Direct printing tools for flexible hybrid electronics assembly David Grierson, Ph.D. President & CTO of systemech, LLC
We solve the problem of placing ultra-thin, high-performance Si devices onto flexible substrates by providing direct transfer printing tools. Our tools allow device manufacturers to assemble flexible hybrid electronic (FHE) devices. Unlike competing approaches, our technology enables the transfer of ultra-thin Si devices from the fabrication substrate to the flexible substrate in a single step.
Solution: direct transfer printing Device layer Oxide Handle wafer Multi-step die transfer SOI
Solution: direct transfer printing Device layer Oxide Handle wafer Multi-step die transfer SOI Lithography and oxide removal
Solution: direct transfer printing Device layer Oxide Handle wafer Multi-step die transfer SOI Lithography and oxide removal Handle or stamp Transfer to carrier or stamp
Solution: direct transfer printing Device layer Oxide Handle wafer Multi-step die transfer SOI Lithography and oxide removal Handle or stamp Flexible substrate Adhesive Transfer to carrier or stamp Transfer again to flexible substrate
Solution: direct transfer printing Device layer Oxide Handle wafer Handle or stamp Flexible substrate Adhesive Multi-step die transfer SOI Lithography and oxide removal Transfer to carrier or stamp Transfer again to flexible substrate Direct transfer approach Rolling-based Direct transfer Flexible substrate Spatially controlled Flexible substrate
Value proposition Direct transfer approach Rolling-based Transfer thin die and layers (100 nm 10 µm) with diverse geometries and architectures Improve throughput and yield by eliminating intermediate handling/transfer steps Reduce cost of materials and waste by removing need for temporary handling materials Spatially controlled Scalable to high rates and large areas
Technology Rolling-based direct transfer Web Roller Wafer 2 mm
z z (nm) Technology Rolling-based direct transfer Web Roller Wafer 2 mm 20 μm decoupled 500 400 300 200 100 0 SiNM R = 1 cm 0 1 2 3 4 x ( m) x (nm) 20 μm
z z (nm) Technology Rolling-based direct transfer Web Roller Wafer 2 mm 20 μm decoupled 500 400 300 200 100 0 SiNM R = 1 cm 0 1 2 3 4 x ( m) x (nm) 20 μm Spatially controlled direct transfer Indenter Chip
z z (nm) Technology Rolling-based direct transfer Web Roller Wafer 2 mm 20 μm decoupled 500 400 300 200 100 0 SiNM R = 1 cm 0 1 2 3 4 x ( m) x (nm) 20 μm Spatially controlled direct transfer Indenter Chip R = 1 cm 390 nm 0 150 µm 200 µm 20 µm
FHE: A rapidly growing market FHE spans several rapidly growing market segments, including wearable technology ($15-$60B within 10 years), medical devices ($6.3B in 2013), and IoT ($2B $17.6B by 2020) FHE enables a wide range of applications, from consumer devices (e.g., flexible phones and tablets), to imaging and sensing, to health care and homeland security Emerging FHE manufacturing technologies will be implemented commercially within the equipment market for printed and flexible electronics (>$1B in 2020)
Company/Team David Grierson, Ph.D. President & CTO dsgrierson@systemech.com Prof. Kevin Turner Co-founder and Chief Advisor Spin-off from the University of Wisconsin-Madison >$1M in STTR support (AFOSR & NSF) to take our core technology from concept to prototype Printing services now available using our in-house tools Seeking NSF Phase II and follow-on funding for commercialization Looking for strategic partners that are developing FHE devices
Thank you R = 1 cm R = 1 cm 150 µm www.systemech.com info@systemech.com phone: 1.608.571.4327 Thank you. Advancing our ability to manipulate matter at the micro- and nano-scales Check us out at Booth S19 in the Silicon Innovation Village