Model 2425B50-50C Rev. A

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rit Model 2425B50-50C Xinger Balun 50Ω to 100Ω Balanced Description The 2425B50-50C is a low profile sub-miniature balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering 802.11b+g. The 2425B50-50C is ideal for high volume manufacturing and is higher performance than traditional ceramic baluns. The 2425B50-50C has an unbalanced port impedance of 50Ω and a 100Ω balanced port impedance*. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude (-3dB) with 180 degree phase differential. The 2425B50-50C is available on tape and reel for pick and place high volume manufacturing. Features: 2.4 2.5 GHz 180 Transformer 50 Ohm to 2 x 50 Ohm 802.11 b+g Compliant Low Insertion Loss Medium Power No DC Decoupling Capacitors Required Input to Output DC Isolation Surface Mountable Tape & Reel Convenient Package Outline Drawing ELECTRICAL SPECIFICATIONS** Frequency Unbalanced Port Impedance Balanced Port Impedance* Return Loss Insertion Loss GHz Ohms Ohms db min db max 2.4 2.5 50 100 17 0.55*** Amplitude Balance Phase Balance Power Handling ΘJC Operating Temp. db Degrees max Watts ºC / Watt ºC 0 ± 0.5 180 ± 5.0 4 28-55 to +85 **Specification based on performance of unit properly installed on microstrip printed circuit boards with 50 Ω nominal impedance. Specifications subject to change without notice. * 50Ω reference to ground *** Insertion Loss stated at room temperature (0.6 db Max at +85 ºC) Top View (Near-side) Side View Bottom View (Far-side).120±.005 [3.05±0.13] 3 2 1.024±.002 [0.61±0.05] 4X.010±.004 [0.25±0.10].120±.005 [3.05±0.13].095±.004 [2.41±0.10] 6X.010±.004 [0.23±0.10] 4 5 6 Dimensions are in Inches [Millimeters] Mechanical Outline Pin 1 2 3 4 5 6 Designation Out 1 Out 2 In 6X.030±.004 [0.76±0.10] Tolerances are Non-Cumulative

Typical Broadband Performance: 2.3 GHz. to 2.7 GHz. Pin Configuration: Balun Pin Configruation Pin 5 50 ς Unbalanced Port λ 4 λ 4 Pin 1 Balanced Port Terminals Pin 3 The internal configuration of the Xinger balun is diagramed to the left; the unbalanced port is DC connected to ground and the two balanced ports are DC connected and floating. For many chipset applications there is an opportunity to eliminate two decoupling capacitors and/or use a single bias point if applicable. Differential drive is popular in integrated circuit since it aids stability in the presence of bond wire and pin inductance, provides some degree of immunity to power supply and ground noise, and can provide higher output power in the case of some device limits. The construction of the Xinger balun is bonded multi-layered stripline made of low loss dielectric material with plated through vias connecting the internal circuitry to the external printed circuit board, similar to that of the Xinger hybrids and directional couplers. and Reel For Pick and Place Manufacturing.

Typical Performance: 2.35 GHz. to 2.55 GHz. Mounting Configuration: 6X.022 [0.57] 6X.030 [0.76] 4X.012 [0.30].095 [2.41] In order for Xinger surface mount components to work optimally, there must be a 50Ω transmission line to the balanced port and 50Ω transmission lines from the unbalanced ports. If this condition is not satisfied, amplitude balance, insertion loss and VSWR may not meet published specifications. 2X.009 [0.22] Multiple plated thru holes to ground All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/ o C Circuit Pattern Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] Mounting Footprint 3X 50 ς Transmission Line An example of the PCB footprint used in the testing of these parts is shown to the left. in specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.

Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. See Model Numbers below for further ordering information..010 [0.25].157 [4.00].079 [2.01].157 [4.00] Ø.059 [Ø1.50].069 [1.75].130 [3.30].138 [3.50].315 [8.00].030 [0.80].063 [1.61] Ø.039 [Ø0.99] Dimensions are in inches [mm] Direction of Part Feed (Unloading) ØA ØC ØD QUANTITY/REEL 4000 TABLE 1 REEL DIMENSIONS (inches [mm]) ØA B ØC ØD 7.00 [177.8] 0.32 [8.0] 2.0 [50.8] 0.512 [13.0] B and Reel For Pick and Place Manufacturing.