TriQuint SCM6M7010 WiMAX Dual-Band WiFi Front-End Module TriQuint TQPED 0.5 µm E-D phemt Process Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Process Summary 2 Device Overview 2.1 Downstream Product 2.2 Package and Die 3 Package Analysis 3.1 Package 4 Process 4.1 General Structure 4.2 Bond Pads 4.3 Dielectrics 4.4 Routing Metals 4.5 Vias and Contacts 4.6 Epi and Substrate 4.7 Capacitors 4.8 Resistors 4.9 Inductors 4.10 ESD Diodes 4.11 Through Die Via 4.12 Transistors 4.13 Undetermined Devices 5 Critical Dimensions 5.1 Package and Die 5.2 Vertical Dimensions 5.3 Horizontal Dimensions 6 References 7 Statement of Measurement Uncertainty and Scope Variation Report Evaluation
Overview 1-1 1 Overview 1.1 List of Figures 2 Device Overview 2.1.1 Intel WiMAX/WiFi Card Top View 2.1.2 Intel WiMAX/WiFi Board Top View 2.1.3 Intel WiMAX/WiFi Board Bottom View 2.2.1 Package Photograph Top View 2.2.2 Package Photograph Bottom View 2.2.3 Inside Package Plan View 2.2.4 Package X-Ray Plan View 2.2.5 Package X-Ray Detailed Plan View 2.2.6 Die Photograph 2.2.7 Die Markings 2.2.8 Die Photograph Delayered to Metal 1 2.2.9 Annotated Die Photograph 2.2.10 Die Bottom Left Corner 2.2.11 Die Top Right Corner 2.2.12 Minimum Pitch Bond Pads 2.2.13 Bond Pad 2.2.14 TDV Pad 3 Package Analysis 3.1.1 SCM6M7010 Package Cross Section 3.1.2 PWB and Die Cross Section SEM 3.1.3 PWB and Die Cross Section Optical 3.1.4 Stitch Bond 3.1.5 Solder Ball 3.1.6 Edge of Solder Ball Detail 3.1.7 Die Bond 3.1.8 Diplexer 3.1.9 SMT Capacitor 4 Process 4.1.1 General Structure 4.1.2 Die Edge and Seal Tilt View 4.1.3 Die Edge 4.1.4 Die Edge Seal Along its Length Optical 4.1.5 Left Die Edge Seal Along its Length SEM 4.1.6 Die Edge Seal Detail Length Direction 4.1.7 Right Die Edge Seal Width Direction 4.2.1 Bond Pad Optical 4.2.2 Bond Pad SEM 4.2.3 Left Edge of Bond Pad
Overview 1-2 4.3.1 Dielectrics General Structure 4.3.2 ILD 0 Detail SEM 4.3.3 ILD 0 Detail TEM 4.3.4 PMD Detail 4.4.1 Minimum Pitch Metal 2 4.4.2 Metal 2 4.4.3 Minimum Pitch Metal 1 4.4.4 Metal 1 4.4.5 Minimum Pitch Metal 0 Optical 4.4.6 Minimum Pitch Metal 0 SEM 4.4.7 MIM Metal and Metal 0 4.5.1 Minimum Pitch Via 1 4.5.2 Minimum Pitch Via 0 Contacting M0 4.5.3 Minimum Pitch Via 0 Contacting MIM Metal 4.5.4 Minimum Pitch Schottky Contacts 4.5.5 Schottky Contact 4.5.6 Minimum Pitch Ohmic Contacts and Contacted Gates 4.5.7 Ohmic Contact SEM 4.5.8 Ohmic Contact Detail TEM 4.5.9 Minimum Pitch Gate 4.6.1 Cross-Sectional Epi Layer Block Diagram 4.6.2 Epi Stack SEM 4.6.3 GaAs Substrate Orientation 45 Cleave 4.6.4 Epi Stack TEM 4.7.1 MIM Capacitors Plan View 4.7.2 MIM Capacitor Cross-Sectional Overview 4.7.3 Contact to MIM Capacitor Top Plate 4.7.4 MIM Capacitor Detail SEM 4.7.5 MIM Capacitor Detail TEM 4.8.1 NiCr Resistors Plan View 4.8.2 NiCr Resistors Plan View Delayered to Metal 1 4.8.3 NiCr Resistors Cross Section SEM 4.8.4 NiCr Resistor Cross Section TEM 4.8.5 NiCr Resistor Detail 4.8.6 NiCr Resistor Edge 4.8.7 Epi Resistor Plan View 4.8.8 Epi Resistor Tilt View 4.9.1 Inductor with Narrow Coil 4.9.2 Inductor with Broader Coil 4.9.3 Type A Coil Inductor Cross Section Overview 4.9.4 Type B Coil Inductor Cross Section Overview 4.9.5 Type B Coil Inductor Cross Section Detail
Overview 1-3 4.10.1 ESD Diode Plan View Delayered to Metal 1 4.10.2 ESD Diode Cross Section Overview 4.10.3 ESD Diode Cross Section Detail 4.10.4 ESD Diode Schottky Contact Detail 4.10.5 ESD Diode Cross Section Longer Ohmic to Schottky Contact Separation 4.11.1 Through Die Via Optical 4.11.2 Through Die Via SEM 4.11.3 Through Die Via Top 4.11.4 Through Die Via Bottom 4.11.5 TDV Connected to MIM Capacitor 4.11.6 TDV Detail Optical 4.11.7 TDV Top Detail TEM 4.11.8 TDV Top Edge and Ohmic Contact TEM 4.11.9 TDV Ohmic Contact Detail 4.12.1 E-Mode FETs (FET 1) Delayered to Metal 1 Optical Plan View 4.12.2 E-Mode FETs (FET 1) Delayered to Metal 1 SEM Plan View 4.12.3 Metal Gate Edge of E-Mode FET (FET 1) Detail SEM Plan View 4.12.4 E-Mode FET (FET 1) Cross Section SEM 4.12.5 E-Mode FET (FET 1) Cross Section TEM 4.12.6 E-Mode FET (FET 1) Source/Drain Contact TEM 4.12.7 Single E-Mode FET (FET 1) TEM 4.12.8 E-Mode FET (FET 1) Metal Gate TEM 4.12.9 E-Mode FET (FET 1) Metal Gate Detail TEM 4.12.10 E-Mode FET (FET 1) Metal Gate Pt/AlGaAs Schottky Layer Interface 4.12.11 SCM of E-Mode FET 4.12.12 Trigate D-Mode FETs With Slot S/D Contacts 4.12.13 Trigate D-Mode FETs with Slot S/D Contacts Delayered to Metal 1 SEM Plan View 4.12.14 Trigate D-Mode FETs with Slot S/D Contacts Delayered to Metal 1 Tilt View 4.12.15 SEM Cross Section of Trigate D-Mode FET with Slot S/D Contacts 4.12.16 Single D-Mode Gate (with Slot S/D Contacts) Detail 4.12.17 Trigate D-Mode FETs (FET 2) with Point S/D Contacts Plan View 4.12.18 D-Mode FETs (FET 2) with Point S/D Contacts Delayered to Metal 1 Plan View 4.12.19 Trigate D-Mode FETs with Slot S/D Contacts Delayered to Metal 1 Tilt View 4.12.20 D-Mode FET Metal Gate Overview TEM 4.12.21 D-Mode FET Metal Gate Detail 1 TEM 4.12.22 D-Mode FET Metal Gate Detail 2 TEM 4.13.1 Undetermined Three Terminal Device 4.13.2 Dual Gate Structure Detailed Tilt View 4.13.3 FET with Gate Shorted to One Terminal 4.13.4 Wide and Narrow Striped Structures
Overview 1-4 1.2 List of Tables 1 Overview 1.5.1 Device Summary 1.6.1 Summary of Major Findings 2 Device Overview 2.2.1 Package and Die Dimensions 4 Process 4.3.1 Dielectric Composition and Thicknesses 4.4.1 Metallization Composition and Thicknesses 4.4.2 Minimum Metals Horizontal Dimensions 4.5.1 Via and Contact Horizontal Dimensions 4.6.1 Epi and Die Vertical Dimensions 4.6.2 Desired Epi Layer Composition 5 Critical Dimensions 5.1.1 Package and Die Dimensions 5.2.1 Dielectric Composition and Thicknesses 5.2.2 Metallization Composition and Thicknesses 5.2.3 Epi, and Die Vertical Dimensions 5.3.1 Minimum Metals Horizontal Dimensions 5.3.2 Via and Contact Horizontal Dimensions
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