FNK N-Channel Enhancement Mode Power MOSFET Description The FNK6075K uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications. General Features V DS =60V,I D =75A R DS(ON) < 11.5mΩ @ V GS =10V (Typ:9.1mΩ) Schematic diagram High density cell design for ultra low Rdson Fully characterized avalanche voltage and current Good stability and uniformity with high E AS Excellent package for good heat dissipation Special process technology for high ESD capability Application Power switching application Hard switched and high frequency circuits Uninterruptible Power Supply Marking and pin assignment TO-252-2L top view Package Marking and Ordering Information Device Marking Device Device Package Reel Size Tape width Quantity 6075K FNK6075K TO-252-2L - - - Absolute Maximum Ratings (T C =25 unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS 60 V Gate-Source Voltage VGS ±20 V Drain Current-Continuous I D 75 A Drain Current-Continuous(T C =100 ) I D (100 ) 50 A Pulsed Drain Current I DM 300 A Maximum Power Dissipation P D 110 W Derating factor 0.73 W/ Single pulse avalanche energy (Note 5) E AS 450 mj Operating Junction and Storage Temperature Range T J,T STG -55 To 175 Thermal Characteristic Thermal Resistance,Junction-to-Case (Note 2) R θjc 1.36 /W Page 1
Electrical Characteristics (T C =25 unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit Off Characteristics Drain-Source Breakdown Voltage BV DSS V GS =0V I D =250μA 60 68 - V Zero Gate Voltage Drain Current I DSS V DS =60V,V GS =0V - - 1 μa Gate-Body Leakage Current I GSS V GS =±20V,V DS =0V - - ±100 na On Characteristics (Note 3) Gate Threshold Voltage V GS(th) V DS =V GS,I D =250μA 2 3 4 V Drain-Source On-State Resistance R DS(ON) V GS =10V, I D =30A - 9.1 11.5 mω Forward Transconductance g FS V DS =25V,I D =30A 20 - - S Dynamic Characteristics (Note4) Input Capacitance C lss - 2350 - PF V DS =25V,V GS =0V, Output Capacitance C oss - 237 - PF F=1.0MHz Reverse Transfer Capacitance - 205 - PF C rss Switching Characteristics (Note 4) Turn-on Delay Time t d(on) - 16 - ns Turn-on Rise Time t r V DD =30V,I D =2A,R L =15Ω - 10 - ns Turn-Off Delay Time t d(off) V GS =10V,R G =2.5Ω - 45 - ns Turn-Off Fall Time t f - 12 - ns Total Gate Charge Q g V DS =30V,I D =30A, - 50 - nc Gate-Source Charge Q gs V GS =10V - 12 - nc Gate-Drain Charge - 16 - nc Q gd Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) V SD V GS =0V,I S =30A - - 1.2 V Diode Forward Current (Note 2) I S - - 75 A Reverse Recovery Time t rr TJ = 25 C, IF =75A - 28 ns Reverse Recovery Charge Qrr di/dt = 100A/μs(Note3) - 49 nc Forward Turn-On Time t on Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. Surface Mounted on FR4 Board, t 10 sec. 3. Pulse Test: Pulse Width 300μs, Duty Cycle 2%. 4. Guaranteed by design, not subject to production 5. E AS condition : Tj=25,V DD =30V,V G =10V,L=0.5mH,Rg=25Ω Page 2
Test Circuit 1) E AS test Circuit 2) Gate charge test Circuit 3) Switch Time Test Circuit Page 3
Typical Electrical and Thermal Characteristics (Curves) Rdson On-Resistance(mΩ) ID- Drain Current (A) ID- Drain Current (A) Vds Drain-Source Voltage (V) Figure 1 Output Characteristics Vgs Gate-Source Voltage (V) Figure 2 Transfer Characteristics Normalized On-Resistance Vgs Gate-Source Voltage (V) Is- Reverse Drain Current (A) T J -Junction Temperature( ) Figure 4 Rdson-JunctionTemperature Qg Gate Charge (nc) Figure 5 Gate Charge I D - Drain Current (A) Figure 3 Rdson- Drain Current Vsd Source-Drain Voltage (V) Figure 6 Source- Drain Diode Forward Page 4
Vds Drain-Source Voltage (V) Figure 7 Capacitance vs Vds T J -Junction Temperature( ) Figure 9 BV DSS vs Junction Temperature ID- Drain Current (A) C Capacitance (pf) Vds Drain-Source Voltage (V) Figure 8 Safe Operation Area T J -Junction Temperature( ) Figure 10 V GS(th) vs Junction Temperature r(t),normalized Effective Transient Thermal Impedance Square Wave Pluse Duration(sec) Figure 11 Normalized Maximum Transient Thermal Impedance Page 5
TO-252-2L Package Information Page 6