Hermetic Packaging Solutions using Borosilicate Glass Thin Films 1
Company Profile Company founded in 2006 ISO 9001:2008 qualified since 2011 Headquarters and Production in Dresden, Germany Production and R&D Location in Berlin, Germany Winner 'Material Award' of the IC Industry Awards in 2009 Worldwide services in Europe, Asia and US Funded among others by the state of Saxony through TGFS 2
What we do Hermetic Structured Borosilicate Glass Layers for Packaging of Opto-electronics, MEMS, MOEMS on Wafer-Level 3
Key advantages of Lithoglas Hermetic Structured Borosilicate Glass Layers as known from lab equipment excellent chemical resistance very low moisture absorption transparent, temperature-stable hard, scratch resistant 4
Key advantages of Lithoglas Hermetic Structured Borosilicate Glass Layers film thicknesses of 100nm 20µm 3µm glass layer on KOH-etched Si-groove adhesion verified on various surfaces precise perpetuation of topography CTE matched to silicon, glass wafers 5
Key advantages of Lithoglas Hermetic Structured Borosilicate Glass Layers gentle structuring by lift-off technique protection of surface qualities high degree of design freedom 6
Key advantages of Lithoglas Hermetic Structured Borosilicate Glass Layers hermeticity proven by: temperature-humidity-storage (THS 85 C/85%, 8000h) Helium leak test (MIL-STD 883 Method 1014) 7
Key advantages of Lithoglas Hermetic Structured Borosilicate Glass Layers Plasma-Assisted E-Beam Evaporation unique deposition process for glass very low substrate temperatures (< 80 C) yielding dense, transparent glass layers batch processing for various substrate sizes: 4 to 8 8
Key advantages of Lithoglas Technology: Deposition of Borosilicate Glass Thin Films hermetic moisture resistant, long-term stable robust temperature resistant, excellent chemical stability compatible low processing temperatures, RoHS compliant, matched thermal behavior to silicon mature controlled layer stress, uniformity, repeatability 9
Products and Services Solutions: surface passivation 10 semi-finished products wafer-level-capping
Solution: surface passivation Immediate protection of the chip surface Lithoglas Coatings hermetic sealing of chip surface by thin glass film application on wafer-level in cleanroom environment structuring of glass by gentle lift-off processing reduced packaging effort / costs 11 Glass!
Solution: surface passivation Flip-Chip Redistribution using Lithoglas polymers for dielectric and surface passivation replaced by glass RDL in copper and aluminum realized UBM formation on top of glass advantage of matched CTE to silicon 12
Solution: semi-finished products Lithoglas Substrates glass caps for optical/mems packaging substrates for hermetic bonding (anodic) structures for microfluidics 13
Solution: semi-finished products Lithoglas Substrates Full Glass Cap glass rim on glass lid improved reliability standard lid material: glass, quartz, sapphire stand-off heights < 20 µm ± 1 µm optical coatings like AR, IR, apertures feasible appl.: optical, eg. detectors, imagers Wafer-level CSP glass cap opto chip board bonded glass caps for COB packaging 14
Solution: wafer-level-capping Encapsulation of sensitive devices on wafer-level Lithoglas µcapping encapsulation of sensitive chip areas in early stage of packaging in cleanroom environment (class 10) Sensitive Area exact cavity stand-off height / placement Singulated Chip Wire Bond Pads 15 Glass Cap
Solution: wafer-level-capping Encapsulation of sensitive devices on wafer-level Lithoglas µcapping singulation of capped chips easily integrated in standard COB-packaging requirements on cleanliness in the following packaging steps reduced placement on lead frame wire bonding of contacts molding of device 16
Solution: wafer-level-capping Encapsulation of sensitive devices on wafer-level Lithoglas µcapping excellent reliability results even with adhesive bonding Glass Bond Frame excellent diffusion barrier Adhesive Bond Line very thin bond line long diffusion path 17
Solution: semi-finished products Lithoglas Substrates Silicon Cap for Anodic Bond glass film on etched silicon structures hermetic encapsulation stand-off heights > 100 µm ± 5 µm Silicon Cap typ. appl.: MEMS MEMS Device Glass Bond Layer e.g. as replacement for glass frit 18
Solution: semi-finished products Lithoglas Substrates Silicon Cap for Anodic Bond bonding of silicon to silicon (8 ) with 5 µm glass film (on 100nm SiO2) bonding with 3 voltage steps: 20 V, 40 V, 60 V bonding temperature: 400 C bonding time: 10 min charge separation > 1000 mc Lithoglas Glass Film 19 Bond Chart
Solution: semi-finished products Lithoglas Substrates Glass-Coated Wafers for Anodic Bond borosilicate glass coating on standard silicon wafers (4 to 8 ) borosilicate glass coating on other materials (quartz, sapphire) acc. to customer specification structured borosilicate glass coatings acc. to customer design typ. appl.: anodic bond silicon-to-silicon or other materials MEMS Sensor Source: GE Silicon with Lithoglas wafer sizes up to 8 available 20 Lithoglas on structured silicon e.g. replacement of glass wafers in MEMS
Solution: semi-finished products Lithoglas Substrates Hybrid Silicon-Glass Cap silicon rim on glass lid (anodic bond) hermetic optical cap stand-off heights > 100 µm ± 5 µm optical coatings like AR, IR, apertures feasible typ. appl.: detectors, LED, MOEMS glass silicon hybrid cap chip submount encapsulation of mounted device with hybrid cap 21
Summary Lithoglas for packaging applications enables plastic molded packages with high reliability reduction of package size and packaging costs proven and widely compatible technology, excellent material properties avoids expensive materials and processes enables new packaging concepts / new products 22
Products and Services Overview Lithoglas Coatings micro-structured glass thin films on customer wafers / customized design Lithoglas Substrates micro-structured glass thin films on almost any substrate Lithoglas µcapping customized wafer-level glass encapsulation MSG Lithoglas GmbH Maria-Reiche-Str. 1 01109 Dresden, Germany www.lithoglas.de / info@lithoglas.de 23