Qualcomm PM8921 (Die Markings HG11-N ) PMIC. Transistor Characterization of N and P-LDMOS Transistor Blocks

Similar documents
Qualcomm QFE1100 Envelope Tracking PA Power Supply

Marvell I1062-B0 Hard Drive Controller SoC

Samsung SDP1301 DTV SERDES Interface

MediaTek MT6167A Smartphone Radio Frequency (RF) Transceiver

Qualcomm MDM9235M 4G LTE Advanced Modem

Qualcomm APQ8084 Snapdragon 805 Application Processor

Qualcomm MSM8926 Snapdragon 400 Application Processor

Texas Instruments/Apple 343S0538 Touch Screen Controller with F Die Markings

Apple/Dialog Semiconductor 343S0622-A1/D2018A WLED Driver

Qualcomm Atheros AR8035 Ultra Low Power Single RGMII Gigabit Ethernet PHY

u-blox M8030-KT Concurrent Multi-GNSS Receiver

Marvell Avastar 88W ac Wi-Fi 2x2 MIMO Combo Chip

FocalTech Systems FT5336GQQ and FT5436iGQQ (FS-123ATPBC Die) Capacitive Touch Screen Controller

RDA Microelectronics RDA8851A GSM/GPRS Baseband SoC

MediaTek MT3333AV (BT10085B Die) Satellite Receiver SoC

Freescale MCIMX535DVV1C i.mx535 Mobile Applications Processor

Apple/Cirrus Logic 338S1081/46L01 Multi-Standard Audio Decoder

STMicroelectronics STMT05 S-Touch Capacitive Touch Screen Controller

Qualcomm MSM8260A Snapdragon S4 Dual-Core System-on-Chip (SoC) Mobile Applications Processor

Marvell 88E6046-TAH1 Four Port Fast Ethernet Plus Two Port Gigabit Ethernet Switch

Freescale MCIMX6Q5EYM10AC (i.mx6q) Integrated Multimedia Applications Processor

Fullhan FH8520 Image Signal Processor

FocalTech FT5316 Touch Screen Controller

Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator

FocalTech FT5206GE1 Capacitive Touch Screen Controller IC

Apple A5 APL0498 (APL0498E01 Die Markings) Mobile Processor Extracted from the ipad 2

Qualcomm MDM6600 Gobi Baseband Processor Plus RF Transceiver

SFARDS SF3301-FC481 Dual Crypto Mining ASIC STMicroelectronics 28 nm FD-SOI. Logic Transistor Characterization

Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process

Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor. Module 3: Planar Pixel Analysis

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis

Texas Instruments WL1283C WiLink 7.0 Single Chip WLAN, GPS, Bluetooth, and FM Transceiver

Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 4: Pixel Cross-Sectional Analysis

Qualcomm MDM9215M Gobi 4G GSM/CDMA Modem 28 nm LP. Module 2: CMOS FEOL Analysis

Maxim. MAX V Ultra-Precision Low Noise Op Amp. Circuit Analysis

Freescale SCK20DN51Z K20 USB MHz Microcontroller eflash. Flash Process Review

Rockchip RK3188 Mobile Application Processor GF 28 nm SLP Gate First HKMG CMOS Process

Atmel. MXT540E Touch Screen Controller. Circuit Analysis of Charge Integrator and I/O Blocks

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis

Intel Q3GM ES 32 nm CPU (from Core i5 660)

Broadcom BCM43224KMLG Baseband/MAC/Radio All-in-One Die SMIC 65 nm Process

Sony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera

Canon LC Mp, 4.3 µm Pixel Size, APS-C Format CMOS Image Sensor from the Canon EOS Rebel T4i (EOS 650D/EOS Kiss X6i)

Intel Xeon E3-1230V2 22 nm Tri-Gate Microprocessor

OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 3: Planar Pixel Analysis

MediaTek MT6592V Octa-Core HSPA+ Platform

AuthenTec AES1710 Secure Slide Fingerprint Sensor

Luxtera. PN Opto-Electronic Transceiver. Circuit Analysis of Transmitter and Receiver Blocks

Texas Instruments ISO7220A Capacitor Type Digital Isolator

Texas Instruments. SR5580CBA4 HDD Pre-Amplifier. Circuit Analysis of Hard Drive Write System

OmniVision OVM7692 (OV289AA Die Markings) VGA CameraCubeChip. Module 1: Overview Analysis

TLE7242-G 4 Channel Fixed Frequency Constant Current Control IC

Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera

Sony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000. Module 5: Substrate Dopant Analysis

Maxim Integrated. MAX88920 Gesture/Proximity Sensor. Analog Circuit Analysis

AMD ATI TSMC 28 nm Gate Last HKMG CMOS Process

Volterra VT1115MF PWM Controller Chip

Silicon Laboratories

IBM POWER7 Server 46J6702 IBM 45 nm Dual Stress Liner SOI CMOS Process with edram

Intel T2300 (Yonah 65 nm node) 1.66 GHz Dual Core Laptop Microprocessor Transistor Characterization Report

Freescale MCIMX357DVM5B 90 nm Multimedia Application Processor

Bosch Sensortec BMP180 Pressure Sensor

Texas Instruments. TPA2028D1 Class-D Audio Amplifier. Circuit Analysis of the Analog Functional Blocks

Intel D920 (Presler 65 nm node) 2.8 GHz Dual Core Microprocessor

Altera 5SGXEA7K2F40C2ES Stratix V TSMC 28 nm HP Gate Last HKMG CMOS Process

Analog Devices ADMP403 MEMS Microphone

Intel Xeon E3-1230V2 CPU Ivy Bridge Tri-Gate 22 nm Process

Samsung LTN097QL01-A01 Display Module with LED Backlit LCD and Capacitive Touch Screen

Texas Instruments Sitara XAM3715CBC Application Processor 45 nm UMC Low Power Process

PowerDsine/Freescale

SiTime SIT8002AC-13-18E50 One Time Programmable Oscillator

FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera

Sony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera

NVE IL715-3E GMR Type Digital Isolator (30457J Die Markings) 0.50 µm CMOS Process

Intel Q3GM ES 32 nm CPU (from Core i5 660)

Samsung K3PE7E700B-XXC1 3x nm 4 Gbit Mobile DRAM. DRAM Process Report with Custom BEOL and Dopant Analysis

MemsTech MSM3C-S4045 Integrated Silicon Microphone with Supplementary TEM Analysis

Trident. PNX1002EL400 Media Processor. Circuit Analysis of DDR1/DDR2 Memory Interface and DLLs

STMicroelectronics LIS3L02AE 3-Axis Accelerometer. MEMS Process Review

Microchip PIC18F4320-I/ML Enhanced Flash Microcontroller Structural Analysis

Texas Instruments BRF6350B Bluetooth Link Controller UMC 90 nm RF CMOS

Micron MT66R7072A10AB5ZZW 1 Gbit Phase Change Memory 45 nm BiCMOS PCM Process

Oki 2BM6143 Microcontroller Unit Extracted from Casio GW2500 Watch 0.25 µm CMOS Process

Akustica AKU2000 MEMS Microphone. MEMS Process Review

Sharp NC Megapixel CCD Imager Process Review

Elpida Memory Inc. B240ABB (die markings), MC77-LL/A (package markings) 46 nm Mobile / Low Power DDR2 SDRAM

Linear Technology. LTC3808EGN DC/DC Controller. Circuit Analysis

InvenSense ITG-3200 Three-Axis Digital Output Yaw, Pitch, and Roll Gyroscope

NXP. P5CC052 Secure Contact PKI Smart Card Controller. Analog Circuit Analysis

Silicon Storage Technology SST39VF800A 8 Mbit Multi-Purpose Flash Memory Structural Analysis

CMOSIS CMV Mp, 5.5 µm Pixel Pitch High-Speed Pipelined Global Shutter CMOS Image Sensor with Correlated Double Sampling

Sony. IMX Mp BSI CMOS Image Sensor

Analog Devices AD7658 Analog to Digital Converter icmos Process Technology Process Review

MEMSIC MMC3120M Tri-Axis Magnetic Sensor

Peregrine Semiconductor PE4268 SP6T RF UltraCMOS TM Switch Structural Analysis

Samsung K9F2G08U0M-YCB0 2Gbit NAND Flash Device Structural Analysis

Motorola PRF5P21240 RF Power MOSFET Structural Analysis

LSI Logic LSI53C1030 PCI-X to Dual Channel Ultra320 SCSI Controller 0.18 µm CMOS Process

Sony. IMX135 Exmor RS 13 Mp Stacked CMOS Image Sensor. Circuit Analysis of Row Control, Column Data Readout and Control, and Ramp Generator

Transcription:

Qualcomm PM8921 (Die Markings HG11-N1039-300) PMIC Transistor Characterization of N and P-LDMOS Transistor Blocks

2 Chipworks and the Chipworks logo are registered trademarks of TechInsights Inc. All copyright, proprietary, and intellectual property rights related to this report reside with TechInsights, except as, and only to the extent, expressly agreed otherwise in writing. The report is provided under license, exclusively for the use of the organization to which TechInsights has delivered the report and may only be used in accordance with the terms of the license set out in the agreement between TechInsights and that organization, or with the other express, prior written consent of TechInsights. If distribution of the report is permitted, TechInsights accreditation, including watermarks, must remain attached. The information contained in this report may describe technical innovations, which are the subject of patents held by third parties. The disclosure by TechInsights of any such information is in no form whatsoever an inducement to infringe any patent. TechInsights assumes no liability for patent infringement arising from the use of the information contained in this report. TCR-1403-903 26109CYSDW Revision: 1.0 Published: April 23, 2014

3 Table of Contents Phase 1 Design of Experiment Die Photograph at the Polysilicon Layer P and N-Type LDMOS Transistors of Interest P and N-Type LDMOS Transistors of Interest Detail Measure the LDMOS at the Metal 2 Layer Plan-View SEM Analysis of LDMOS Transistors N-LDMOS at the Metal Layer N-LDMOS at the Metal 2 Layer N-LDMOS at the Metal 1 Layer N-LDMOS at the Polysilicon Layer N-LDMOS at the Polysilicon Layer Detail N-LDMOS Cross Section P-LDMOS Blocks at the Metal 1 Layer P-LDMOS Array Corner at the Polysilicon Layer P-LDMOS Array Corner at the Metal 1 Layer P-LDMOS Array Corner at the Metal 2 Layer P-LDMOS Transistor Pair Cross Section Phase 2 Final Sample Preparation and Measurement Conditions N-LDMOS Sample Preparation N-LDMOS Test Area N-LDMOS IV Measurement Setup: S/D Breakdown, Id - Vg, Id - Vd (3.3 V) Phase 3 Summary of N-LDMOS Electrical Characterization Results N-LDMOS: Source/Drain Reverse Breakdown N-LDMOS: Id - Vg (Vdd = 3.3 V) N-LDMOS: Id - Vd (Vdd = 3.3 V) N-LDMOS IV Measurement Setup: Id - Vg, Id - Vd (Vdd = 6 V) N-LDMOS: IdVg 6 Vdd = V Failed N-LDMOS: Data Log of 6 V Failure N-LDMOS Transistor Characteristics Summary (Vdd = 3.3 V) Phase 2 P-LDMOS Sample Preparation P-LDMOS Test Area P-LDMOS IV Measurement Setup: S/D Breakdown, Id - Vg, Id - Vd (6 V, 9 V, and 12 V) Phase 3 Summary of P-LDMOS Electrical Characterization Results P-LDMOS: Source/Drain Reverse Breakdown P-LDMOS: Id - Vg (Vdd = -3.3 V) P-LDMOS: Id - Vd (Vdd = -3.3 V) P-LDMOS IV Measurement Setup: Id - Vg, Id - Vd (Vdd = -6.00 V) P-LDMOS: Id - Vg (Vdd = -6.0 V) P-LDMOS: Id - Vd (Vdd = -6.0 V) P-LDMOS IV Measurement Setup: Id - Vg, Id - Vd (Vdd = -9.00 V) P-LDMOS: Id - Vg (Vdd = -9.0 V) P-LDMOS: Id - Vd (Vdd = -9.0 V) PMOS IV Measurement Setup: Id - Vg, Id - Vd (Vdd = -12.00 V) P-LDMOS: Id - Vg (Vdd = -12.0 V) P-LDMOS: Id - Vd (Vdd = -12.0 V) P-LDMOS Transistor Characteristics Summary (Vdd = 12 V)

4 Table of Contents Continued Appendix: ICWorks Surveyor Images LDMOS Transistor Blocks ICWorks Surveyor Image N and P-LDMOS at the Metal 5 Layer ICWorks Surveyor Image N and P-LDMOS at the Metal 4 Layer ICWorks Surveyor Image N and P-LDMOS at the Metal 3 Layer ICWorks Surveyor Image N and P-LDMOS at the Metal 2 Layer ICWorks Surveyor Image N and P-LDMOS at the Metal 1 Layer ICWorks Surveyor Image N and P-LDMOS at the Polysilicon Layer ICWorks Surveyor Image N and P-LDMOS at the Polysilicon Layer Detail Statement of Measurement Uncertainty and Scope Variation About Chipworks

62 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at 1-613-829-0414 Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T 1-613-829-0414 F 1-613-829-0515 Web site: www.chipworks.com Email: info@chipworks.com Please send any feedback to feedback@chipworks.com