v.71 HMC5ST9 / 5ST9E Typical Applications The HMC5ST9 / HMC5ST9E is ideal forr: Cellular / PCS / 3G Fixed Wireless & WLAN CATV, Cable Modem & DBS Microwave Radio & Test Equipment IF & RF Applications Functional Diagram P1 Output Power: +22 m Gain: 22 Output IP3: +37 m Cascadable 5 Ohm I/Os Single Supply: +5V Industry Standard SOT9 Package General Description Electrical Specifications, Vs= 5V, Rbias= 1. Ohm, T A = +25 C The HMC5ST9 & HMC5ST9E are InGaP Heterojunction Bipolar Transistor (HBT) Gain Block MMIC SMT amplifi ers covering DC to 1 GHz. Packaged in an industry standard SOT9, the amplifi er can be used as a cascadable 5 Ohm RF or IF gain stage as well as a PA or LO driver with up to +26 m output power. The HMC5ST9(E) offers 22 of gain with a +37 m output IP3 at 25 MHz, and can operate directly from a +5V supply. The HMC5ST9(E) exhibits excellent gain and output power stability over temperature, while requiring a minimal number of external bias components. Parameter Min. Typ. Max. Units Gain DC -.25 GHz.25 -.5 GHz.5-1. GHz 1.5 15 22 21 17 Gain Variation Over Temperature DC - 1. GHz.5 / C Input Return Loss DC -.25 GHz.25 -.5 GHz.5-1. GHz 35 2 Output Return Loss DC -.5 GHz.5-1. GHz Reverse Isolation DC - 1. GHz 23 Output Power for 1 Compression (P1) Output Third Order Intercept (IP3) (Pout= m per tone, 1 MHz spacing) Features DC -.25 GHz.25 -.5 GHz.5-1. GHz DC -.25 GHz.25 -.5 GHz.5-1. GHz Noise Figure DC - 1. GHz 2. Supply Current (Icq) 11 ma 17.5 11 22 2.5 37 35 33 m m m m m m Note: Data taken with broadband bias tee on device output. - 16 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA Phone: 97-333 Fax: 97-3373 Order On-line at www.hittite.com Application Support: Phone: 97-333 or apps@hittite.com
v.71 HMC5ST9 / 5ST9E Broadband Gain & Return Loss RESPONSE () 25 2 15 1 5-1 -2-3 - S21 S11 S22.5 1 1.5 2 2.5 3 Input Return Loss vs. Temperature RETURN LOSS () Reverse Isolation vs. Temperature REVERSE ISOLATION () -1-2 -3 -.3.5. 1 1.3 1.5-1 -2-3 +5C -C +5C -C Gain vs. Temperature GAIN () 2 2 +5C -C.25.5.75 1 1.25 1.5 Output Return Loss vs. Temperature RETURN LOSS () -1-2 +5C -C.25.5.75 1 1.25 1.5 Noise Figure vs. Temperature NOISE FIGURE () 1 6 2 +5C -C.25.5.75 1 1.25 1.5.25.5.75 1 1.25 1.5 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA Phone: 97-333 Fax: 97-3373 Order On-line at www.hittite.com Application Support: Phone: 97-333 or apps@hittite.com - 17
v.71 HMC5ST9 / 5ST9E P1 vs. Temperature P1 (m) 26 2 22 2 1 1 1 6 2.3.5. 1 1.3 1.5 Output IP3 vs. Temperature IP3 (m) 5 35 3 25 +5C -C +5C -C 2.25.5.75 1 1.25 1.5 Vcc vs. Icc Over Temperature for Fixed Vs= 5V, RBIAS= 1. Ohms Icc (ma) 9 92 9 6 2 +5C 7.2.3..5.6.7 Vcc (V) -C Psat vs. Temperature Psat (m) 2 2 2 +5C -C.25.5.75 1 1.25 1.5 Gain, Power & OIP3 vs. Supply Voltage for Constant Icc = ma @ 5 MHz GAIN (), P1 (m), Psat (m), IP3 (m) ACPR vs. Channel Output Power ACPR (c) 36 32 2 2 2.5 5 5.5-2 -3-5 -6 Vs (V) WCDMA 1MHz WCDMA MHz CDMA2 1MHz CDMA2 MHz Gain P1 Psat IP3-65 2 6 1 1 1 CHANNEL OUTPUT POWER (m) - 1 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA Phone: 97-333 Fax: 97-3373 Order On-line at www.hittite.com Application Support: Phone: 97-333 or apps@hittite.com
v.71 HMC5ST9 / 5ST9E Absolute Maximum Ratings Collector Bias Voltage (Vcc) Outline Drawing +5.5 Vdc RF Input Power (RFIN)(Vcc = +.2 Vdc) +1 m Junction Temperature 15 C Continuous Pdiss (T = 5 C) (derate 9 mw/ C above 5 C).59 W Thermal Resistance (junction to lead) 11 C/W Storage Temperature -65 to +15 C Operating Temperature - to +5 C ESD Sensitivity (HMB) Class 1C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-1S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 1% MATTE TIN.. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H5 HMC5ST9 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H5 HMC5ST9E RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 C [2] Max peak refl ow temperature of 26 C [3] -Digit lot number XXXX For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA Phone: 97-333 Fax: 97-3373 Order On-line at www.hittite.com Application Support: Phone: 97-333 or apps@hittite.com -
v.71 HMC5ST9 / 5ST9E Pin Descriptions Pin Number Function Description Interface Schematic 1 IN Application Circuit Recommended Bias Resistor Values for Icc = ma, Rbias = (Vs - Vcc) / Icc, Vs > +5V Supply Voltage (Vs) 6V V RBIAS VALUE 13 Ω 36 Ω RBIAS POWER RATING ¼ W ½ W This pin is DC coupled. An off chip DC blocking capacitor is required. 3 OUT RF output and DC Bias (Vcc) for the output stage. 2, GND These pins and package bottom must be connected to RF/DC ground. Note: 1. External blocking capacitors are required on RFIN and RFOUT. 2. RBIAS provides DC bias stability over temperature. Recommended Component Values for Key Application Frequencies with Vs = +5V Frequency (MHz) Component 5 25 9 L1 27 nh 11 nh 11 nh 56 nh C1, C2.1 μf 2 pf 2 pf 1 pf Rbias Ohms 1.5 Ohms 1.5 Ohms 1. Ohms - 15 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA Phone: 97-333 Fax: 97-3373 Order On-line at www.hittite.com Application Support: Phone: 97-333 or apps@hittite.com
v.71 HMC5ST9 / 5ST9E Evaluation PCB List of Materials for Evaluation PCB 12 [1] Item J1 - J2 J3 - J Description PCB Mount SMA Connector DC Pin C1, C2 Capacitor, 2 Pkg. C3 C C5 R1 L1 U1 PCB [2] 1 pf Capacitor, 2 Pkg. 1 pf Capacitor, 63 Pkg. 2.2 μf Capacitor, Tantalum Resistor, 6 Pkg. Inductor, 63 Pkg. HMC5ST9 / HMC5ST9E 1736 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 35 [3] Evaluation board tuned for 9 MHz operation The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 5 Ohm impedance while the package ground leads and package bottom should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request. For price, delivery and to place orders: Hittite Microwave Corporation, 2 Alpha Road, Chelmsford, MA Phone: 97-333 Fax: 97-3373 Order On-line at www.hittite.com Application Support: Phone: 97-333 or apps@hittite.com - 151