FGH12040WD 1200 V, 40 A Field Stop Trench IGBT

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FGH12040WD 1200 V, 40 A Field Stop Trench IGBT Features Maximum Junction Temperature : T J = 175 o C Positive Temperature Co-efficient for Easy Parallel Operating Low Saturation Voltage: V CE(sat) = 2.3 V ( Typ.) @ I C = 40 A 100% of The Parts Tested for I (1) LM Short Circuit Ruggedness > 5 us @ 150 o C High Input Impedance RoHS Compliant G C E TO-247 long leads General Description Using novel field stop IGBT technology, ON Semiconductor s new series of field stop 2 nd generation IGBTs offer the optimum performance for welder applications where low conduction and switching losses are essential. Applications Only for Welder G C E Absolute Maximum Ratings Symbol Description FGH12040WD-F155 Unit V CES Collector to Emitter Voltage 1200 V V GES Gate to Emitter Voltage ±25 V Transient Gate to Emitter Voltage ±30 V I C Collector Current @ T C = 25 o C 80 A Collector Current @ T C = 100 o C 40 A I LM (1) Clamped Inductive Load Current @ T C = 25 o C 100 A I CM (2) Pulsed Collector Current 100 A I F Diode Continuous Forward Current @ T C = 25 o C 80 A Diode Continuous Forward Current @ T C = 100 o C 40 A I FM (2) Diode Maximum Forward Current 100 A SCWT (3) Short Circuit Withstand Time, @ T C = 150 o C 5 us P D Maximum Power Dissipation @ T C = 25 o C 428 W Maximum Power Dissipation @ T C = 100 o C 214 W T J Operating Junction Temperature -55 to +175 T stg Storage Temperature Range -55 to +175 T L Maximum Lead Temp. for soldering Purposes, 1/8 from case for 5 seconds T C = 25 C unless otherwise noted 300 o C o C o C Notes: 1. V CC = 600 V, V GE = 15 V, I C = 100 A, R G = 23 Inductive Load 2. Repetitive rating : Pulse width limited by max, junction temperature 3. V CC = 600 V, V GE = 12 V 2014 Semiconductor Components Industries, LLC. September-2017, Rev. 3 Publication Order Number: FGH12040WD-F155/D

Thermal Characteristics Symbol Parameter FGH12040WD-F155 Unit R JC (IGBT) Thermal Resistance, Junction to Case 0.35 o C/W R JC (Diode) Thermal Resistance, Junction to Case 1.4 o C/W R JA Thermal Resistance, Junction to Ambient 40 o C/W Package Marking and Ordering Information Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity FGH12040WD-F155 FGH12040WD TO-247 G03 Tube - - 30 Electrical Characteristics of the IGBT T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics BV CES Collector to Emitter Breakdown Voltage V GE = 0 V, I C = 250 ua 1200 - - V BV CES / Temperature Coefficient of Breakdown V GE = 0 V, I C = 250 ua T J Voltage - 1.2 - V/ o C I CES Collector Cut-Off Current V CE = V CES, V GE = 0 V - - 250 ua I GES G-E Leakage Current V GE = V GES, V CE = 0 V - - ±400 na On Characteristics V GE(th) G-E Threshold Voltage I C = 40 ma, V CE = V GE 4.8 6.4 8.0 V I = 40 A, V = 15 V C GE T C = 25 o C - 2.3 2.9 V V CE(sat) Collector to Emitter Saturation Voltage I C = 40 A, V GE = 15 V, T C = 175 o C - 2.7 - V Dynamic Characteristics C ies Input Capacitance - 2800 - pf C oes Output Capacitance V CE = 30 V, V GE = 0 V, f = 1MHz - 105 - pf C res Reverse Transfer Capacitance - 60 - pf Switching Characteristics t d(on) Turn-On Delay Time - 45 - ns t r Rise Time - 70 - ns t d(off) Turn-Off Delay Time V CC = 600 V, I C = 40 A, - 560 - ns t f Fall Time R G = 23, V GE = 15 V, - 15 - ns E on Turn-On Switching Loss Inductive Load, T C = 25 o C - 4.1 - mj E off Turn-Off Switching Loss - 1.0 - mj E ts Total Switching Loss - 5.1 - mj t d(on) Turn-On Delay Time - 43 - ns t r Rise Time - 73 - ns t d(off) Turn-Off Delay Time V CC = 600 V, I C = 40 A, - 572 - ns t f Fall Time R G = 23, V GE = 15 V, - 58 - ns E on Turn-On Switching Loss Inductive Load, T C = 175 o C - 6.9 - mj E off Turn-Off Switching Loss - 1.9 - mj E ts Total Switching Loss - 8.8 - mj 2

Electrical Characteristics of the IGBT (continued) Symbol Parameter Test Conditions Min. Typ. Max. Unit Q g Total Gate Charge - 226 - nc Q V CE = 600 V, I C = 40 A, ge Gate to Emitter Charge - 18 - nc V GE = 15 V Q gc Gate to Collector Charge - 155 - nc Electrical Characteristics of the DIODE T C = 25 C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Unit V FM Diode Forward Voltage I F = 40 A, T C = 25 o C - 3.6 4.7 V I F = 40 A, T C = 175 o C - 2.9 - V t rr Diode Reverse Recovery Time - 71 - ns I rr Diode Peak Reverse Recovery Current V R = 600 V, I F = 40 A, di F /dt = 200 A/us, T C = 25 o C - 6.8 - A Q rr Diode Reverse Recovery Charge - 242 - nc E rec Reverse Recovery Energy - 690 - uj t rr Diode Reverse Recovery Time V R = 600 V, I F = 40A, di F /dt = 200 A/us, T C = 175 o C - 500 - ns I rr Diode Peak Reverse Recovery Current - 17 - A Q rr Diode Reverse Recovery Charge - 4250 - nc 3

Typical Performance Characteristics Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics Figure 3. Typical Saturation Voltage Figure 4. Saturation Voltage vs. Case Characteristics Temperature at Variant Current Level Figure 5. Saturation Voltage vs. V GE Figure 6. Saturation Voltage vs. V GE 4

Typical Performance Characteristics Figure 7. Capacitance Characteristics Figure 9. Turn-on Characteristics vs. Gate Resistance Figure 8. Gate Charge Characteristics Figure 10. Turn-off Characteristics vs. Gate Resistance Figure 11. Swithcing Loss vs. Gate Resistance Figure 12. Turn-on Characteristics vs. Collector Current 5

Typical Performance Characteristics Figure 13. Turn-off Characteristics vs. Figure 14. Swithcing Loss vs. Collector Current Collector Current Figure 15. Load Current vs. Frequency Figure 16. SOA Characteristics Figure 17. Forward Characteristics Figure 18. Reverse Recovery Current 6

Typical Performance Characteristics Figure 19. Reverse Recovery Time Figure 20. Stored Charge Figure 21. Transient Thermal Impedance of IGBT P DM t 1 t 2 Figure 22. Transient Thermal Impedance of Diode P DM t 1 t 2 7

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