50 to 6000 InGaP HBT Active Bias Gain Block SBB3000 50 to 6000 InGaP HBT ACTIVE BIAS GAIN BLOCK Package: Bare Die Product Description RFMD s SBB3000 is a high performance InGaP HBT MMIC amplifier utilizing a Darlington configuration with an active bias network. The active bias network provides stable current over temperature and process Beta variations. The SBB3000 product is designed for high linearity 5V gain block applications that require excellent gain flatness, small size, and minimal external components. It is internally matched to 50. Optimum Technology Matching Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs phemt Si CMOS Si BJT GaN HEMT InP HBT RF MEMS LDMOS db 30 20 10 0-10 -20 Gain and Return Loss V S = 5V, I S = 42mA S21 Bias Tee Data, Z S = Z L = 50 Ohms, T L = S11 S22-30 0 1 2 3 4 5 6 Features Single Fixed 5V Supply Patented Self Bias Circuit and Thermal Design Gain = 16.4dB at 1950 P1dB = 15.2dBm at 1950 OIP3 = 29.5dBm at 1950 Robust 1000V ESD, Class 1C HBM Applications PA Driver Amplifier RF Pre-Driver and RF Receiver Path Military Communications Test and Instrumentation Parameter Specification Min. Typ. Max. Unit Condition Small Signal Gain 16.6 db 850 16.4 db 1950 16.3 db 2400 Output Power at 1dB Compression 15.6 dbm 850 15.2 dbm 1950 15.4 dbm 2400 Output Third Order Intercept Point 3 dbm 850 29.5 dbm 1950 29.5 dbm 2400 Input Return Loss 21 db 1950 Output Return Loss 25.5 db 1950 Noise Figure 3.9 db 1950 Device Operating Voltage 4.2 V R DC = 20, V S = 5.0V Device Operating Current 38 42 46 ma R DC = 20, V S = 5.0V Operational Current Range 30 46 ma Per user preference via R DC Thermal Resistance 80 C/W Junction to lead (89 package) Test Conditions: V D = 4.2V, I D = 42mA, T L =, OIP 3 Tone Spacing = 1, R DC = 20, Bias Tee Data, Z S = Z L = 50, P OUT per tone = -5dBm RF MICRO DEVICES, RFMD, Optimum Technology Matching, Enabling Wireless Connectivity, PowerStar, POLARIS TOTAL RADIO and UltimateBlue are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. 2006, RF Micro Devices, Inc. 1 of 5
Absolute Maximum Ratings Parameter Rating Unit Max Device Current (l D ) 100 ma Max Device Voltage (V D ) 6 V Max RF Input Power* (See Note) +20 dbm Max Junction Temperature (T J ) +150 C Operating Temperature Range (T L ) -40 to +85 C Max Storage Temperature +150 C ESD Rating - Human Body Model Class 1C (HBM) *Note: Load condition Z L = 50 Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the table on page one. Bias Conditions should also satisfy the following expression: I D V D < (T J - T L )/R TH, j - l and T L = T LEAD Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. RFMD Green: RoHS compliant per EU Directive 2002/95/EC, halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder. SBB3089Z Typical RF Performance at Key Operating Frequencies (Bias Tee Data) Parameter Unit 100 500 850 SBB3089Z Typical Performance with Bias Tees, V D = 5V with R DC = 20, I D = 42mA 1950 2140 2400 Small Signal Gain db 16.9 16.6 16.6 16.4 16.4 16.3 16.1 Output Third Order Intercept Point dbm 29.5 30.5 3 29.5 29.0 29.5 27.0 Output Power at 1dB Compression dbm 15.6 16.0 15.6 15.2 15.0 15.4 15.2 Input Return Loss db 24.0 26.5 24.5 21.0 20.5 2 15.5 Output Return Loss db 21.5 26.0 26.0 25.5 25.5 27.5 21.0 Reverse Isolation db 19.5 19.0 19.5 19.5 19.5 19.5 19.5 Noise Figure db 3.7 3.9 3.9 3.9 3.9 4.0 3.8 Test Conditions: V D = 4.2V, I D = 42mA, OIP3 Tone Spacing = 1, P OUT per tone = -5dBm, R DC = 20, T L =, Z S = Z L = 50 3500 34.0 OIP3 versus Frequency, (-5dBm/tone, 1 spacing) 2 P1dB versus Frequency 32.0 18.0 OIP3 (dbm) 3 28.0 P1dB (dbm) 16.0 14.0 26.0 24.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 12.0 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 2 of 5
SBB3089Z Typical Performance with Bias Tees, V S = 5V, R DC = 20, I D = 42mA S11 versus Frequency S21 versus Frequency 2 18.0 S11 (db) -1-2 Gain (db) 16.0 14.0-3 12.0 1 1.0 2.0 3.0 4.0 5.0 6.0 1.0 2.0 3.0 4.0 5.0 6.0 S12 versus Frequency S22 versus Frequency -1-1 S12 (db) S22 (db) -2-2 -3 1.0 2.0 3.0 4.0 5.0 6.0-3 1.0 2.0 3.0 4.0 5.0 6.0 NF versus Frequency DCIV 6.0 10 5.5 9 5.0 8 7 NF (db) 4.5 4.0 3.5 3.0 2.5 2.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ID (ma) 6 5 4 3 2 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 3 of 5
Application Schematic Application Circuit Element Values Reference Designator 500 to 3500 C1 C2 L1 1000pF 68pF 48nH 0805HQ Coilcraft Recommended Bias Resistor Values for I D = 42mA, R DC = (V S - V D )/I D Supply Voltage (V S ) 5V 6V 8V 10V 12V R DC 20 43 91 139 187 4 of 5
Pin Names and Descriptions Pin Name Description RF IN DIE BACKSIDE RF OUT/ DC BIAS RF input. An external DC blocking capacitor chosen for the frequency of operation is required. Die backside must be connected to RF/DC ground using silver filled conductive epoxy. RF output and DC bias input. An external DC blocking capacitor chosen for the frequency of operation is required. Die Dimensions 21 [0.52] 23 [0.59] RF IN Notes: 1. All dimensions in inches [millimeters] 2. Die thickness: 04 [0.10] 3. Typical bond pad size is 03 x 07 4. Backside metallization: Gold 5. Bond pad metallization: Gold 6. Backside is ground RF OUT DC Bias In Ordering Information Part Number Description Container Quantity SBB3000 Bare Die Gel Pack 10 SBB3000S2 Bare Die Gel Pack 2 5 of 5