Goodix GF6648 Exploratory Analysis
2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. Chipworks Inc. 2015 all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. EXR-1501-901 28306CYSDW Revision: 1.0 Published: January 23, 2015 Revision: 2.0 Published: March 6, 2015
3 Table of Contents Introduction Device Identification Meizu MX4 Pro M462 Smartphone GF6648M Fingerprint Sensor and Ribbon Cable from the Meizu MX4 Pro M462 Package Top and Bottom GF6648 Fingerprint Sensor and Ribbon Cable Package Top and Bottom GF6648 Fingerprint Sensor and Ribbon Cable Package X-Ray on Ribbon Cable GF6648M Fingerprint Sensor and Ribbon Cable Package X-Ray GF6648 Fingerprint Sensor and Ribbon Cable Side-View Package X-Ray GF900_5E4_96B Die Photograph GF900_5E4_96B Die Markings GF900_5E4_96B Die Corners Top Edge GF900_5E4_96B Die Corners Bottom Edge GF900_5E4_96B Die Pixel Array GF900_5E4_96B Die RDL Pads GF900_5E4_96B Die Photograph at Polysilicon Winbond KAG033901 Die Extracted from the GF6648 Fingerprint Sensor MediaTek BD10239A Die Extracted from the GF6648 Fingerprint Sensor GF6648M Package Cross Section Optical Overview GF6648M Sapphire Cover SEM-EDS GF6648M Package Cross Section Detailed Optical GF6648M Package Cross Section SEM Overview GF6648M Package Cross Section SEM GF6648M Package Cross Section Metal 2 Pitch SEM GF6648M Package Cross Section Ball Bond Detail SEM GF900_5E4_96B Die Edge SEM GF900_5E4_96B Die Seal Structure SEM GF900_5E4_96B General Structure SEM GF900_5E4_96B Minimum Pitch Metal 1 SEM GF900_5E4_96B Minimum Pitch Contact Gates SEM GF900_5E4_96B Minimum Pitch Contact Gates Detail SEM GF900_5E4_96B LOCOS Field Oxide SEM GF900_5E4_96B Die Critical Dimensions GF900_5E4_96B Large MOS SEM (Cross GF900_5E4_96B Well Structure SEM (Cross GF900_5E4_96B PMOS Transistor Bank SEM (Cross GF900_5E4_96B DeMOS Transistor Bank SEM (Cross GF900_5E4_96B DeMOS Transistor Detail SEM (Cross Statement of Measurement Uncertainty and Scope Variation About Chipworks
41 Statement of Measurement Uncertainty and Scope Variation Statement of Measurement Uncertainty Chipworks calibrates length measurements on its scanning electron microscopes (SEM), transmission electron microscope (TEM), and optical microscopes, using measurement standards that are traceable to the International System of Units (SI). Our SEM/TEM cross-calibration standard was calibrated at the National Physical Laboratory (NPL) in the UK (Report Reference LR0304/E06050342/SEM4/190). This standard has a 146 ± 2 nm (± 1.4%) pitch, as certified by NPL. Chipworks regularly verifies that its SEM and TEM are calibrated to within ± 2% of this standard, over the full magnification ranges used. Fluctuations in the tool performance, coupled with variability in sample preparation, and random errors introduced during analyses of the micrographs, yield an expanded uncertainty of about ± 5%. The materials analysis reported in Chipworks reports is normally limited to approximate elemental composition, rather than stoichiometry, since calibration of our SEM and TEM based methods is not feasible. Chipworks will typically abbreviate, using only the elemental symbols, rather than full chemical formulae, usually starting with silicon or the metallic element, then in approximate order of decreasing atomic % (when known). Secondary ion mass spectrometry (SIMS) data may be calibrated for certain dopant elements, provided suitable standards were available. A stage micrometer, calibrated at the National Research Council of Canada (CNRC) (Report Reference LS-2005-0010), is used to calibrate Chipworks optical microscopes. This standard has an expanded uncertainty of 0.3 µm for the stage micrometer s 100 µm pitch lines. Random errors, during analyses of optical micrographs, yield an expanded uncertainty of approximately ± 5% to the measurements. Statement of Scope Variation Due to the nature of reverse engineering, there is a possibility of minor content variation in Chipworks standard reports. Chipworks has a defined table of contents for each standard report type. At a minimum, the defined content will be included in the report. However, depending on the nature of the analysis, additional information may be provided in a report, as value-added material for our customers.
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