FCB20N60 N-Channel SuperFET MOSFET 600 V, 20 A, 190 mω Features 650 V @T J = 150 C Typ. R DS(on) = 150 m Ultra Low Gate Charge (Typ. Q g = 75 nc) Low Effective Output Capacitance (Typ. C oss.eff = 165 pf) 100% Avalanche Tested RoHS Compliant Application Lighting AC-DC Power Supply Solar Inverter Description October 2013 SuperFET MOSFET is Fairchild Semiconductor s first generation of high voltage super-junction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low onresistance and lower gate charge performance. This technology is tailored to minimize conduction loss, provide superior switching performance, dv/dt rate and higher avalanche energy. Consequently, SuperFET MOSFET is very suitable for the switching power applications such as PFC, server/telecom power, FPD TV power, ATX power and industrial power applications. D D G S D 2 -PAK G MOSFET Maximum Ratings T C = 25 o C unless otherwise noted S Symbol Parameter FCB20N60TM Unit S Drain to Source Voltage 600 V Drain Current - Continuous (T C = 25 o C) 20 - Continuous (T C = 100 o C) 12.5 A M Drain Current - Pulsed (Note 1) 60.0 A S Gate to Source Voltage ±30 V E AS Single Pulsed Avalanche Energy (Note 2) 690 mj I AR Avalanche Current (Note 1) 20 A E AR Repetitive Avalanche Energy (Note 1) 20.8 mj dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns P D Power Dissipation (T C = 25 o C) 208 W - Derate above 25 o C 1.67 W/ o C T J, T STG Operating and Storage Temperature Range -55 to +150 o C T L Maximum Lead Temperature for Soldering Purpose, 1/8 from Case for 5 Seconds 300 o C Thermal Characteristics Symbol Parameter FCB20N60TM Unit R JC Thermal Resistance, Junction to Case, Max 0.6 R JA Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max. 62.5 Thermal Resistance, Junction to Ambient (1 in 2 pad of 2 oz copper), Max. 40 o C/W 1
Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FCB20N60 FCB20N60TM D 2 -PAK 330mm 24m 800 Electrical Characteristics T C = 25 o C unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Unit Off Characteristics BS Drain to Source Breakdown Voltage = 0 V, = 250 A, T C = 25 o C 600 - - V = 0 V, = 250 A, T C = 150 o C - 650 - V BS Breakdown Voltage Temperature / T J Coefficient = 250 A, Referenced to 25 o C - 0.6 - V/ o C B Drain-Source Avalanche Breakdown Voltage = 0 V, = 20 A - 700 - V SS Zero Gate Voltage Drain Current = 600 V, = 0 V - - 1 = 480 V, = 0 V, T C = 125 o C - - 10 A I GSS Gate to Body Leakage Current = ±30 V, = 0 V - - ±100 na On Characteristics (th) Gate Threshold Voltage =, = 250 A 3.0-5.0 V R DS(on) Static Drain to Source On Resistance = 10 V, = 10 A - 0.15 0.19 g FS Forward Transconductance = 40 V, = 10 A - 17 - S Dynamic Characteristics C iss Input Capacitance - 2370 3080 pf = 25 V, = 0 V C oss Output Capacitance - 1280 1665 pf f = 1.0 MHz C rss Reverse Transfer Capacitance - 95 - pf C oss Output Capacitance = 480 V, = 0 V, f = 1.0 MHz - 65 85 pf C oss eff. Effective Output Capacitance = 0 V to 400 V, = 0 V - 165 - pf Switching Characteristics t d(on) Turn-On Delay Time - 62 135 ns t r Turn-On Rise Time = 300 V, = 20 A - 140 290 ns t d(off) Turn-Off Delay Time R G = 25-230 470 ns t f Turn-Off Fall Time (Note 4) - 65 140 ns Q g(tot) Total Gate Charge at 10V = 480 V, = 20 A, - 75 98 nc Q gs Gate to Source Gate Charge = 10 V - 13.5 18 nc Q gd Gate to Drain Miller Charge (Note 4) - 36 - nc Drain-Source Diode Characteristics I S Maximum Continuous Drain to Source Diode Forward Current - - 20 A I SM Maximum Pulsed Drain to Source Diode Forward Current - - 60 A V SD Drain to Source Diode Forward Voltage = 0 V, I SD = 20 A - - 1.4 V t rr Reverse Recovery Time = 0 V, I SD = 20 A - 530 - ns Q rr Reverse Recovery Charge di F /dt = 100 A/ s - 10.5 - C Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. I AS = 10 A, = 50 V, R G = 25, Starting T J = 25 C 3. I SD 20 A, di/dt 200 A/ s, BS, Starting T J = 25 C 4. Essentially Independent of Operating Temperature Typical Characteristics 2
Typical Performance Characteristics Figure 1. On-Region Characteristics 10 2 Top : 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V 10 1 Bottom : 5.5 V 10-1 10 1, Drain-Source Voltage [V] 1. 250 s Pulse Test 2. T C = 25 C Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 2. Transfer Characteristics 10 2 10 1 25 C 150 C -55 C Note 1. = 40V 2. 250 s Pulse Test 2 4 6 8 10, Gate-Source Voltage [V] Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 0.4 10 2 R DS(ON) [O ], Drain-Source On-Resistance 0.3 0.2 0.1 = 10V = 20V Note : T J = 25 C R, Reverse Drain Current [A] 10 1 150 C 25 C 1. = 0V 2. 250 s Pulse Test 0.0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 V SD, Source-Drain Voltage [V] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics Capacitance [pf] 10000 9000 8000 7000 6000 5000 4000 3000 2000 1000 C rss C iss C oss C iss = C gs + C gd (C ds = shorted) C oss = C ds + C gd C rss = C gd 1. = 0 V 2. f = 1 MHz, Gate-Source Voltage [V] 12 10 8 6 4 2 = 250V = 400V = 100V Note : = 20A 0 10-1 10 1, Drain-Source Voltage [V] 0 0 10 20 30 40 50 60 70 80 Q G, Total Gate Charge [nc] 3
Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature BS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 0.9 1. = 0 V 2. = 250 A 0.8-100 -50 0 50 100 150 200 T J, Junction Temperature [ C] Figure 9. Maximum Safe Operating Area Figure 8. On-Resistance Variation vs. Temperature R DS(ON), (Normalized) Drain-Source On-Resistance 3.0 2.5 2.0 1.5 1.0 0.5 0.0-100 -50 0 50 100 150 200 T J, Junction Temperature [ C] Figure 10. Maximum Drain Current vs. Case Temperature 1. = 10 V 2. = 20 A Operation in This Area 10 2 is Limited by R DS(on) 25 100 us 20 10 1 10-1 1. T C = 25 C 2. T J = 150 C 3. Single Pulse 1 ms 10 ms DC 15 10 5 10-2 10 1 10 2 10 3, Drain-Source Voltage [V] 0 25 50 75 100 125 150 T C, Case Temperature [ C] Figure 11. Transient Thermal Response Curve Z JC Z (t), JC (t), Thermal Response [ o C/W] 10-1 10-2 D=0.5 0.2 0.1 0.05 0.02 0.01 single pulse 1. Z JC (t) = 0.6 C/W Max. 2. Duty Factor, D=t 1 /t 2 3. T JM - T C = P DM * Z JC (t) P DM t 1 t 2 10-5 10-4 10-3 10-2 10-1 10 1 t 1, Square W ave Pulse Duration [sec] 4
12V 200nF I G = const. 3mA 50KΩ Figure 12. Gate Charge Test Circuit & Waveform Same Type as DUT 300nF V GS 10V Q g Q gs Q gd DUT Charge Figure 13. Resistive Switching Test Circuit & Waveforms R L 90% R G V 10 DUT 10% t d(on) t r t d(off) tf t on t off Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms L E AS = ---- 1 LI 2 2 AS BS -------------------- BS - BS I AS R G (t) V 10 DUT (t) t p t p Time 5
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT + I SD Driver _ L R G Same Type as DUT dv/dt controlled by RG I SD controlled by pulse period ( Driver ) Gate Pulse Width D = -------------------------- Gate Pulse Period 10V I FM, Body Diode Forward Current I SD ( DUT ) di/dt I RM Body Diode Reverse Current ( DUT ) Body Diode Recovery dv/dt V SD Body Diode Forward Voltage Drop 6
Mechanical Dimensions TO-263 2L (D 2 PAK) Figure 16. 2LD,TO263, Surface Mount Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: http:///package/packagedetails.html?id=pn_tt263-002 Dimension in Millimeters 7
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