Model BD4859L51A Ultra Small Low Profile 63 Balun 5Ω to 1Ω Balanced Description The BD4859L51A is an ultra-small low profile balanced to unbalanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering 82.11a Uni- Band II and Uni-Band III and the Japanese ISM band (4.9GHz). The BD4859L51A is ideal for high volume manufacturing and is higher performance than traditional ceramic baluns. The BD4859L51A has an unbalanced port impedance of 5Ω and a 1Ω balanced port impedance. This transformation enables single ended signals to be applied to differential ports on modern integrated chipsets. The output ports have equal amplitude (db) with 18 degree phase differential. The BD4859L51A is available on tape and reel for pick and place high volume manufacturing. Detailed Electrical Specifications: Specifications subject to change without notice. Features: 48 59 MHz.7mm Height Profile 5 Ohm to 2 x 5 Ohm Covers 82.11a Uni-Band II & III Low Insertion Loss Input to Output DC Isolation Surface Mountable Tape & Reel Non-conductive Surface RoHS Compliant ROOM (25 C) Parameter Min. Typ. Max Unit Frequency 48 59 MHz Unbalanced Port Impedance 5 Ω Balanced Port Impedance 1 Ω Return Loss 13 18 db Insertion Loss*.6.8 db Amplitude Balance.5 1.2 db Phase Balance 2.5 7 Degrees CMRR 29 db Power Handling.5 Watts Thermal Resistance TBD ºC / Watt Operating Temperature -55 +85 ºC * Insertion Loss stated at room temperature (Insertion Loss is approximately.1 db higher at +85 ºC) Outline Drawing Top View (Near-side) Side View Bottom View (Far-side).59±.4 [1.5±.1].27±.2 [.7±.5].2 [.5].29±.4 1 2 3 [.75±.1].8 [.2] Orientation Marker Denotes Pin Location Dimensions are in Inches [Millimeters] Mechanical Outline Pin Designation 1 Unbalanced Port 2 GND 3 Balanced Port 1 4 Balanced Port 2 5 GND 6 NC.2 [.52] 6 4.1 [.24] Tolerances are Non-Cumulative 5 Available on Tape and Reel for Pick and Place Manufacturing. (315) 432-899 (8) 411-6596
Model BD4859L51A Typical Broadband Performance: 5 MHz. to 8 MHz. Return Loss - Input Amplitude Balance 2-6 1.5-9 1-12.5-18 -21-24 -.5-27 -1 3-1.5 6-2 5 1 15 2 25 3 35 4 45 65 7 75 8 5 1 15 2 25 3 35 4 45 65 7 75 8 Insertion Loss Phase Balance 2-5 15 1-1 5 deg -2-5 -1-25 -2 5 1 15 2 25 3 35 4 45 65 7 75 8 5 1 15 2 25 3 35 4 45 CMRR -1-4 -7-1 -13-16 -19-22 -25-28 1 4 7-4 5 1 15 2 25 3 35 4 45 65 7 75 8 (315) 432-899 (8) 411-6596 Available on Tape and Reel for Pick and Place Manufacturing.
Model BD4859L51A Typical Performance: 47 MHz. to MHz. -6-9 -12-18 -21-24 -27 3 6 47 48 49 Return Loss - Input 51 52 53 54 56 57 58 59 2 1.5 1.5 -.5-1 -1.5-2 47 48 49 Amplitude Balance 51 52 53 54 56 57 58 59 -.3 -.6 -.9-1.2-1.5-1.8-2.1-2.4-2.7.3.6 47 48 49 51 Insertion Loss 52 53 54 56 57 58 59 deg 2 15 1 5-5 -1-2 47 48 49 51 Phase Balance 52 53 54 56 57 58 59 CMRR -6-9 -12-18 -21-24 -27 3 6 47 48 49 51 52 53 54 56 57 58 59 Available on Tape and Reel for Pick and Place Manufacturing. (315) 432-899 (8) 411-6596
Model BD4859L51A Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/ o C. An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. No Bias Footprint DC Bias Footprint 6X.13 [.34] 2X.6 [.16] 6X.13 [.34] DC Bias 6X.11 [.29].12 [.31] Part Orientation (Top View) 6X.11 [.29] Part Orientation (Top View) 6X.2 [.5] 3X Transmission Line Circuit Pattern Plated thru holes to ground 6X.2 [.5] 3X Transmission Line Circuit Pattern 4X.126 [3.2].12 [.31] Plated thru holes to ground Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] 63 Standaard Mounting Footprint Footprint Pad (s) Solder Resist Dimensions are in Inches [Millimeters] 63 DC Bias Mounting Footprint (315) 432-899 (8) 411-6596 Available on Tape and Reel for Pick and Place Manufacturing.
Model BD4859L51A Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4 per reel. See Model Numbers below for further ordering information. ØA ØC ØD QUANTITY/REEL 4 TABLE 1 REEL DIMENSIONS (inches [mm]) ØA B ØC ØD 7. [177.8].32 [8.] 2. [5.8].512 [13.] B Available on Tape and Reel for Pick and Place Manufacturing. (315) 432-899 (8) 411-6596
Model BD4859L51A (315) 432-899 (8) 411-6596 Available on Tape and Reel for Pick and Place Manufacturing.