3V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER

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3V, SUPER MINIMOLD MEDIUM POWER SI MMIC AMPLIFIER UPC277TB FEATURES HIGH GAIN: 2 db at 9 to MHz Typical HIGH OUTPUT POWER: PSAT = +2. dbm at 9 MHz + dbm at MHz LOW BIAS VOLTAGE: 3. V Typical, 2.7 V Minimum SUPER SMALL PACKAGE: SOT-33 TAPE AND REEL PACKAGING OPTION AVAILABLE DESCRIPTION NEC's UPC277TB is a Silicon Monolithic integrated circuit which is manufactured using the NESAT III process. The NESAT III process produces transistors with ft approaching 2 GHz. The UPC277TB is pin compatible and has comparable performance as the larger UPC277T, so it is suitable for use as a replacement to help reduce system size. The IC is housed in a pin super minimold or SOT-33 package. Operating on a 3 volt supply, this IC is ideally suited for hand-held, portable designs. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. Gain, GS (db) GAIN vs. FREQUENCY AND TEMPERATURE 2 22 2 8 TA = +2 C TA = +8 C..3. 3. TA = - C +2 C - C +8 C ELECTRICAL CHARACTERISTICS (TA = 2 C, ZL = ZS = Ω, ) PART NUMBER UPC277TB PACKAGE OUTLINE S SYMBOLS PARAMETERS AND CONDITIONS UNITS MIN TYP MAX ICC Circuit Current (no signal) ma 3 GS Small Signal Gain, f = 9 MHz db 9 2 2 f = MHz db 8 2 2 fu Upper Limit Operating Frequency (The gain at fu is 3 db down from the gain at MHz) GHz.8 2.2 PdB db Compressed Output Power, f = 9 MHz dbm +9 +. f = MHz dbm +7 +9. PSAT Saturated Output Power, f = 9 MHz dbm +2. f = MHz dbm + NF Noise Figure, f = 9 MHz db 7. f = MHz db 7. RLIN Input Return Loss, f = 9 MHz db f = MHz db RLOUT Output Return Loss, f = 9 MHz db. 9. f = MHz db. 8. ISOL Isolation, f = 9 MHz db 2 3 f = MHz db 2 3 OIP3 SSB OutputThird Order Intercept Point f = 9, 92 MHz, POUT = + dbm dbm +3 f =, 2 MHz, POUT = + dbm dbm + PADJ Adjacent Channel Power, f = 9 mhz, π/ QPSK wave, POUT = +7 dbm f = ± khz dbc - f = ± khz dbc -72 PADJ2 Adjacent Channel Power 2, f =. GHz, π/ QPSK wave, POUT = +7 dbm f = ± khz dbc 9 f = ± khz dbc -72 Note:.π/ QPSK modulated wave input, data rate 2 kbps, Filter roll off α =. California Eastern Laboratories

ABSOLUTE MAXIMUM RATINGS (TA = 2 C) TEST CIRCUIT SYMBOLS PARAMETERS UNITS RATINGS VCC Supply Voltage V 3. ICC Total Supply Current ma 77.7 pf VCC PIN Input Power dbm +3 PT Total Power Dissipation 2 mw 2 L= nh TOP Operating Temperature C - to +8 TSTG Storage Temperature C to Notes:. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on a X X. mm epoxy glass PWB (TA = 8 C). Ω IN pf pf Ω OUT RECOMMENDED OPERATING CONDITIONS 2, 3, SYMBOLS PARAMETERS UNITS MIN TYP MAX VCC Supply Voltage V 2.7 3 3.3 TOP Operating Temperature C - +2 +8 TYPICAL PERFORMANCE CURVES (TA = 2 C) CIRCUIT CURRENT vs. VOLTAGE CIRCUIT CURRENT vs. TEMPERATURE Circuit Current, ICC (ma) 3 2 Circuit Current, ICC (ma) 3 2 2 3 - - -2 2 8 Supply Voltage, VCC (V) Temperature ( C) GAIN AND NOISE FIGURE vs. FREQUENCY AND VOLTAGE INSERTION POWER GAIN vs. FREQUENCY AND TEMPERATURE Gain, GS (db) 2 22 2 8 2 8 VCC = 2.7V VCC = 3.V VCC = 3.3V VCC = 3.3V NF GS..3. 3. 7 3 Noise Figure, NF (db) Insertion Power Gain, GP (db) 2 22 2 8 TA = - C..3. 3.

TYPICAL PERFORMANCE CURVES (TA = 2 ) INPUT RETURN LOSS AND OUTPUT RETURN LOSS vs. FREQUENCY ISOLATION vs. FREQUENCY VCC = 3.V Return Loss (db) - -2 RLOUT RLIN Isolation, ISOL (db) - -2-3 -3 - -..3. 3...3. 3. f =.9 GHz INPUT POWER AND TEMPERATURE f =.9 GHz + TA = - C TA = - C -2-2 - - -2-2 - - INPUT POWER AND TEMPERATURE f =. GHz f =. GHz + + TA = - C TA = - C - -2-2 - - -2-2 - -

+ f =.9 GHz + f =.9 GHz TA = - C - -2-2 - - - -2-2 - - SATURATED FREQUENCY AND VOLTAGE SATURATED FREQUENCY AND TEMPERATURE Saturated Output Power, PO(SAT) (dbm) +7 +3 + +9 +7 PIN = -3 dbm..3. 3. Saturated Output Power, PO(SAT) (dbm) +7 +3 + +9 +7 TA = 2 C TA = - C PIN = -3 dbm TA = 8 C..3. 3. Third Order Intermodulation Distortion, IM3 (dbc) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE - - -3-2 - f =.9 GHz f2 =.92 GHz - - + Output Power of Each Tone, PO(each) (dbm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE AND VOLTAGE Third Order Intermodulation Distortion, IM3 (dbc) - - -3-2 - f =. GHz f2 =.2 GHz - - + Output Power of Each Tone, PO(each) (dbm)

TYPICAL SCATTERING PARAMETERS (TA = 2 C) S Frequency S22 Frequency 3. GHz 3. GHz. GHz 2. GHz 2. GHz. GHz VCC = VOUT = 3. V, ICC = 3 ma FREQUENCY S S2 S2 S22 K GHz MAG ANG MAG ANG MAG ANG MAG ANG.. 9.7.7 -.7.28.8.327 -.2..2.7 37..38-9..28..32 -..3.3.7.3.77 -..29 8..323 -.2.8..9 3.3. -9..3..32-2.9.9.. 2.2.27-2..3.9.33-2....8.2.8-3..3.8.32-32..37.7.38 3.9 2. -3.9.3 9.8.3-37.3.29.8.3 32. 2.37-2..32 2..39-2.8.2.9.8 29. 2.8-8.8.32 23.2.3-9....22 2.3 3.3..32 23.9.37....29 2.7 3.77 -..33 2.9.389-2..3.2.233..82-73..33 2.. -9.3.99.3.22 8..3-83.2.3 28.8. -7..92..27 -..33-92..3 3..2-83..9..28 -.8.2-2..3 32.. -9..9..293-3.9 3.929-2..37 3..3-99.3.89.7.3-2.9 3.28-2..39 32.. -.8.88.8.29-28. 2.722-3..38 3.7. -3.7.9.9.28-3.3.9-39..38 3..387-2.8.3 2..273 -.8.232-7..38 37..378-27..9 2..27-7.. -.8.39 39..3-33.. 2.2.2. 9.8 -.7...3-38..2 2.3.237 7. 9.8-8.. 3.7.32-2.8.28 2..22 -. 8.7-73.7. 8.3.32-8.3.37 2..22-8.8 7.97-79.7.2 8.3.322-2.. 2..28-72.2 7.7 7.9.3.8.3 -.7.9 2.7.22-7. 7. 7.. 3.7.39 -..3 2.8.9-7.3.7.7.7.2.33 -.. 2.9.78-7.7.33.7. 7.7.292-7.8. 3.. -82.3.3....287-72.8.2 3..7-88..772.3. 9.3.279-7..

OUTLINE DIMENSIONS (Units in mm) UPC277TB PACKAGE OUTLINE S LEAD CONNECTIONS (Top View) (Bottom View) 2.±..2±. 3 3 2.±.2. 3.2 +. - 2 C2H 2.3. 2.9 ±..7 ~. DOT ON BACK SIDE. +. -.. INPUT 2. GND 3. GND. OUTPUT. GND. VCC PIN DESCRIPTION Pin Pin Applied Description Internal No. Name Voltage Equivalent (V) Circuit Input Signal input pin. An internal matching circuit, configured with resistors, enables Ω connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of hfe and resistance. This pin must be coupled to the signal source with a blocking capacitor. Output Signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. VCC 2.7 to 3.3 Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. 2 GND Ground pins. These pins should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. 3 2 ORDERING INFORMATION PART NUMBER QTY -22 UPC277TB-E3-A 3K/Reel Note: Embossed Tape, 8 mm wide. Pins, 2 and 3 face perforated side of tape. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES Headquarters 9 Patrick Henry Drive Santa Clara, CA 9-87 (8) 988-3 Telex 3-393 FAX (8) 988-279 2-Hour Fax-On-Demand: 8-39-3232 (U.S. and Canada only) Internet: http://www.cel.com DATA SUBJECT TO CHANGE WITHOUT NOTICE 7/2/2

9 Patrick Henry Drive Santa Clara, CA 9-87 Telephone: (8) 99-2 Facsimile: (8) 988-279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 22/9/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 23//EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix A indicates that the device is Pb-free. The AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Concentration Limit per RoHS (values are not yet fixed) < PPM Concentration contained in CEL devices -A -AZ Not Detected (*) Mercury < PPM Not Detected Cadmium < PPM Not Detected Hexavalent Chromium < PPM Not Detected PBB < PPM Not Detected PBDE < PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability. -23