Data Sheet. ACMD-7402 Miniature PCS Band Duplexer. Description. Features. Specifications. Applications. Functional Block Diagram

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ACMD-742 Miniature PCS Band Duplexer Data Sheet Description The Avago ACMD-742 is a miniature duplexer designed for US PCS handsets. The ACMD-742 is designed with Avago Technologies Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-q filters at a fraction of their usual size. The ACMD-742 also utilizes Avago s innovative Microcap bonded-wafer, chip scale packaging technology. This process allows the filters to be assembled in a molded chip-on-board module that is less than 1.3 mm high with a footprint of only 3.8 x 3.8 mm. The ACMD-742 enhances the sensitivity and dynamic range of PCS receivers by providing more than 54 db attenuation of the transmitted signal at the receiver input and more than 45 db rejection of transmitgenerated noise in the receive band. Maximum Insertion Loss in the Tx channel is only 3.5 db, which minimizes current drain from the power amplifier. Insertion Loss in the Rx channel is 3.8 db max, improving receiver sensitivity. Features Miniature size - 3.8 x 3.8 mm footprint size - 1.3 mm max height High power rating size - +33 dbm max Tx power Lead-free construction Specifications Performance guaranteed 3 to +85 C Rx band performance (193.5 1989.5 mhz) size - Insertion loss: 3.8 db max size - Noise blocking: 43 db min Tx band performance (185.5 199.5 mhz) size - Insertion loss: 3.5 db max size - Interferer blocking: 52 db min Applications Handsets or data terminals operating in the US PCS frequency band The excellent power handling capability of the FBAR bulk-mode resonators supports the high output power levels needed in PCS handsets while adding virtually no distortion. Functional Block Diagram ANT PORT 3 Tx PORT 1 Rx PORT 2

ACMD-742 Electrical Specifications, Z = 5 Ω, T C [1,2] as indicated 3 C [2] +25 C [2] +85 C [2] Symbol Parameter Units Min Typ [3] Max Min Typ [3] Max Min Typ [3] Max Antenna Port to Receive Port S23 Insertion Loss in Receive Band db 3.8 1.5 3.5 3.5 (193.5 1989.5 MHz) S23 Ripple (p-p) in Receive Band db 3. 1.5 2.6 2.6 S22 Return Loss of Receive Port db 9.5 9.5 17 9.5 in Receive Band S23 Attenuation in Transmit Band db 52 52 56 52 (185.5 199.5 MHz) S23 Attenuation 16 MHz db 2 31 S23 Attenuation in Receive 2 nd db 18 19 Harmonic Band (3861 3979 MHz) Transmit Port to Antenna Port S31 Insertion Loss in Transmit Band db 3. 1.1 3. 3.5 [4] (185.5 199.5 MHz) S31 Ripple (p-p) in Transmit Band db 2.3.9 2.3 2.8 S11 Return Loss of Transmit Port db 9.5 9.5 2 9.5 in Transmit Band S31 Attenuation in Receive Band db 43 43 48 43 (193.5 1989.5 MHz) S31 Attenuation 16 MHz db 22 34 S31 Attenuation in Transmit 2 nd db 8 13 Harmonic Band (371 3819 MHz) Antenna Port S33 Return Loss of Antenna Port in db 9 9 16 9 Receive Band (193.5 1989.5 MHz) S33 Return Loss of Antenna Port in db 9 9 19 9 Transmit Band (185.5 199.5 MHz) Isolation Transmit Port to Receive Port S21 Tx-Rx Isolation in Receive Band db 45 45 48 45 (193.5 1989.5 MHz) S21 Tx-Rx Isolation in Transmit Band db 54 54 58 54 (185.5 199.5 MHz) Notes: 1. T C is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board. 2. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dbm over all Tx frequencies unless otherwise noted. 3. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time. Refer to Characterization section for measurement details. 4. At Tx input power between +26 dbm and +29 dbm, the Insertion Loss at the upper edge of the Tx band (197 199.5 MHz) will be slightly degraded. From 197 to 199.5 MHz, the maximum Insertion Loss specification at Tc = +85 C is guaranteed to +26 dbm input power. 2

Absolute Maximum Ratings [1] Parameter Unit Value Storage Temperature C 65 to +125 Maximum RF Input Power dbm +33 to Tx Ports Maximum Recommended Operating Conditions [2] Parameter Unit Value Operating Temperature, Tc [3], C 4 to +1 Tx Power 29 dbm Operating temperature, Tc [3], C 4 to +85 Tx Power 3 dbm Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. T C is defined as case temperature, the temperature of the underside of the Duplexer where it makes contact with the circuit board. Characterization A test circuit similar to that shown in Figure 1 was used to measure typical device performance. This circuit is designed to interface with Air Coplanar (ACP), Ground- Signal-Ground (GSG) RF probes of the type commonly used to test semiconductor wafers. The test circuit is a 7 x 7 mm PCB with a well-grounded pad to which the device under test (DUT) is soldermounted. A test circuit with a ACMD-742 mounted in place is shown in Figure 2. S-parameters are then measured using a network analyzer and calibrated ACP probe set Phase data for s-parameters measured with ACP probe circuits are adjusted to place the reference plane at the edge of the Duplexer. Short lengths of 5-ohm microstripline connect the DUT to the ACP probe patterns on the board. Figure 1. ACP probe test circuit Figure 2. Test circuit with ACMD-742 duplexer 3

Typical Performance at T c = 25 C.. -1. -2. -3. -1. -2. -3. -4. 185 186 187 188 189 19 191 Frequency [MHz] -4. 193 194 195 196 197 198 199 Frequency [MHz] Figure 3. Tx Ant insertion loss Figure 4. Ant Rx insertion loss -5 Return Loss [db] -15-3 -5-25 175 18 185 19 195 2 25 21-6 175 18 185 19 195 2 25 21 Frequency[MHz] Frequency[MHz] Figure 5. Tx and Rx port return loss Figure 6. Tx rejection in Rx band and Rx rejection in Tx band -35-45 -5-55 -6-65 -7-75 -8 175 18 185 19 195 2 25 21 Frequency[MHz] Figure 7. Tx Rx isolation Return Loss [db] -5-15 -25 175 18 185 19 195 2 25 21 Frequency [MHz] Figure 8. Antenna port return loss 4

-3-3 -5 37 372 374 376 378 38 382 Frequency [MHz] -6. 1. 2. 3. 4. 5. 6. Frequency [GHz] Figure 9. Tx Ant rejection at Tx second harmonic Figure 1. Tx Ant and Ant Rx wideband insertion loss -3-5 -3-5 -6..2.4.6.8 1. 1.2 1.4 1.6 Frequency [GHz] -6..2.4.6.8 1. 1.2 1.4 1.6 Frequency [GHz] Figure 11. Tx Ant low frequency rejection Figure 12. Ant Rx low frequency rejection 5

SOLDER MASK OVER VIAS (2 PLS) 1.8 1.4.8.5.1.4 Rx (PRODUCT MARKING) Tx 3.8 2.8 1.1 Tx Rx 1.9 Ant Ant 3.8 1.2 1.4 1.9 2.4 NOTES: 1. DIMENSIONS IN MILLIMETERS (mm). 2. TOLERANCE: X.X ±.1, X.XX ±.5 3. PACKAGE HEIGHT = 1.3 mm MAX. 4. CONTACT AREAS ARE GOLD PLATED. 5. NON-GROUND VIAS SHOWN FOR REFERENCE ONLY; COVERED WITH.51 mm SOLDER MASK. Lead Free Figure 13. Package outline drawing PACKAGE ORIENTATION Rx H FB Y WW DC N N N N Ant Tx H = ACMD-742 FB = Avago ID Y = Year WW = Work Week DC = Date Code NNNN = Lot Number Figure 14. Package marking 6

1. 1.8 1. 1.2 1.2.8.2 1..4.3 1.8 T W 1.4.3.6 1.2 1.2 1.2 1.2 NOTES: DIMENSIONS IN MILLIMETERS (mm) ALL VIAS.4 ANGLES 45 RF PORTS ARE CPW T AND W SELECTED FOR 5 OHMS PATTERN CENTERED ON DUPLEXER.3.3.5.5.2.2.4.4.3 1.4.3 Figure 15. Recommended PCB land print Figure 16. Duplexer superposed on PCB land print 7

1.63 1. 2.7 1.25 3.4.4 1. 3.25 NOTES: 1. DIMENSIONS IN MILLIMETERS (mm). 2. SOLDER STRIPES (14 PLS) ARE.2 WIDE, PITCH. 3. SOLDER PADS FOR I/O ARE.35 x.35. 4. STENCIL PATTERN IS CENTERED ON DUPLEXER. Figure 17. Recommended solder stencil Figure 18. Duplexer superposed on solder s stencil Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 26 C J-STD-2C Level 3 3 25 TEMPERATURE C 2 15 1 5 5 1 15 2 25 3 TIME, SECONDS Figure 19. Verified SMT solder profile 8

4. ±.1 SEE NOTE 2 2. ±.5 B 1.55 ±.5 1.75 ±.1 Bo 5 MAX. 5.5 ±.5 12. ±.1 A A SECTION B-B Ko B 8. ±.1 1.5 (MIN.).3 ±.5 Ao Ao = 4.1 Bo = 4.1 Ko = 1.45 PITCH = 8. WIDTH = 12. SECTION A-A 5 MAX. NOTES: 1. Ao and Bo MEASURED AT.3 mm ABOVE BASE OF POCKET. 2. 1 PITCHES CUMULATIVE TOLERANCE ±.2 mm. Figure 2. SMD tape packing SPROCKET HOLES PACKAGE PIN 1 ORIENTATION H FB Y WW DC N N N N H FB Y WW DC N N N N TAPE WIDTH POCKET CAVITY Figure 21. Unit orientation In tape 9

Ordering Information Part Number No. of Devices Container ACMD-742-BLK 25 Anti-static Bag ACMD-742-TR1 1 7-inch Reel For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright 26 Avago Technologies Pte. All rights reserved. AV1-261EN July 12, 26