SS5P3S SMD Photovoltaic Solar Cell Protection Schottky Rectifier esmp Series Anode Cathode Anode PRIMARY CHARACTERISTICS I F(AV) 5 A V RRM 30 V I FSM 80 A E AS 0 mj V F at I F = 5 A 0.4 V T J max. 50 C Package Diode variations Single die FEATURES Very low profile - typical height of. mm Ideal for automated placement Guardring for overvoltage protection Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level, per J-STD-00, LF maximum peak of 60 C Material categorization: For definitions of compliance please see www.vishay.com/doc?999 TYPICAL APPLICATIONS For use in solar cell junction box as a bypass diode for protection, using DC forward current without reverse bias. MECHANICAL DATA Case: Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Terminals: Matte tin plated leads, solderable per J-STD-00 and JESD -B0 M3 suffix meets JESD 0 class A whisker test MAXIMUM RATINGS ( unless otherwise noted) PARAMETER SYMBOL SS5P3S UNIT Device marking code 53S Maximum repetitive peak reverse voltage V RRM 30 V 5 Maximum DC forward current (fig. ) I () F 4.5 () A Peak forward surge current 0 ms single half sine-wave superimposed on rated load I FSM 80 A Non-repetitive avalanche energy at I AS =.0 A, T J = 5 C E AS 0 mj Operating junction and storage temperature range T OP, T STG - 55 to + 50 C Junction temperature in DC forward current without reverse bias, t h (3) T J 00 C () Mounted on 30 mm x 30 mm Al PCB with 50 mm x 5 mm x 00 mm fin heat sink () Free air, mounted on recommended copper pad area (3) Meets the requirements of IEC 65 Ed. bypass diode thermal test Revision: -Dec-3 Document Number: 898
DC Forward Current (A) www.vishay.com SS5P3S ELECTRICAL CHARACTERISTICS ( unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT I F = 7.5 A 0.43 - I F = 5 A Instantaneous forward voltage V () 0.50 0.57 F V I F = 7.5 A 0.3 - I F = 5 A 0.4 0.49 Reverse current V R = 30 V I () 50 000 μa R 59 0 ma Typical junction capacitance 4.0 V, MHz C J 930 - pf () Pulse test: 300 μs pulse width, % duty cycle () Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS ( unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Typical thermal resistance R JA () 00 R JM () 3 () Free air, mounted on recommended copper pad area. Thermal resistance R JA - junction to ambient. () Mounted on 30 mm x 30 mm Al PCB with 50 mm x 5 mm x 00 mm fin heat sink. Thermal resistance R JM - junction to mount. C/W ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACAGE CODE BASE QUANTITY DELIVERY MODE SS5P3S-M3/86A 0.0 86A 500 7" diameter plastic tape and reel SS5P3S-M3/87A 0.0 87A 6500 3" diameter plastic tape and reel RATINGS AND CHARACTERISTICS CURVES ( unless otherwise noted) 8 6 T M = 00 C () () Mounted on 30 mm x 30 mm Al PCB with 50 mm x 5 mm x 4 () 00 mm fin heat sink, T M measured at the terminal of cathode band (3) () Mounted on 30 mm x 30 mm Al PCB (R JA = 0 C/W) 0 8 6 4 (4) (5) 0 0 5 50 75 00 5 50 Ambient Temperature ( C) Fig. - Maximum Current Derating Curve (3) Mounted on 30 mm x 30 mm x copper pad areas FR4 PCB (R JA = 30 C/W) (4) Mounted on 5 mm x 5 mm x copper pad areas FR4 PCB (R JA = 30 C/W) (5) Free air, mounted on recommended copper pad area (R JA = 00 C/W) Revision: -Dec-3 Document Number: 898
Average Power Loss (W) Junction Capacitance (pf) www.vishay.com SS5P3S 9 D = 0.8 8 D = 0.5 7 6 D = 0.3 D = 0. D =.0 5 4 D = 0. 3 T D = t p /T t p 0 0 4 6 8 0 4 6 8 Average Forward Current (A) Instantaneous Reverse Current (ma) 000 T A = 50 C 00 0 0. 0.0 0.00 0 0 30 40 50 60 70 80 90 00 Percent of Rated Peak Reverse Voltage (%) Fig. - Forward Power Loss Characteristics Fig. 4 - Typical Reverse Leakage Characteristics Instantaneous Forward Current (A) 00 0 T A = 50 C 0 000 000 T J = 5 C f =.0 MHz V sig = 50 mv p-p 0. 0 0. 0. 0.3 0.4 0.5 0.6 0.7 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics 00 0. 0 00 Reverse Voltage (V) Fig. 5 - Typical Junction Capacitance Revision: -Dec-3 3 Document Number: 898
SS5P3S PACAGE OUTLINE DIMENSIONS in inches (millimeters) 0.87 (4.75) 0.75 (4.45) 0.06 (0.40) 0.006 (0.5) 0.6 (6.65) 0.50 (6.35) 0.4 (6.5) 0.38 (6.05) 0.7 (4.35) 0.67 (4.5) 0.047 (.0) 0.039 (.00) 0.46 (3.70) 0.34 (3.40) 0.087 (.0) 0.075 (.90) Mounting Pad Layout 0.89 (4.80) 0.89 (4.80) 0.73 (4.40) 0.55 (3.94) NOM. 0.68 (6.80) 0.86 (4.7) 0.030 (0.75) NOM. 0.049 (.4) 0.037 (0.94) 0.050 (.7) 0.084 (.3) NOM. 0.053 (.35) 0.04 (.05) Conform to JEDEC TO-77A 0.04 (.04) 0.055 (.40) Revision: -Dec-3 4 Document Number: 898
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