HMC1044LP3E. Programmable Harmonic Filters - SMT. Functional Diagram. General Description

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Typical Applications The HMC144LP3E is ideal for wideband transceiver harmonic filtering applications including: Filtering lo Harmonics to Reduce Modulator Sideband Rejection & Demodulator Image Rejection Amplifier Harmonic Filtering RF Filtering Functional Diagram Features Programmable Bandwidth: 1 to 3 GHz Compatible with Narrowband & Wideband: PLLs with Integrated VCOs Modulators Demodulators LO Harmonic Rejection: ~2 db Improves Modulator/Demodulator Sideband/Image Rejection Performance: 2 db Typical Single-Ended or Differential Options Footprint up to 9% Smaller than Current Discrete Fixed Bandwidth Solutions 16 Lead 3x3 mm smt Package General Description The HMC144LP3E is a programmable bandwidth LPF (Low Pass Filter) targeted at all applications that use quadrature modulators and/or demodulators. The HMC144LP3E filters out lo harmonics and ensures little or no lo contribution to modulator sideband rejection or demodulator image rejection performance. Although targeted at lo filtering applications, the HMC144LP3E can be used to filter all RF harmonics such as the ones generated by amplifiers. The HMC144LP3E offers a choice of 16 programmable bands, optimized for high and low cellular bands ranging from 1 to 3 GHz, making the HMC144LP3E a truly wideband part compatible with wideband PLLs with Integrated VCOs and wideband quadrature modulators and demodulators. It enables wideband multi-standard, multi-carrier designs that are field configurable on-the-fly for each individual application. The HMC144LP3E is packaged in a compact 3x3 mm QFN leadless package. 1

Electrical Specifications, T A = +25 C, V3 = 3.3 V (3 V to 3.5 V) Parameter Min. Typ. Max. Units Single-Ended Passband [1] 25 36 MHz ƒcutoff [2] Tuning Range (3 db Loss) 125 36 MHz Passband Flatness 2.5 db Passband Insertion Loss 3 5 db Return Loss 1 db Input/Output Impedance 5 Ω Input IP3 (inband) 43 dbm Differential Passband [1] 25 34 MHz ƒcutoff [2] Tuning Range (3 db Loss) 97 34 MHz Passband Flatness 2.5 db Passband Insertion Loss 3 5 db Return Loss 1 db Input/Output Impedance 1 Ω Input IP3 (inband) 43 dbm Supplies DC Supply 3 3.3 3.5 V Supply Current 1 ua Digital Inputs Digital Input Low Level (VIL).4 V Digital Input High Level (VIH) 1.5 V [1] Minimum frequency is limited by external DC blocking capacitor. Displayed value corresponds to default evaluation board configuration of 1 pf. [2] ƒcutoff defined as the point at which the insertion loss is 3 db below the passband insertion loss @ 5 MHz. 2

Figure 1. Single-Ended Insertion Loss [1] Figure 2. Differential Insertion Loss [1] INSERTION LOSS (db) -5-1 -15-2 -25-3 -35 Band Low Bands High Bands Band 7-4 1 2 3 4 5 6 7 8 9 Band 8 Band 15 Figure 3. Single-Ended Insertion Loss Over Supply Voltage [1] INSERTION LOSS (db) -1-2 -3-4 -5 1 2 3 4 5 6 7 8 9-5 Band, 3 V, 3.3 V & 3.5 V Band 8, 3 V, 3.3 V & 3.5 V Band 7, 3 V, 3.3 V & 3.5 V Band 15, 3 V, 3.3 V & 3.5 V INSERTION LOSS (db) INSERTION LOSS (db) -5-1 -15-2 -25-3 -35 Band Low Bands High Bands Band 7-4 1 2 3 4 5 6 7 8 9-1 -2-3 -4 Band 25 C 85 C -4 C Band 7 Band 8 Band 8 Band 15 Figure 4. Single-Ended Insertion Loss Over Temperature [1] -5 1 2 3 4 5 6 7 8 9-5 Figure 5. Single-Ended Return Loss [1] Figure 6. Differential Return Loss [1] Band 15 RETURN LOSS (db) -1-15 -2-25 Band Band7 Band8 Band15 RETURN LOSS (db) -1-15 -2-25 Band Band7 Band8 Band15-3 1 2 3 4 5 6 7 8 9-3 1 2 3 4 5 6 7 8 9 [1] Low frequency performance limited by external DC blocking capacitors at RF input and output. 3

Figure 7. Single-Ended Return Loss vs. V3 [1] RETURN LOSS (db) -5-1 -15-2 -25 Band, 3 V, 3.3 V & 3.5 V Band 7, 3 V, 3.3 V & 3.5 V Band 8, 3 V, 3.3 V & 3.5 V -3 1 2 3 4 5 6 7 8 9 Band 15, 3 V,3.3 V & 3.5 V Figure 9. Single-Ended Filter Group Delay [1] GROUP DELAY (ns).8.7.6.5.4.3 Band Band 7 5 1 15 2 25 3 35 4 Band 8 Band 15 Figure 8. Single-Ended Return Loss vs. Temperature [1] RETURN LOSS (db) -5-1 -15-2 -25 Band Band 7 Band 8 25 C 85 C -4 C -3 1 2 3 4 5 6 7 8 9 Band 15 [1] Low frequency performance limited by external DC blocking capacitors at RF input and output. 4

HMC144LP3E Frequency Bands Typical 3 db Cutoff Frequency Relative to 5 MHz HMC144LP3E Band Setting Single-Ended Differential 125 97 1 15 1 2 175 13 3 115 155 4 113 185 5 116 112 6 1195 1155 7 1225 1195 8 223 2335 9 23 243 1 238 253 11 2465 2655 12 255 277 13 2675 294 14 285 3145 15 36 34 5

Absolute Maximum Ratings Reliability Information V3 RF Power Input Digital Input Voltage Range Outline Drawing Parameter Rating Package Information -.3 to +3.6 V 18 dbm -.3 to +3.6 V Storage Temperature -65 to +15 C Reflow Soldering Peak Temperature 26 C Time at Peak Temperature 4 sec ELECTROSTATIC SENSITIVE DEVICE observe HANDling PrecaUtions NOTES: [1] PACKage body material: low stress injection molded Plastic silica and silicon impregnated. [2] lead and ground PADDLE material: copper alloy. [3] lead and ground PADDLE Plating: 1% matte tin. [4] Dimensions are in inches [millimeters]. [5] lead SPacing tolerance is non-cumulative. [6] PAD BURR length SHall be.15 mm max. PAD BURR HeigHT SHall be.5 mm max. [7] PACKage WARP SHall not EXceeD.5 mm [8] all ground leads and ground PADDLE MUST be soldered TO PCB RF ground. [9] refer TO Hittite APPlication note FOR SUggesteD PCB land PATtern. Maximum Junction Temperature 125 C Operating Temperature -4 to +85 C ESD Rating (HBM) Class 2 Thermal Resistance 9 C/W Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] [2] 144 HMC144LP3E RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 26 C 6

Pin Descriptions Pin Number Function Description Interface Schematic 1, 4, 5, 6, 7, 8, 9, 12 2 OUT_N 3 OUT_P 1 IN_P 11 IN_N These pins and exposed paddle must be connected to RF/DC ground. This pin is DC coupled and matched to 5 Ohms. External voltage must not be applied to this pin. [1] This pin is DC coupled and matched to 5 Ohms. External voltage must not be applied to this pin. [1] This pin is DC coupled and matched to 5 Ohms. External voltage must not be applied to this pin. [1] This pin is DC coupled and matched to 5 Ohms. External voltage must not be applied to this pin. [1] 13 SEN Serial Port Enable (cmos) Logic Input 14 SCK Serial Port Clock (cmos) Logic Input 15 SDI Serial Port Data (cmos) Logic Input 16 V3 DC Power Supply [1] Although the pins are DC coupled they require external ac coupling for proper operation. Please refer to Evaluation PCB Schematic for more information. 7

Evaluation PCB The circuit board used in the application should use RF circuit design techniques. Signal lines should have 5 Ohms impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Evaluation Order Information Item Contents Part Number Evaluation PCB Only HMC144LP3E Evaluation PCB EVAL1-HMC144LP3E Evaluation Kit HMC144LP3E Evaluation PCB USB Interface Board 6 USB A Male to USB B Female Cable CD rom (Contains User Manual, Evaluation PCB Schematic, Evaluation Software) EKit1-HMC144LP3E 8

Evaluation PCB Schematic 2 1 B A NOTICE OF PROPRIETARY PROPERTY: THIS DOCUMENT AND THE INFORMATION CONTAINED IN IT ARE THE PROPRIETARY PROPERTY OF HITTITE MICROWAVE CORPORATION. IT MAY NOT BE COPIED IN ANY MANNER NOR MAY ANY OF THE INFORMATION IN OR UPON IT BE USED FOR ANY PURPOSE WITHOUT THE EXPRESSED WRITTEN CONSENT OF AN AUTHORIZED AGENT OF HITTITE MICROWAVE CORPORATION. 3.3V TP2 J5 J4 TP1 FB1 1K 2 3.3V C3.1UF C6 1UF.1UF C4 C7.1UF 1 2 OUT_N 3 OUT_P 4 REVISIONS REV ECN# ZONE DESCRIPTION NAME DATE 1 QC111299 ----- ENGINEERING RELEASE D. ACEVAL 2/1/211 A CP12371 ---- PRODUCTION RELEASE D. ACEVAL 3/5/212 16 V3 5 15 SDI 6 SPI 14 SCK 7 SCK SD1 13 SEN 8 SEN SSW-16-1-T-D 1 2 3 4 5 6 7 8 9 1 11 12 J1 U1 12 11 IN_N 1 IN_P 9 HMC144LP3E TITLE PROJECT DRAWING #: DRAWN BY R1 HITTITE MICROWAVE CORPORATION 2 Alpha Rd Chelmsford, MA 1824 SCH, CUSTOMER EVALUATION HMC144LP3E 13-329- D. ACEVAL 1 R2 3.3V C5 1UF.1UF C1 C2.1UF DATE 3.3V 1/1/21 J2 J3 SHEET SHEET 1 OF 1 CODE ID NO. SIZE REV 1CN88 A A 15-3-212_13:47 B A 9

HMC144LP3E Application Information The HMC144LP3E is an ideal lo harmonic filter for wideband applications featuring quadrature modulators and/or demodulators. The HMC144LP3E s 16 user programmable bands enable the user to optimally attenuate 2nd and/ or 3rd lo harmonics in order to maximize quadrature modulator/demodulator sideband/image rejection performance. Typical diagrams with the HMC144LP3E are shown in Figure 1 and Figure 11. Figure 1. Typical HMC144LP3E transmitter application Figure 11. Typical HMC144LP3E receiver application Background, LO Harmonics and Modulator/Demodulator Sideband/Image Rejection Most wideband quadrature modulators/demodulators in the market use some form of a filter to create the required in-phase and quadrature lo components at the fundamental frequency of the lo (1xLO). Others, less common modulators/demodulators accept lo input at 2xLO frequency and are not based upon filters. The 1xLO types are particularly sensitive to lo 3rd harmonic levels, while the 2xLO types are more sensitive to 2nd harmonic levels. Harmonics are normally present in all VCOs and especially in RFICs with integrated VCOs. High lo harmonic content causes amplitude and phase mismatches, and ultimately performance degradation in modulator sideband rejection and demodulator image rejection, as shown in Figure 12. 1

hmc71 Sweeper Plot 11:18:12 AM 3/19/212 MODULATOR SIDEBAND REJECTION (dbc) -1-2 -3-4 -5-6 -7-8 Targeted minimum LO harmonic level Targeted maximum modulator sideband rejection 3rd LO Harmonic 2nd LO Harmonic -8-7 -6-5 -4-3 -2-1 LO HARMONIC LEVEL (dbc) Figure 12. Typical impact of 2nd and 3rd lo harmonic on modulator sideband rejection. [1] Figure 12 shows a typical modulator with 1xLO input, where both the 2nd and 3rd lo harmonics affect the modulator sideband rejection performance at levels > -2 dbc relative to the lo signal power. It also shows that the 3rd lo harmonic has greater impact on modulator sideband rejection performance than the 2nd, and that there is little effect of the 2nd lo harmonic on modulator sideband rejection once the 2nd lo harmonic is below -2 dbc levels, relative to the lo signal level. The HMC144LP3E is designed to ensure that the 2nd and the 3rd lo harmonics are below -2 dbc relative to the LO signal level across the entire operating range of Hittite s wideband PLLs with integrated VCOs. Thereby ensuring little or no lo contribution is added to modulator/demodulator sideband/image rejection performance degradation. Using the HMC144LP3E Modulator/demodulator sideband/image rejection performance is specific to each individual modulator/demodulator, and depends on a number of other variables including: type (1xLO or 2xLO input), balance (amplitude and phase matching), signal path matching and interface to other components, board layout, input signal bandwidth, and lo harmonics. Figure 12 shows that typically the lo harmonics stop being a dominant contributor to modulator/demodulator sideband/image rejection performance degradation once they are below approximately -2 dbc relative to the lo signal level. However, the exact level at which harmonics cease being the dominant contributor to sideband/image rejection performance depends on each individual modulator/demodulator and each individual design. Hence, the optimal band selection of the HMC144LP3E may be different for different designs. Figure 13 shows optimal 3rd harmonic attenuation achieved with the HMC144LP3E without optimizing the 2nd harmonic, when the HMC83LP6GE PLL with Integrated VCO is used as an LO to drive the HMC697LP4E quadrature modulator. The corresponding HMC144LP3E band selections are shown in Figure 14. [1] Measured with HMC697LP4E direct modulator at 2 GHz, with lo input power = dbm, 1xLO type. 11

16 HARMONIC LEVEL (dbc) -1-2 -3-4 -5-6 Filtered Unfiltered Targeted Harmonic Levels 3rd LO Harmonic 2nd LO Harmonic 5 1 15 2 25 3 LO FUNDAMENTAL Figure 13. Maximum HMC144LP3E attenuation of 3rd harmonic of the LO [2] SELECTED BAND 14 12 1 8 6 4 2 5 1 15 2 25 3 LO Figure 14. HMC144LP3E band selection corresponding to Figure 13 Observing the results shown in Figure 13 in the context of targeted performance in Figure 12; It is apparent that the HMC144LP3E attenuates both the 3rd and the 2nd lo harmonics to well below the targeted maximum lo harmonic level shown in Figure 12, ensuring that the targeted modulator sideband rejection performance is achieved. Figure 15 shows the optimal 2nd harmonic attenuation achieved with the HMC144LP3E, when the HMC83LP6GE PLL with Integrated VCO is used as an lo to drive the HMC697LP4E quadrature modulator. The corresponding HMC144LP3E band selection is shown in Figure 16. HARMONIC LEVEL (dbc) -1-2 -3-4 -5-6 Unfiltered Filtered 3rd LO Harmonic 2nd LO Harmonic Targeted Harmonic Levels 5 1 15 2 25 3 LO FUNDAMENTAL Figure 15. Maximum HMC144LP3E attenuation of 2nd harmonic of the lo [2] SELECTED BAND 2 15 1 5-5 5 1 15 2 25 3 LO Figure 16. HMC144LP3E band selection corresponding to Figure 15 Observing the results shown in Figure 15 in the context of the targeted performance in Figure 12; it is apparent that the HMC144LP3E attenuates both the 3rd and the 2nd lo harmonics to well below the targeted maximum lo harmonic level shown in Figure 12, ensuring that the targeted modulator sideband rejection performance shown in Figure 12 is achieved. Using the relationship between sideband/image rejection vs. lo harmonic distortion in Figure 12 as a reference, it can be observed that both approaches (maximizing 2nd harmonic attenuation in Figure 13, and maximizing 3rd harmonic attenuation in Figure 14) achieve sideband/image rejection performance improvement, and effectively remove any LO contribution to sideband/image rejection performance degradation. However, Figure 12 suggests that, when using a 1xLO type modulator, more emphasis should be placed on attenuating the 3rd harmonic than the second because the 2nd harmonic ceases to be a contributor at levels ~<-2 dbc, while the 3rd harmonic continues contributing to sideband/image rejection, albeit at a smaller rate for the particular design characterized in Figure 12. [2] Measured with HMC83LP6GE as an lo and HMC697LP4E modulator. The HMC83LP6GE was used in single-ended output configuration. 12

Figure 17 shows the maximum sideband rejection achieved without calibrating the modulator, both with and without the HMC144LP3E. It is generated by selecting the HMC144LP3E band that achieves maximum uncalibrated sideband rejection for each particular frequency accross a very wide bandwidth. The corresponding HMC144LP3E band settings are shown in Figure 18. UNCALIBRATED SIDEBAND REJECTION (dbc) -1-2 -3-4 -5-6 Without HMC144LP3E With HMC144LP3E Targeted Image/Sideband Rejection Performance 5 1 15 2 25 3 LO Figure 17. Optimal uncalibrated modulator sideband rejection with and and without HMC144LP3E, single-ended lo configuration [3] SELECTED BAND 2 15 1 5-5 5 1 15 2 25 3 LO Figure 18. HMC144LP3E band selection corresponding to Figure 17 Results shown in Figure 17 confirm that the HMC144LP3E improves modulator sideband rejection ~2 db across the wideband operation of the modulator and PLL with integrated VCO. Sideband rejection performance improvements less than ~2 db occur at those frequencies where the lo harmonics are not a dominant contributor to sideband rejection, ie. where sideband rejection performance is already good. The corresponding HMC144LP3E band selections shown in Figure 18 are closer to those shown in Figure 14, than those from Figure 16. This confirms the data shown in Figure 12, and the postulation that the 3rd lo harmonic is a greater contributor to modulator sideband rejection degradation than the 2nd for 1xLO type modulators/demodulators. Another variable that should be considered is the insertion loss of the HMC144LP3E which can vary ~2.5 db across the pass band of the selected band setting as shown in Figure 1 and Figure 2. The selected HMC144LP3E band that results in optimal sideband/image rejection performance also depends on the lo input power at the modulator/ demodulator, which is specific to each individual design. It depends on the output power of the PLL with integrated VCO (that is used as an lo) at each frequency, insertion loss of the HMC144LP3E at the selected band setting, lo frequency, and the required modulator/demodulator lo input power. The harmonic attenuation and sideband rejection graphs in this section were generated by maintaining the minimum lo input power into the HMC697LP4E at -3 dbm across all frequencies, which falls well into the required lo input power specification in the HMC697LP4E data sheet of greater than -6 dbm and less than 6 dbm. For applications that require a flat output power response, over a wide bandwidth, it should be noted that it is possible to build a low harmonic source with flat output power over a wideband using a leveling loop based upon the HMC83LP6GE wideband PLL with integrated VCO, the HMC144LP3E variable LPF, and the HMC993LP5E agc. [3] Measured with HMC83LP6GE as an lo and HMC697LP4E modulator. The HMC83LP6GE was used in single-ended output configuration. 13

Serial Port Interface (SPI) The HMC144LP3E SPI has only write and no read capability. It features a three wire serial port for simple communication with the host controller. The HMC144LP3E has a 3-bit chip address which is fixed as 6b. Serial Port write Operation Main SPI Timing Characteristics V3 = 3.3 V (3 V to 3.5 V), = V Parameter Conditions Min Typ Max Units t 1 SDI to sck Setup Time 8 nsec t 2 SDI to sck Hold Time 8 nsec t 3 SCK High Duration 1 nsec t 4 SCK Low Duration 1 nsec t 5 sen Low Duration 2 nsec t 6 sen High Duration 2 nsec t 7 SCK to sen [a] 8 nsec a. sen must rise after the 16th falling edge of sck but before the next rising sck edge. If sck is shared amongst several devices this timing must be respected. A typical write cycle is shown in Figure 19. 1. The Master asserts sen (active low Serial Port Enable) followed by a rising edge of sck. 2. The HMC144LP3E reads SDI (the msb) on the 1st rising edge of sck after sen active low. 3. The HMC144LP3E registers the data bits in the next 8 rising edges of sck (for a total of 9 data bits). 4. The host places 4 register address bits on the next 4 falling edges of sck (msb to lsb) while the HMC144LP3E reads the address bits on the corresponding rising edge of sck. 5. The host places 3 chip address bits on the next 3 falling edges of sck (msb to lsb). Note the HMC144LP3E chip address is fixed as 6d or 11 b. Figure 19. Serial port write timing diagram 14

Register Map Reg 1h - Autotune Bit Name Width Default Description [15:] Autotune 4 15 Band setting - lowest band 15 - highest band 15

NOTES: 16