Ultrafast E Series with High Reverse Energy Capability

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Ultrafast E Series with High Reverse Energy Capability... designed for use in switching power supplies, inverters and as free wheeling diodes, these state of the art devices have the following features: 20 mj Avalanche Energy Guaranteed Excellent Protection Against Voltage Transients in Switching Inductive Load Circuits Ultrafast 75 Nanosecond Recovery Time 175 C Operating Junction Temperature Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction Reverse Voltage to 1000 Volts Mechanical Characteristics: Case: Epoxy, Molded Weight: 1.1 gram (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 220 C Max. for 10 Seconds, 1/16 from case Shipped in plastic bags, 5,000 per bag Available Tape and Reeled, 1500 per reel, by adding a RL suffix to the part number Polarity: Cathode indicated by Polarity Band Marking: MUR480E, MUR4100E MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MUR480E MUR4100E Average Rectified Forward Current (Square Wave) (Mounting Method #3 Per Note 2) Non Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range V RRM V RWM V R 800 1000 I F(AV) 4.0 @ T A = 35 C V A I FSM 70 A T J, T stg 65 to +175 C ULTRAFAST RECTIFIER 4.0 AMPERES 800 1000 VOLTS AXIAL LEAD CASE 267 05 (DO 201AD) STYLE 1 MARKING DIAGRAM MUR4x0E MUR4x0E = Device Code x = 8 or 10 ORDERING INFORMATION Device Package Shipping MUR480E Axial Lead 5000 Units/Bag MUR480ERL Axial Lead 1500/Tape & Reel MUR4100E Axial Lead 5000 Units/Bag MUR4100ERL Axial Lead 1500/Tape & Reel Semiconductor Components Industries, LLC, 2002 May, 2002 Rev. 3 1 Publication Order Number: MUR480E/D

THERMAL CHARACTERISTICS Rating Symbol Value Unit Maximum Thermal Resistance, Junction to Ambient R θja See Note 2 C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (i F = 3.0 Amps, T J = 150 C) (i F = 3.0 Amps, T J = 25 C) (i F = 4.0 Amps, T J = 25 C) Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, T J = 150 C) (Rated dc Voltage, T J = 25 C) Maximum Reverse Recovery Time (I F = 1.0 Amp, di/dt = 50 Amp/µs) (I F = 0.5 Amp, i R = 1.0 Amp, I REC = 0.25 Amp) Maximum Forward Recovery Time (I F = 1.0 Amp, di/dt = 100 Amp/µs, Recovery to 1.0 V) Characteristic Symbol Max Unit v F 1.53 1.75 1.85 i R 900 25 t rr 100 75 Volts µa ns t fr 75 ns Controlled Avalanche Energy (See Test Circuit in Figure 6) W AVAL 20 mj 1. Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%. 2

MUR480E, MUR4100E Figure 1. Typical Forward Voltage MUR480E, MUR4100E Figure 2. Typical Reverse Current* Figure 3. Current Derating (Mounting Method #3 Per Note 2) Figure 4. Power Dissipation Figure 5. Typical Capacitance 3

Figure 6. Test Circuit The unclamped inductive switching circuit shown in Figure 6 was used to demonstrate the controlled avalanche capability of the new E series Ultrafast rectifiers. A mercury switch was used instead of an electronic switch to simulate a noisy environment when the switch was being opened. When S 1 is closed at t 0 the current in the inductor I L ramps up linearly; and energy is stored in the coil. At t 1 the switch is opened and the voltage across the diode under test begins to rise rapidly, due to di/dt effects, when this induced voltage reaches the breakdown voltage of the diode, it is clamped at BV DUT and the diode begins to conduct the full load current which now starts to decay linearly through the diode, and goes to zero at t 2. By solving the loop equation at the point in time when S 1 is opened; and calculating the energy that is transferred to the diode it can be shown that the total energy transferred is equal to the energy stored in the inductor plus a finite amount of energy from the V DD power supply while the diode is in breakdown (from t 1 to t 2 ) minus any losses due to finite Figure 7. Current Voltage Waveforms component resistances. Assuming the component resistive elements are small Equation (1) approximates the total energy transferred to the diode. It can be seen from this equation that if the V DD voltage is low compared to the breakdown voltage of the device, the amount of energy contributed by the supply during breakdown is small and the total energy can be assumed to be nearly equal to the energy stored in the coil during the time when S 1 was closed, Equation (2). The oscilloscope picture in Figure 8, shows the information obtained for the MUR8100E (similar die construction as the MUR4100E Series) in this test circuit conducting a peak current of one ampere at a breakdown voltage of 1300 volts, and using Equation (2) the energy absorbed by the MUR8100E is approximately 20 mjoules. Although it is not recommended to design for this condition, the new E series provides added protection against those unforeseen transient viruses that can produce unexplained random failures in unfriendly environments. EQUATION (1): W AVAL 1 2 LI 2 LPK BV DUT BV DUT V DD CH1 CH2 500V 50mV A 20s 953 V VERT EQUATION (2): W AVAL 1 2 LI 2 LPK 1 ACQUISITIONS 217:33 HRS SAVEREF SOURCE STACK CH1 CH2 REF REF Figure 8. Current Voltage Waveforms 4

NOTE 2 AMBIENT MOUNTING DATA Data shown for thermal resistance junction to ambient (R θja ) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR R θja IN STILL AIR Mounting Lead Length, L (IN) Method 1/8 1/4 1/2 3/4 Units 1 50 51 53 55 C/W 2 R θja 58 59 61 63 C/W 3 28 C/W MOUNTING METHOD 1 P.C. Board Where Available Copper Surface area is small. L L MOUNTING METHOD 2 Vector Push In Terminals T 28 L L É MOUNTING METHOD 3 P.C. Board with 1 1/2 x 1 1/2 Copper Surface L = 1/2 Board Ground Plane 5

PACKAGE DIMENSIONS AXIAL LEAD CASE 267 05 (DO 201AD) ISSUE G B D K A K 6

Notes 7

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303 675 2175 or 800 344 3860 Toll Free USA/Canada Fax: 303 675 2176 or 800 344 3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800 282 9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4 32 1 Nishi Gotanda, Shinagawa ku, Tokyo, Japan 141 0031 Phone: 81 3 5740 2700 Email: r14525@onsemi.com ON Semiconductor Website: For additional information, please contact your local Sales Representative. 8 MUR480E/D