SN54HC377, SN74HC377 OCTAL D-TYPE FLIP-FLOPS WITH CLOCK ENABLE

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Eight Flip-Flops With Single-Rail Outputs Clock Enable Latched to Avoid False Clocking Applications Include: Buffer/Storage Registers Shift Registers Pattern Generators Package Options Include Plastic Small-Outline (DW) and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 00-mil DIPs description SN4HC, SN4HC SN4HC...J OR W PACKAGE SN4HC... DW OR N PACKAGE (TOP VIEW) CLKEN 1Q 2Q Q D 4D 4Q GND 1 2 4 6 8 9 10 20 19 18 1 16 1 14 1 12 11 V CC 8Q 8D D Q 6Q 6D D Q CLK These devices are positive-edge-triggered octal D-type flip-flops with an enable input. The HC are similar to the HC2 but feature a latched clock-enable (CLKEN) input instead of a common clear. Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse if CLKEN is low. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input has no effect at the output. These devices are designed to prevent false clocking by transitions at CLKEN. The SN4HC is characterized for operation over the full military temperature range of C to 12 C. The SN4HC is characterized for operation from 40 C to 8 C. FUNCTION TABLE (each flip-flop) INPUTS OUTPUT CLKEN CLK D Q H X X Q0 L H H L L L X L X Q0 SN4HC... FK PACKAGE (TOP VIEW) 2Q Q D 4D 1Q CLKEN V CC 8Q 4 2 1 20 19 18 6 8 1 16 1 14 91011121 4Q GND CLK Q D 8D D Q 6Q 6D Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 199, Texas Instruments Incorporated POST OFFICE BOX 60 DALLAS, TEXAS 26 1

logic symbol CLKEN CLK 1 11 G1 1C2 D 4D D 6D D 8D 4 8 1 14 1 18 2 6 9 12 1 16 19 1Q 2Q Q 4Q Q 6Q Q 8Q This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 61-12. 2 POST OFFICE BOX 60 DALLAS, TEXAS 26

logic diagram (positive logic) CLKEN 1 CLK 11 2 1Q 4 2Q D 6 Q 4D 8 9 4Q D 1 12 Q 6D 14 1 6Q D 1 16 Q 8D 18 19 8Q POST OFFICE BOX 60 DALLAS, TEXAS 26

absolute maximum ratings over operating free-air temperature range Supply voltage range, V CC.......................................................... 0. V to V Input clamp current, I IK (V I < 0 or V I > V CC ) (see Note 1).................................... ±20 ma Output clamp current, I OK (V O < 0 or V O > V CC ) (see Note 1)................................ ±20 ma Continuous output current, I O (V O = 0 to V CC ).............................................. ±2 ma Continuous current through V CC or GND................................................... ±0 ma Package thermal impedance, θ JA (see Note 2): DW package................................. 9 C/W N package................................... 6 C/W Storage temperature range, T stg................................................... 6 C to 10 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 1, except for through-hole packages, which use a trace length of zero. recommended operating conditions SN4HC SN4HC UNIT MIN NOM MAX MIN NOM MAX Supply voltage 2 6 2 6 V = 2 V 1. 1. VIH High-level input voltage = 4. V.1.1 V = 6 V 4.2 4.2 = 2 V 0 0. 0 0. VIL Low-level input voltage = 4. V 0 1. 0 1. V = 6 V 0 1.8 0 1.8 VI Input voltage 0 0 V VO Output voltage 0 0 V = 2 V 0 1000 0 1000 tt Input transition (rise and fall) time = 4. V 0 00 0 00 ns = 6 V 0 400 0 400 TA Operating free-air temperature 12 40 8 C 4 POST OFFICE BOX 60 DALLAS, TEXAS 26

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA = 2 C SN4HC SN4HC MIN TYP MAX MIN MAX MIN MAX 2 V 1.9 1.998 1.9 1.9 IOH = 20 µa 4. V 4.4 4.499 4.4 4.4 VOH VI = VIH or VIL 6 V.9.999.9.9 V IOH = 4 ma 4. V.98 4...84 IOH =.2 ma 6 V.48.8.2.4 2 V 0.002 0.1 0.1 0.1 IOL = 20 µa 4. V 0.001 0.1 0.1 0.1 VOL VI = VIH or VIL 6 V 0.001 0.1 0.1 0.1 V IOL = 4 ma 4. V 0.1 0.26 0.4 0. IOL =.2 ma 6 V 0.1 0.26 0.4 0. II VI = or 0 6 V ±0.1 ±100 ±1000 ±1000 na ICC VI = or 0, IO = 0 6 V 8 160 80 µa Ci 2 V to 6 V 10 10 10 pf UNIT timing requirements over recommended operating free-air temperature range (unless otherwise noted) TA = 2 C SN4HC SN4HC MIN MAX MIN MAX MIN MAX 2 V 0 0 0 4 fclock Clock frequency 4. V 0 2 0 16 0 20 MHz 6 V 0 29 0 19 0 2 2 V 100 10 12 tw Pulse duration, CLK high or low 4. V 20 0 2 ns tsu Setup time before CLK 6 V 1 2 21 2 V 100 10 12 D 4. V 20 0 2 6 V 1 2 21 2 V 100 10 12 CLKEN high or low 4. V 20 0 2 6 V 1 2 21 2 V th Hold time after CLK CLKEN inactive or active, data 4. V ns 6 V UNIT ns POST OFFICE BOX 60 DALLAS, TEXAS 26

switching characteristics over recommended operating free-air temperature range, C L = 0 pf (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) TA = 2 C SN4HC SN4HC MIN TYP MAX MIN MAX MIN MAX 2 V 11 4 fmax 4. V 2 4 16 20 MHz 6 V 29 64 19 2 2 V 6 160 240 200 tpd CLK Any 4. V 1 2 48 40 ns 6 V 12 2 41 4 2 V 8 110 9 tt Any 4. V 8 1 22 19 ns 6 V 6 1 19 16 UNIT operating characteristics, T A = 2 C PARAMETER TEST CONDITIONS TYP UNIT Cpd Power dissipation capacitance per flip-flop No load 0 pf 6 POST OFFICE BOX 60 DALLAS, TEXAS 26

PARAMETER MEASUREMENT INFORMATION SN4HC, SN4HC From Output Under Test Test Point CL = 0 pf (see Note A) High-Level Pulse Low-Level Pulse tw LOAD CIRCUIT VOLTAGE WAVEFORMS PULSE DURATIONS Input tplh tphl Reference Input Data Input 10% tsu th 90% 90% tr 10% tf In-Phase Output Out-of-Phase Output 10% tphl 90% 90% 90% tr 10% 10% tf tplh VOH 10% VOL tf VOH 90% VOL tr VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 0 Ω, tr = 6 ns, tf = 6 ns. C. For clock inputs, fmax is measured when the input duty cycle is. D. The outputs are measured one at a time with one input transition per measurement. E. tplh and tphl are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 60 DALLAS, TEXAS 26

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ( CRITICAL APPLICATIONS ). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER S RISK. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 1998, Texas Instruments Incorporated