AFBR-59F2Z Data Sheet Description Features Applications Transmitter Receiver Package

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AFBR-59F2Z 2MBd Compact 6nm Transceiver for Data communication over Polymer Optical Fiber (POF) cables with a bare fiber locking system Data Sheet Description The Avago Technologies AFBR-59F2Z transceiver provides system designers with the ability to support serial communication with baud rates of up to 2MBd over 2.2mm jacketed standard polymer optical fiber (POF). The innovative bare fiber locking mechanism of the transceiver allows connection of POF cable with a simple insert and lock system eliminating the need for connectors. This facilitates fast installation and maintenance. The AFBR-59F2Z is Laser Class 1, lead-free and compliant with RoHS. The very compact design is similar to that of the well known RJ-45 connector. Transmitter The transmitter consists of a 6nm LED which is controlled by a fully integrated driver IC. The LED driver operates at 3.3V. It receives Low Voltage Differential Signaling (LVDS) electrical input, and converts it into a modulated current driving the LED. LED and driver IC are packaged in an optical subassembly. The optimized lens system of the optical subassembly couples the emitted optical power very efficiently into 1mm core POF cable. Receiver The receiver utilizes a fully integrated single chip solution which provides excellent immunity to EMI and fast transient dv/dt rejection. The receiver directly converts light to a digital LVDS output signal and operates at 3.3V nominal supply. The integrated receiver is packaged in an optical subassembly, which couples optical power efficiently from POF to the receiving PIN. The receiver features an analog monitor output of the incoming optical signal. The monitor output provides an analog voltage proportional to the average optical input power. In absence of receiver optical input signal, the receiver is in low power sleep mode and the differential output signal is pulled to ground. The receiver wakes up, when a valid optical input signal is detected. Features Easy bare fiber termination solution for 2.2mm jacket POF EMI/ EMC robust Link lengths up to 40m POF LVDS interface compatible Operating temp. range -40 C to 85 C 3.3V power supply operation Analog monitor output (MON) Low power sleep mode Applications Factory automation Power generation and distribution system Industrial vision system Solar panel tracking system Home/ Office Networking Package The transceiver package contains the two optical subassemblies which are mounted in the housing for bare fiber connection. The metal shield on bare fiber clamp transceiver provides excellent immunity to EMI/ EMC

0 Pin description and recommended PCB footprint The AFBR-597F2Z has ten active signal pins (including supply voltage and ground pins), two EMI shield solder posts, two additional ground pins and two mounting posts. The EMI shield solder posts and the additional ground pins are isolated from transceiver internal circuit and should be connected to equipment chassis ground or signal ground. Connecting the two additional ground pins with ground provides EMI shielding to the front of the device. Grounding these pins will also provide a ground connection of the POF jacket in order to ground small leakage currents in high voltage applications such as in HVDC installations. The mounting posts provide additional mechanical strength to hold the transceiver module on the application board. Figure 1 shows the top view of the PCB footprint and Pin-out diagram. Pin Descriptions Pin No. Name Symbol Pin No. Name Symbol 1 Data Input (Negative) TD- 8 Monitor Output (IAVG) MON 2 Data Input (Positive) TD+ 9 Data Output (Negative) RD- 3 Ground Tx 10 Data Output (Positive) RD+ 4 DC Supply Voltage Tx Vdd 11 EMI Shield - 5 (Optional) Ground Tx 12 EMI Shield - 6 DC Supply Voltage Rx Vdd 13 Additional EMI - 7 Ground Rx 14 Additional EMI - Top View 0.8 (10 ) 0.76 2.03 3.3 4.57 5.84 7.74 5.2 4.0 11 1 2 3 4 5 6 7 8 9 10 12 1.3 (2 ) 3.2 (2 ) 0 2.74 13 1.3 (2 ) 14 Mount Post Unplated (2 ) Outer edge housing Dimension: mm Recommended PCB thickness: 1.57 ± 0.08 7.83 5.83 3.89 0 FRONT Figure 1. PCB footprint and Pin-out diagram 2

Recommended compliance table Feature Test Method Performance Electrostatic discharge (ESD) to the electrical Pins Immunity JESD22-A114 Variation of IEC 61000-4-3 Withstands up to 2kV HBM applied between the electrical pins. Typically shows no measurable effect from a 15V/m field swept from 8MHz to 1GHz applied to the transceiver when mounted on a circuit board without chassis enclosure. Eye safety EN 60825-1:52007 Laser Class 1 product (LED radiation only). TÜV certificate:r217706. CAUTION Use of controls or adjustments of performance or procedures other than those specified herein may result in hazardous radiation exposure. Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operation conditions. It should not be assumed that limiting values of more than one parameter can be applied to the products at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min. Max. Units Supply Voltage V dd Max -0.5 4.5 V Storage Temperature T STG -40 85 C Lead Soldering Temperature [1] T sold 260 C Lead Soldering Time [1] t sold 10 s Electrostatic Voltage Capability [2] ESD 2.0 kv Installation Temperature [3] T I 0 C 1. The transceiver is Pb-free wave solderable. According to JEDEC J-STD-020D, the moisture sensitivity classification is MSL2a. 2. ESD Capability for all Pins HBM (human body model) according JESD22-A114B 3. Range over which fibers can be connected/ disconnected to/ from the bare fiber clamp. Recommended Operating Conditions Operating temperature T A -40 25 85 C DC Supply Voltage V dd 3.0 3.3 3.6 V Baud Rate [4] BR 10 2 MBd Note: 4. Data rate of 200 Mbps with 8b/10b coding. All the data in this specification refer to the operating conditions above and over lifetime unless otherwise stated. Mechanical Characteristics Parameter Min. Typ. Max. Units Temp. [ C] Fiber/ Cable Retention Force [5] - 30 - N 25 10 - N -40...85 [6] Clamp opening force - 20 - N 25 10-30 N 0... [6] Clamp closing force - 13 - N 25 5-20 N 0... [6] 5. Measured with Avago s AFBR-HUDxxxZ (2.2mm duplex-fiber, PE-jacket, without connector) with 100mm/ min traction speed. 6. Range over which fibers can be connected/ disconnected to/ from the bare fiber clamp. 3

Transmitter Electrical Characteristics Current Consumption I dd - 29.0 40.0 ma External Input Termination Impedance Z IN - 100 Ω LVDS Input Voltage Range to Circuit Common V IN 0.8-2.2 V LVDS Differential Input Voltage V IN-DIIFF 200-1200 mv Transmitter Optical Characteristics (with standard POF NA = 0.5) Central Wavelength [1] l C 635 6 675 nm Spectral Bandwidth (RMS) l W - - 17.0 nm Average Output Power [1, 3] P O -8.5 - -2.0 dbm Optical Rise Time (20% - 80%) [1] t r - 1.2 3.0 ns Optical Fall Time (80% - 20%) [1] t f - 1.2 3.0 ns Extinction Ratio [1] R E 10.0 12.0 - db Duty Cycle Distortion [1] DCD - - 1.0 ns Random Jitter [1, 2] RJ - - 0.7 ns Data dependent Jitter [1] DDJ - - 0.8 ns 1. Measured at the end of 1m plastic optical fiber (POF) with PRBS 2 7-1 sequence 2. Peak to peak measurement, based on BER = 2.5 x 10-10 3. Minimum average output power specification value includes 1dB degradation margin Receiver Electrical Characteristics Current Consumption I dd - 23.0 30.0 ma LVDS Output Common Mode Voltage V CM - 1.2 - V LVDS Output Differential Voltage Swing [4] V O-DIFF 0-800 mv Output Rise Time (10% - 90%) [4] t f - 1.1 3.0 ns Output Fall Time (90% - 10%) [4] t f - 1.1 3.0 ns Duty Cycle Distortion [4] DCD - - 1.0 ns Random Jitter [4, 5, 6] R J - - 1.0 ns Data Dependent Jitter [4] DDJ - - 0.8 ns Output Ratio for MON Pin (to use I AVG output of the IC) I MON/P - 0.5 - μa/μw Monitor Output Voltage Range V MON 0 - V CC -1.5 V Wake up time after sleep state T WKUP 1.0 ms 4. Differential output signal is measured with reference transmitter source, 0.5m POF cable, and PRBS 2 7-1 sequence. 5. Peak to peak measurement, based on BER = 2.5 x 10-10 6. Maximum random jitter at -15dBm optical input power is 0.4ns. Receiver Optical Characteristics Central Wavelength [7] λ C 635 6 675 nm Minimum Receiver Input Power [7] P in Min -21.0 - - dbm Maximum Receiver Input Power [7] P in Max - - -2.0 dbm Note: 7. Average optical power, measured with a PRBS 2 7-1 sequence, BER = 2.5 x 10-10 4

Analog Monitoring Voltage Figure 2 shows the variation of analog monitoring voltage as a function of receiver optical input for industrial temperature range. The monitoring voltage is measured across 2K resistor as shown in Figure 3. The monitoring voltage varies linearly with optical input power and the variation over temperature is negligible. Mon. Voltage (mv) 5 0 4 400 3 300 2 200 1 100 T = -40 C T = +25 C T = +85 C 0 0 100 1 200 2 300 3 400 4 0 5 Optical Power (µw) Figure 2. Analog monitoring voltage as a function of optical power General LVDS Application Circuit The recommended application circuit is shown in figure 3. Board layout- Decoupling circuit and Ground Planes To achieve optimum performance from the AFBR-59F2Z transceiver module it is important to take note of the following recommendations; A power supply decoupling circuit should be used to filter out noise and assure optical product performance; A contiguous signal ground plane should be provided directly beneath the transceiver module for low inductance ground to signal return current; The shield posts should be connected to chassis ground or signal ground to provide optimum EMI and ESD performance. These recommendations are in keeping with good high frequency board layout practices, however, the optimum grounding strategy will depend on the overall system architecture. Figure 3 shows the minimum external circuitry between AFBR-59F2Z transceiver module and PHY chip. AC-coupling would be possible, if the common mode voltage and voltage swing at the data lines are within the recommended values. Please use the product information of the actual PHY Chip for connecting to the AFBR-59F2Z transceiver module. AFBR-59F2Z RD + RD+ RD - MON 100 RD- MON Vdd Amplifier + Quantizer 100nF 2K 10µF 100nF 10nF Ferrite 3V3 TD+ 10µF 10nF Vdd TD+ LED Driver TD- TD- 100 Chassis Figure 3. General Application Circuit for LVDS configuration 5

Mechanical Data - Package Outline 4.9 10.85 ± 0.2 3 6 11.4 6.65 2.74 4 ± 0.15 5.2 ± 0.15 9.4 ± 0.2 15 0 1.52 11.65 7.78 1.27 (8x) 2.54 (6x) 2.54 ± 0.15 15.9 ± 0.15 0.9 ± 0.15 2.6 0.25± 0.05 (10x) 0.25 ± 0.05 3.75 ± 0.2 0.5 ± 0.05 (10x) 24.4 ± 0.25 15.8 ± 0.2 2.9 ± 1.5 1.95 ± 1 1. Dimension: mm 2. General tolerance: ±0.1 3. Recommended PCB thickness: 1.57 ± 0.08 4. Design related is a small gap between plastic part and dust plug possible. Function is nevertheless given. Label (10mm x 12mm) 12 ± 0.2 Clamp Open Clamp with Dust Plug 4) +0.4 29.2-0.2 15.5 ± 0.25 Figure 4. Package Outline Drawing 6

Figure 5. AFBR-59F2Z transceiver module with dust plug Figure 6. AFBR-59F2Z transceiver module without dust plug DISCLAIMER: Avago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2015 Avago Technologies. All rights reserved. AV02-4756EN - November 6, 2015