristics STD13N65M2 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Normalized gate threshold voltage vs. temperature Figure 7. Normalized V (BR)DSS vs. temperature 6/16 DocID027324 Rev 1

Electrical characteristics Figure 8. Static drain-source on-resistance Figure 9. Normalized on-resistance vs. temperature Figure 10. Gate charge vs. gate-source voltage Figure 11. Capacitance variations Figure 12. Output capacitance stored energy Figure 13. Source-drain diode forward characteristics DocID027324 Rev 1 7/16 16

Test circuits STD13N65M2 3 Test circuits Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit VGS VD RG RL D.U.T. 2200 μf 3.3 μf VDD PW AM01468v1 Figure 16. Test circuit for inductive load switching and diode recovery times Figure 17. Unclamped inductive load test circuit G 25 Ω D S A D.U.T. B A FAST DIODE B A B D L=100μH 3.3 1000 μf μf VDD VD ID L 2200 μf 3.3 μf VDD G RG S Vi D.U.T. AM01470v1 Pw AM01471v1 Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform 8/16 DocID027324 Rev 1

Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID027324 Rev 1 9/16 16

Package mechanical data STD13N65M2 Figure 20. DPAK (TO-252) type A drawing 10/16 DocID027324 Rev 1

Package mechanical data Table 9. DPAK (TO-252) type A mechanical data Dim. mm Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 5.10 E 6.40 6.60 E1 4.70 e 2.28 e1 4.40 4.60 H 9.35 10.10 L 1.00 1.50 L1 2.80 L2 0.80 L4 0.60 1.00 R 0.20 V2 0 8 DocID027324 Rev 1 11/16 16

Package mechanical data STD13N65M2 Figure 21. DPAK (TO-252) footprint (a) a. All dimensions are in millimeters 12/16 DocID027324 Rev 1

Packaging mechanical data 5 Packaging mechanical data Figure 22. TapeTape for DPAK (TO-252) DocID027324 Rev 1 13/16 16

Packaging mechanical data STD13N65M2 Figure 23. Reel for DPAK (TO-252) Table 10. DPAK (TO-252) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 Figure 24. Revision history 14/16 DocID027324 Rev 1

Packaging mechanical data Table 11. Document revision history Date Revision Changes 18-Dec-2014 1 First release. DocID027324 Rev 1 15/16 16

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