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2-V to 6-V V CC Operation Inputs Accept Voltages to 6 V Max t pd of 9 ns at 5 V SN54AC86... J OR W PACKAGE SN74AC86... D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 V CC 4B 4A 4Y 3B 3A 3Y 1Y NC 2A NC 2B SCAS533C AUGUST 1995 REVISED OCTOBER 2003 SN54AC86... FK PACKAGE (TOP VIEW) 1B 1A NC V CC 4B 3 4 2 1 20 19 18 5 6 7 17 16 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A description/ordering information NC No internal connection The AC86 devices are quadruple 2-input exclusive-or gates. The devices perform the Boolean function Y = A B or Y = AB + AB in positive logic. A common application is as a true/complement element. If one of the inputs is low, the other input is reproduced in true form at the output. If one of the inputs is high, the signal on the other input is reproduced inverted at the output. TA ORDERING INFORMATION PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP N Tube SN74AC86N SN74AC86N Tube SN74AC86D SOIC D Tape and reel SN74AC86DR AC86 40 C to 85 C SOP NS Tape and reel SN74AC86NSR AC86 SSOP DB Tape and reel SN74AC86DBR AC86 TSSOP PW Tube Tape and reel SN74AC86PW SN74AC86PWR AC86 CDIP J Tube SNJ54AC86J SNJ54AC86J 55 C to 125 C CFP W Tube SNJ54AC86W SNJ54AC86W LCCC FK Tube SNJ54AC86FK SNJ54AC86FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1

SCAS533C AUGUST 1995 REVISED OCTOBER 2003 FUNCTION TABLE (each gate) INPUTS OUTPUT A B Y L L L L H H H L H H H L exclusive-or logic An exclusive-or gate has many applications, some of which can be represented better by alternative logic symbols. EXCLUSIVE OR = 1 These five equivalent exclusive-or symbols are valid for an AC86 gate in positive logic; negation may be shown at any two ports. LOGIC-IDENTITY ELEMENT EVEN-PARITY ELEMENT ODD-PARITY ELEMENT = 2k 2k + 1 The output is active (low) if all inputs stand at the same logic level (i.e., A = B). The output is active (low) if an even number of inputs (i.e., 0 or 2) are active. The output is active (high) if an odd number of inputs (i.e., only 1 of the 2) are active. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, V CC.......................................................... 0.5 V to 7 V Input voltage range, V I (see Note 1)........................................... 0.5 V to V CC + 0.5 V Output voltage range, V O (see Note 1)........................................ 0.5 V to V CC + 0.5 V Input clamp current, I IK (V I < 0 or V I > V CC )................................................ ±20 ma Output clamp current, I OK (V O < 0 or V O > V CC )............................................ ±20 ma Continuous output current, I O (V O = 0 to V CC ).............................................. ±50 ma Package thermal impedance, θ JA (see Note 2): D package................................... 86 C/W DB package................................. 96 C/W N package................................... 80 C/W NS package................................. 76 C/W PW package................................ 113 C/W Storage temperature range, T stg................................................... 65 C to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

recommended operating conditions (see Note 3) SCAS533C AUGUST 1995 REVISED OCTOBER 2003 SN54AC86 SN74AC86 MIN MAX MIN MAX VCC Supply voltage 2 6 2 6 V VCC = 3 V 2.1 2.1 VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V VCC = 5.5 V 3.85 3.85 VCC = 3 V 0.9 0.9 VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V VCC = 5.5 V 1.65 1.65 VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V VCC = 3 V 12 12 IOH High-level output current VCC = 4.5 V 24 24 ma VCC = 5.5 V 24 24 VCC = 3 V 12 12 IOL Low-level output current VCC = 4.5 V 24 24 ma VCC = 5.5 V 24 24 t/ v Input transition rise or fall rate 8 8 ns/v TA Operating free-air temperature 55 125 40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VOL TA = 25 C SN54AC86 SN74AC86 MIN TYP MAX MIN MAX MIN MAX 3 V 2.9 2.9 2.9 IOH = 50 µa 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 IOH = 12 ma 3 V 2.56 2.4 2.46 IOH = 24 ma 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 IOH = 50 ma 5.5 V 3.85 IOH = 75 ma 5.5 V 3.85 3 V 0.002 0.1 0.1 0.1 IOL = 50 µa 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 IOL = 12 ma 3 V 0.36 0.5 0.44 IOL = 24 ma 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 IOL = 50 ma 5.5 V 1.65 IOL = 75 ma 5.5 V 1.65 II VI = VCC or GND 5.5 V ±0.1 ±1 ±1 µa ICC VI = VCC or GND, IO = 0 5.5 V 2 40 20 µa Ci VI = VCC or GND 5 V 2.6 pf Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. UNIT UNIT V V POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3

SCAS533C AUGUST 1995 REVISED OCTOBER 2003 switching characteristics over recommended operating free-air temperature range, V CC = 3.3 V 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tplh tphl FROM TO TA = 25 C SN54AC86 SN74AC86 (INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX 2 6.5 11.5 1 14 1.5 12.5 A or B Y 2 6 11.5 1 14 1.5 12.5 UNIT ns switching characteristics over recommended operating free-air temperature range, V CC = 5 V 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tplh tphl FROM TO TA = 25 C SN54AC86 SN74AC86 (INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX 1.5 4.5 8.5 1 10 1 9 A or B Y 1.5 4.5 8.5 1 10 1 9.5 UNIT ns operating characteristics, V CC = 5 V, T A = 25 C PARAMETER TEST CONDITIONS TYP UNIT Cpd Power dissipation capacitance CL = 50 pf, f = 1 MHz 25 pf 4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION SCAS533C AUGUST 1995 REVISED OCTOBER 2003 2 VCC From Output Under Test CL = 50 pf (see Note A) 500 Ω 500 Ω S1 Open TEST tplh/tphl S1 Open LOAD CIRCUIT tw 2.7 V Input 50% VCC 50% VCC VOLTAGE WAVEFORMS 0 V Input 50% VCC 50% VCC VCC 0 V Timing Input 50% VCC VCC 0 V In-Phase Output tplh 50% VCC tphl VOH 50% VCC VOL tsu th tphl tplh Data Input 50% VCC 50% VCC VCC 0 V Out-of-Phase Output 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS NOTES: A. B. CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 Ω, tr 2.5 ns, tf 2.5 ns. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5

PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) 5962-89550012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-89550012A SNJ54AC 86FK Device Marking 5962-8955001CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8955001CA SNJ54AC86J 5962-8955001DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8955001DA SNJ54AC86W SN74AC86D ACTIVE SOIC D 14 50 Green (RoHS SN74AC86DBR ACTIVE SSOP DB 14 2000 Green (RoHS SN74AC86DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS SN74AC86DE4 ACTIVE SOIC D 14 50 Green (RoHS SN74AC86DG4 ACTIVE SOIC D 14 50 Green (RoHS SN74AC86DR ACTIVE SOIC D 14 2500 Green (RoHS SN74AC86DRE4 ACTIVE SOIC D 14 2500 Green (RoHS SN74AC86N ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN74AC86NSR ACTIVE SO NS 14 2000 Green (RoHS SN74AC86NSRG4 ACTIVE SO NS 14 2000 Green (RoHS SN74AC86PW ACTIVE TSSOP PW 14 90 Green (RoHS SN74AC86PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS SN74AC86PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 SN74AC86N (4/5) Samples Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan SN74AC86PWR ACTIVE TSSOP PW 14 2000 Green (RoHS SN74AC86PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS SN74AC86PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) SNJ54AC86FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-89550012A SNJ54AC 86FK Device Marking SNJ54AC86J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8955001CA SNJ54AC86J SNJ54AC86W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8955001DA SNJ54AC86W (4/5) Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS : TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54AC86, SN74AC86 : Catalog: SN74AC86 Military: SN54AC86 NOTE: Qualified Version Definitions: Catalog - TI's standard catalog product Military - QML certified for Military and Defense Applications Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant SN74AC86DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74AC86DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74AC86NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74AC86PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AC86DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74AC86DR SOIC D 14 2500 367.0 367.0 38.0 SN74AC86NSR SO NS 14 2000 367.0 367.0 38.0 SN74AC86PWR TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2

SCALE 0.900 PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE PIN 1 ID (OPTIONAL) A 4X.005 MIN [0.13].015-.060 TYP [ 0.38-1.52] 12X.100 [2.54] 1 14 14X.045-.065 [ 1.15-1.65] 14X.014-.026 [ 0.36-0.66].010 [0.25] C A B.754-.785 [ 19.15-19.94] 7 8 B.245-.283 [ 6.22-7.19].308-.314 [ 7.83-7.97] AT GAGE PLANE.2 MAX TYP [5.08] C.13 MIN TYP [3.3] SEATING PLANE.015 GAGE PLANE [0.38] 0-15 TYP 14X.008-.014 [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com

J0014A EXAMPLE BOARD LAYOUT CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE SEE DETAIL A (.300 ) TYP [7.62] SEE DETAIL B 1 14 12X (.100 ) [2.54] SYMM 14X (.039) [1] 7 8 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X.002 MAX [0.05] ALL AROUND (.063) [1.6] SOLDER MASK OPENING METAL (.063) [1.6] METAL (R.002 ) TYP [0.05] DETAIL A SCALE: 15X SOLDER MASK OPENING DETAIL B 13X, SCALE: 15X.002 MAX [0.05] ALL AROUND 4214771/A 05/2017 www.ti.com

MECHANICAL DATA MSSO002E JANUARY 1995 REVISED DECEMBER 2001 DB (R-PDSO-G**) 28 PINS SHOWN PLASTIC SMALL-OUTLINE 0,65 0,38 0,22 0,15 M 28 15 5,60 5,00 8,20 7,40 0,25 0,09 Gage Plane 1 14 0,25 A 0 8 0,95 0,55 2,00 MAX 0,05 MIN Seating Plane 0,10 DIM PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065 /E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED AS IS AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer s noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2017, Texas Instruments Incorporated