Reliability of Solder Joint Quality on J-Lead Oscillators Using HALT with Lead and Lead Free Compositions

Similar documents
Copyright International Microelectronics & Packaging Society (IMAPS), MASH Proceedings Baltimore, MD, May 7-10, 2007

Reliability Testing of MWD Assemblies Developing a Standard

Challenges of Evolving Technology in the Workplace. Tips. Bubba Powers. Board Density. Best Rework Soldering Practices. Power. Substrates.

50W TO220 High Power Resistors

Q-TECH CORPORATION khz QT381 AND QT386 SERIES ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.

AN5046 Application note

Cal-Chip Electronics, Inc.

Assembly Instructions for SCA6x0 and SCA10x0 series

MELF Coated Thin Film Precision Resistors (MELFC Series)

Flight Model (FM) Lot Acceptance Test Model (LAT) Quartz Crystal. Synthetic HiQ Quartz, SC-cut, HC-35/U 4-point

Assembly Instructions for SCC1XX0 series

WIRE WOUND CHIP INDUCTORS SWI SERIES

WIRE WOUND CHIP INDUCTORS SWI SERIES

WIRE WOUND CHIP INDUCTORS SWI SERIES

DATA SHEET CURRENT SENSOR - LOW TCR PA0402 series 5%, 1% sizes 0402

TECHNICAL INFORMATION S3X 60NH

Lead Finish: T = Standard S = Solder Dip (**) Package Type: 0 = DIP-14 1 = SMD 2 = Gull Wing Supply Voltage: 3 = +3.3V 5 = +5.0V

DATA SHEET CURRENT SENSOR - LOW TCR PA0603 series 5%, 1% sizes 0603

TECHNICAL INFORMATION S03X7C-56M

TECHNICAL INFORMATION. S03X7Ca-56M

Thermal Cycling and Fatigue

DATA SHEET CURRENT SENSOR - LOW TCR AUTOMOTIVE GRADE PA_E series 5%, 1%, 0.5% sizes 2512

Q-TECH CORPORATION. Description. Features. Applications

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

!"#$%&'()'*"+,+$&#' ' '

High Voltage Thick Film Chip Resistors Product Specification

Application Note 5026

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

Table 1: Pb-free solder alloys of the SnAgCu family

SMTA Great Lakes Chapter Meeting

MINI-CIRCUITS AD FAMILY CUSTOMER SOLDERING OF MATTE TIN PLATING

Recommended Attachment Techniques for ATC Multilayer Chip Capacitors

SMT Assembly Considerations for LGA Package

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

PKF series. General information. PKF series

Data Sheet. HLMP-KA45 T-1 (3 mm) High Intensity InGaN Lamp. Description. Features. Applications. Package Dimensions

Precision Thin Film Chip Resistor Array

VFH2321-VFH2324 VFH2421-VFH2424 XO Hi-REL, 1.8V 5x7mm SMD, HCMOS

Technology Development & Integration Challenges for Lead Free Implementation. Vijay Wakharkar. Assembly Technology Development Intel Corporation

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

Data Sheet. HLMP-KA45 T-1 (3 mm) High Intensity InGaN Lamp. Features. Description. Applications. Package Dimensions

T5321 Series T5421 Series 5x7 mm Surface Mount High Reliability Tristate/Non-Tristate, 1MHz to 100MHz

KTDS-3534UV365B 3.45 x 3.45 mm UV LED With Ceramic Substrate

Solder joint formation and testing on cell busbars

Simulate and Stimulate

303139, Vishay Foil Resistors FEATURES INTRODUCTION. TABLE 1 - TOLERANCE AND TCR VS. RESISTANCE VALUE (- 55 C to C, + 25 C ref.

WIRE WOUND CHIP INDUCTORS SWI SERIES

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

SINGLE TURN COPAL ELECTRONICS S T T A Ω ( 1 2 ) FEATURES PART NUMBER DESIGNATION

CeraDiodes. Soldering directions. Date: July 2014

T5621 Series T5721 Series 5x7 mm Surface Mount High Reliability Tristate/Non-Tristate, 16kHz to 100MHz

PAGE 1/6 ISSUE Jul SERIES Micro-SPDT PART NUMBER R516 XXX 10X R 516 _ 1 0 _

Recommended Attachment Techniques for ATC Multilayer Chip Capacitors

An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications

Practical Solutions for Successful Pb-Free Soldering. Brian Allder Qualitek-Europe

PRODUCT BRIEF Copper to Fiber Ethernet Media Converter 10/100/1000BASE-T to 1000BASE-SX M38999, 28VDC

S3X58-M High Reliability Lead Free Solder Paste. Technical Information. Koki no-clean LEAD FREE solder paste.

This specification applies for the RMS series of Anti-Sulfurated thick film chip resistors made by TA-I. RMS 10 J T 103.

Ultra Wide Band Low Noise Amplifier GHz. Electrical Specifications, TA = +25⁰C, With Vg= -5V, Vcc = +4V ~ +7V, 50 Ohm System

SNT Package User's Guide

GS61008T Top-side cooled 100 V E-mode GaN transistor Preliminary Datasheet

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

Solder Dip Options T = Standard S = Sn60Pb40 G=SAC305. Package 86 =Leaded 80 = Formed Leads 85=SMT

SURFACE MOUNT DEVICE LED Part No. : 0603LGCT REV:A / 01

VS9000.D / Single axis analog vibration sensor 30S.VS9XXX.K.11.12

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

GS61008P Bottom-side cooled 100 V E-mode GaN transistor Preliminary Datasheet

PX-421 Crystal Oscillator

Serial ATA (SATA) Connector

Test Results and Alternate Packaging of a Damped Piezoresistive MEMS Accelerometer

A 2.4 GHz WLAN/BTLTE Co-Existence Filter

Methods to predict fatigue in CubeSat structures and mechanisms

MS9000.D / Single axis analog accelerometer 30S.MS9XXX.K.03.12

RALEC 旺詮. Scope: 2 (EX) request. IE-SP /01/05. Released Date Page No. Remark. Series. Resistance Tolerance. Nominal Resistance.

Mechanically Isolated & Electrically Filtered ICP pyroshock Accelerometers. Bob Metz October 2015

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

GSP. TOYOTA s recommended solder paste for automotive electronics. Product information. LEAD FREE solder paste.

ColibrysVIBRATION. VS9000 DATASHEET Single axis analog accelerometer. Vibration Sensor. Features. Accelerometer specifications

DATA SHEET SHUNT RESISTOR PU series 5%, 1% sizes 2512/ 3921/ 5931

Assembly/Packagng RF-PCB. Thick Film. Thin Film. Screening/Test. Design Manual

AEC-Q200 Compliant with AEC-Q200 standard. Miniature and light weight. Suit for reflow and wave flow solder

Power Transmitter Capacitors UHF/RF High Q Ceramic Capacitors (NP0 TC) 6040C (.600 x.400 ) 6040C (.600 x.400 )

Surface Mount 905 nm Pulsed Semiconductor Laser 4-channel Array High Power Laser-Diode Family for LiDAR and Range Finding

Features. Applications

High Efficient Heat Dissipation on Printed Circuit Boards. Markus Wille, R&D Manager, Schoeller Electronics Systems GmbH

PAGE 1/6 ISSUE SERIES Micro-SPDT PART NUMBER R516 XXX 10X. (All dimensions are in mm [inches]) R 516 _ 1 0 _

PLEDxN Series. PLED Open LED Protectors PLEDxN Series. RoHS. Description

RF-LAMBDA LEADER OF RF BROADBAND SOLUTIONS

Opto Interrupter ITR20403

IEST Conference April 24, 2001

Interesting Customer Questions

ColibrysACCELERATION

Monolithic Amplifier CMA-81+ Wideband, High Dynamic Range, Ceramic. DC to 6 GHz. The Big Deal

DATA SHEET SHUNT RESISTOR PU series 5%, 1% sizes 3921/ 5931

Rakon Product Proposal

ColibrysACCELERATION

AEC-Q200 Compliant with AEC-Q200 standard. Miniature and light weight. Suit for reflow and wave flow solder

Transcription:

INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY Reliability of Solder Joint Quality on J-Lead Oscillators Using HALT with Lead and Lead Free Compositions Steve Laya Elite Electronic Engineering Todd Treichel Precision Devices, Inc.

Presentation Overview Primary Objective: Evaluation of Lead vs. Lead Free Use of HALT Vibration (and Thermal Shock) Initial Findings Sometimes things don t go as planned Understanding HALT Stresses Resonance Dwell To Determine Lead vs. Lead Free Post Test Analysis

Lead vs. Lead-Free Conversion from Lead to Lead-Free European Union Automotive Electronics Industrial and Commercial Electronics Assure reliability of Lead-Free

Published Research Follow up on PDI Testing Joint Council on Ageing Aircraft (JCAA)

J-Lead Ceramic Package Under Test

Test Vehicle PCB 10 parts Lead 10 parts Lead-Free J-Leaded Oscillators Hand Soldered To Fiberglass Epoxy PCB Lead Free Lead

Termination Diagram Electro Au, 1.00 µm Min. Kovar, 0.25 Min. Dia. Electro Ni, 1.78 µm Min. Cu FR4 Substrate Alloys Under Test Ag 3.0% Pb 37% Cu 0.5% Sn 63% Sn 96.5% Tin/Lead SAC 305 Solder

Solder Joint Inspection NASA-STD-8739.3

HALT Table Location Placed in the center of the HALT vibration table with Air Flow evenly distributed Instrumentation to measure open circuit on PCB component interface.

Instrumentation

Elite s HALT System HALT Testing 60C/m Temp Shock 6-Axis Vibration Repetitive Shock Power Spectral Density Characteristics HALT Test Purpose

6-Axis RS Vibration Table

Test Results Thermal Shock Step Vibe Sustained Vibration at 50gs No failures after 35 hours of vibration testing. How come???

Perform a Vibration Survey

Perform a Vibration Survey

Perform a Vibration Survey

Measure PCB Resonance

Lead-Free 3 Lead 2 4

Resonance Search Run 1 10 3 2 4 Demand (G) Ch2 (G) Ch3 (G) Ch4 (G) 1 Gs 0.1 10 100 1000 10000

Multiple Searches Location 3 3 2.5 2 1.5 Gs 1 Location 3 On PCB Near Mounting Bolt Run #2 PCB2 Loc3 Run #3 PCB2 Loc3 Run #1 PCB2 Loc3 0.5 0 1 10 100 1000 10000 Multiple Searches Location 4 12 10 8 6 Gs 4 Run #2 PCB1 Loc4 Run #3 PCB1 Loc4 Run #1 PCB1 Loc4 Location # 4 2 0 1 10 100 1000 10000

Measure resonance of the Oscillator On Chip (PCB2) With and Without Wax 8 Run #2 Accel Only 7 Run #3 Accel + Weight 6 5 Gs 4 3 2 1 0 0 500 1000 1500 2000 2500

Overlay resonance on plot of PSD Location 4 100 10 G 2 /Hz 1 0.1 PCB Response from HALT at 51.9g Control Sw ept Resonance 718.8, 23.3 726.2, 9.4 Location 2 Board 1- Ch4 1 10 100 1000 10000 100000 0.01 4 0.001 100 10 G 2 /Hz 1 HALT Inputl Sw ept Resonance PCB Response 0.1 0.01 0.001 1 10 100 1000 10000 100000 718.75, 0.543299

Overlay resonance on plot of PSD Location 3 100 10 G 2 /Hz 1 Sw ept Resonancel PCB Response from HALT at 51.5g Control 595.87, 2.00 1,371.88, 9.37 Location 1 Board 2 - Ch3 (Near Bolt) 1 10 100 1000 10000 100000 0.1 3 0.01 0.001 100 10 Sw ept Resonance HALT Input PCB Response G 2 /Hz 1 1 10 100 1000 10000 100000 0.1 0.01 0.001

Overlay resonance on plot of PSD Location 2 100 10 G 2 /Hz 1 0.1 Sw ept Resonance PCB Response from HALT at 51.0gsHALT Response 784.38, 15.15 Location 2 Board 2 - Ch2 1 10 100 1000 10000 100000 0.01 0.001 2 100 10 Sw ept Resonance PCB Response from HALT at 51.0gsHALT Response HALT Input Location 2 Board 2 - Ch2 G 2 /Hz 1 1 10 100 1000 10000 100000 0.1 0.01 0.001

100 10 Series2 Series3 Series4 Series1 Location 2 Board 2 -Ch2 (Center) 784.38, 15.15 1 0.1 1 10 100 1000 10000 100000 0.1 0.01 784.38, 0.456793 0.001

What is the Board Acceleration @ 718Hz Location 4 was at 23.3 g 2 /Hz RMS Acceleration at 718 (location 4) is Accel = (23.3 x 3.13) 1/2 = 8.6g @ 1371Hz Location 3, 9.37 g 2 /Hz Accel = (9.37 x 3.13) ½ = 5.4g @784 Hz Location 2, 15.15 g 2 /Hz Accel = (15.15 x 3.13) ½ = 6.8

Perform Resonance Dwell Pick a resonance Test to failure Determine time to failure

Lead-Free 3 Lead 2 4

Lead Free Resonance Dwell at 748Hz Loc 2 (Gs) Loc 3 (Gs) Control (Gs) Dwell (Min) 25-3 10 50-5.6 10 97 6.3 10 10 217 26 20 10 433 78 40 10 513 106 50 10 560 129 60 7 Total 67 An still no pop-off failures!

Solder Joint Inspection 96.5Sn/3.0Ag/0.5Cu 63Sn/37Pb 40% of Joints Fractured 22% of Joints Fractured

Conclusions & Lessons Learned Both constructions are durable HALT Suitable for generating high vibration on PCB components Good fixturing is important Resonance Dwell Concentrates enormous energy at one frequency Selection of resonance frequency could skew results. Test Uniformity & Repeatability Difficult to achieve Board Resonances Locations

INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY Any questions Thank you! Enjoy the remainder of the conference.