Optocoupler, Power Phototriac

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Optocoupler, Power Phototriac i17912-3 DESCRIPTION The is an optically coupled phototriac driving an integrated power TRIAC in a DIP-8 package. Featuring galvanic and electrical noise isolation, the is able to directly drive medium AC loads with a low voltage input signal. The high blocking voltage of 6 V permits control of off-line voltages up to 23 V AC and is sufficient for as much as 38 V AC. 1 2 3 4 5 2181-4 V D E 8 6 FEATURES Fully integrated power TRIAC Maximum trigger current (I FT ): 1 ma Isolation test voltage 53 V RMS Peak off-state voltage 6 V Load current 1 A RMS dv/dt of 6 V/μs DIP-8 package Pure tin leads Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS Air conditioners Microwave ovens Washing machines Refrigerators Fan heaters Inductive heating cooker Water heaters Industrial equipments AGENCY APPROVALS UL cul DIN EN 6747-5-5 (VDE 884-5), available with option 1 ORDERING INFORMATION V O 2 2 2 3 B - X # DIP-8 Option 7 PART NUMBER PACKAGE OPTION 7.62 mm >.7 mm AGENCY CERTIFIED/PACKAGE TRIGGER, CURRENT I FT (ma) UL, cul 1 DIP-8 SMD-8, option 7 -X7T VDE, UL, cul 1 DIP-8 -X1 SMD-8, option 7 -X17T Rev. 1.1, 12-Dec-17 1 Document Number: 83312

ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT Forward current I F 5 ma Reverse voltage V R 5 V Input power dissipation P diss 7 mw OUTPUT Repetitive peak off-state voltage Sine wave, 5 Hz to 6 Hz, gate open V DRM 6 V RMS on-state current I T(RMS) 1 A Non repetitive surge peak on-state current 5 Hz, peak I TSM 1 A COUPLER Total power dissipation (1) P diss 1.2 W Ambient temperature range T amb -4 to +85 C Storage temperature range T stg -4 to +125 C Soldering temperature t 1 s max. T sld 26 C Notes Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability (1) Total power dissipation value is based on 2S2P PCB ABSOLUTE MAXIMUM RATING CURVES P diss - Input Power Disspation (mw) 21296 8 6 4 2-4 -2 2 4 6 8 1 12 T amb - Ambient Temperature ( C) I T(RMS) - RMS On-State Current (A) 21354 1.2 1..8.6.4.2-4 -2 2 4 6 8 1 T amb - Ambient Temperature ( C) Fig. 1 - Input Power Dissipation vs. Ambient Temperature Fig. 2 - RMS On-State Current vs. Ambient Temperature Note The RMS on-state current was calculated out under a given operating conditions and only for reference: input power: Q E =.15 W, θ BA (4-layer) = 3 C/W Rev. 1.1, 12-Dec-17 2 Document Number: 83312

ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT INPUT Trigger input current V T = 6 V I FT 2.5-1 ma Input reverse current V R = 5 V I R - - 1 μa Forward voltage I F = 1 ma V F.9-1.4 V OUTPUT Peak on-state voltage I TM = 1 A V TM - - 1.7 V Peak off-state current V DRM = 6 V I DRM - - 1 μa Holding current R L = 1 Ω I H - - 25 ma Critical rate of rise of off-state voltage V IN = 4 V RMS (Fig. 3) dv/dt cr - 6 - V/μs Critical rate of rise of commutating voltage V IN = 24 V RMS, I T = 1 A RMS (Fig. 3) dv/dt crq -.7 - V/μs Note Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information only and are not part of the testing requirements V CC + - R IN 12 Ω AC V IN M on R L R TEST VIN C TEST R L 5 V, V CC V 21575 dv/dt (c) Fig. 3 - dv/dt Test Circuit dv/dt SAFETY AND INSULATION RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT Climatic classification According to IEC 68 part 1 4 / 85 / 21 Pollution degree According to DIN VDE 19 2 Comparative tracking index Insulation group IIIa CTI 175 Maximum rated withstanding isolation voltage According to UL1577, t = 1 min V ISO 447 V RMS Tested withstanding isolation voltage According to UL1577, t = 1 s V ISO 53 V RMS Maximum transient isolation voltage According to DIN EN 6747-5-5 V IOTM 8 V peak Maximum repetitive peak isolation voltage According to DIN EN 6747-5-5 V IORM 89 V peak Isolation resistance T amb = 25 C, V IO = 5 V R IO 1 12 Ω T amb = 1 C, V IO = 5 V R IO 1 11 Ω Output safety power P SO 2 mw Input safety current I SI 15 ma Input safety temperature T SI 165 C Creepage distance 7 mm DIP-8 Clearance distance 7 mm Creepage distance 8 mm SMD-8, option 7 Clearance distance 8 mm Insulation thickness DTI.4 mm Note This phototriac coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with safety ratings shall be ensured by means of protective circuits Rev. 1.1, 12-Dec-17 3 Document Number: 83312

TYPICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) I F - Forward Current (ma) 1 85 C 25 C 1 C 55 C -4 C 1.8 1. 1.2 1.4 1.6 V F - Forward Voltage (V) I LKG - Off-State Leakage Current (na) 1 1 1 85 C 55 C 1 25 C 1 C 1-4 C.1.1 1 2 3 4 5 6 V DRM - Off-State Voltage (V) Fig. 4 - Forward Current vs. Forward Voltage Fig. 7 - Off-State Leakage Current vs. Off-State Voltage 55 1.5 V R - Reverse Voltage (V) 5 45 NI FT - Normalized Trigger Input Current 1.3 1.1.9.7 Normalized to: I FT = 1 ma, V TM = 6 V, T amb = 25 C 4-4 -15 1 35 6 85 T amb - Ambient Temperature ( C).5-4 -15 1 35 6 85 T amb - Ambient Temperature ( C) Fig. 5 - Reverse Voltage vs. Ambient Temperature Fig. 8 - Normalized Trigger Input Current vs. Ambient Temperature I TM - Peak On-State Current (A) 1..8.6.4.2 -.2 -.4 -.6 -.8-1. -1.8-1.2 -.6.6 1.2 1.8 V TM - Peak On-State Voltage (V) I FT - Trigger Input Current (ma) 21912 5 4 3 2 1 1 1 1 Turn-On Time (µs) Fig. 6 - On-State Current vs. On-State Voltage Fig. 9 - Trigger Input Current vs. Turn-On Time Rev. 1.1, 12-Dec-17 4 Document Number: 83312

NI H - Normalized Holding Current 2.5 2. 1.5 1..5-4 -15 1 35 6 85 T amb - Ambient Temperature ( C) Fig. 1 - Normalized Holding Current vs. Ambient Temperature I FT - Trigger Input Current (ma) 21914 5.5 5. 4.5 4. 3.5 3. 2 4 6 8 1 Trigger Pulse Width (µs) Fig. 11 - Trigger Input Current vs. Trigger Pulse Width I FT - Trigger Input Current (ma) 21915 5 4 3 2 1 1 2 3 4 5 6 V T - Terminal Voltage (V) Fig. 12 - Trigger Input Current vs. Terminal Voltage Rev. 1.1, 12-Dec-17 5 Document Number: 83312

PACKAGE DIMENSIONS (in millimeters) Pin one ID 6.48 6.81 4 3 2 1 5 6 8 ISOmethodA 9.63 9.91.76 1.14.79 7.62 typ. Option 7 7.62 typ. 4 typ. 3.3 3.81.7 4.6 4.1 1.27.46.56 2.54 typ..51.89 3 to 9 1.2.3 2.79 3.3 5.84 6.35 8 min. 8.4 min. 1.3 max..76 2.54 R.25 1.78 8 min. 11.5 1.52 PACKAGE MARKING (example of -X1) V YWW 68 Notes The VDE logo is only marked on option 1 parts. Option information is not marked on the part Tape and reel suffix (T) is not part of the package marking Rev. 1.1, 12-Dec-17 6 Document Number: 83312

PACKING INFORMATION DEVICE PER TUBE TYPE UNITS/TUBE TUBES/BOX UNITS/BOX DIP-8 5 4 2 15 ±.5 2 ±.5 26 ±.5 33 ±.5 528 ±.2 125 ±.5 3 ±.5 1. B VISHAY OPTOSEMICONDUCTOR MADE IN MALAYSIA ANTISTATIC Detail B Detail A 1. A 1..7 ±.5 3 ±.5 38 ± 1 1. 1. 14 x 12 ±.3 B 13 x 1 = 13 6.6 ±.3 Transparent rigid PVC 4.4 ±.3 6 R.1 2.7 ±.2 11 ±.3 R.5.6 ±.1 1 //.2 B 5.7 ±.15 Section A - B A Detail A Not to scale Detail B 17996 Fig. 13 - Shipping Tube Specifications for DIP Packages ESD sticker Top cover tape 33 (13") Tape slot in core 17998 Embossed carrier Embossment Regular, special or bar code label 17999 Fig. 14 - Tape and Reel Shipping Medium Fig. 15 - Tape and Reel Shipping Medium Rev. 1.1, 12-Dec-17 7 Document Number: 83312

Pin 1 and top of component.35 (.14) 1.5 (.59) min. 4 ±.1 (1.57 ±.4) 2 ±.5 (.79 ±.2) 1 pitch cumulative tolerance on tape ±.2 (.8) Top cover tape 1.41 (.41) 1.75 ±.1 (.69 ±.4) 4.7 (.185) 13.3 (.523) 1.21 (.42) 7.5 ±.5 16. ±.3 (.295 ±.2) (.63 ±.12) 12. (.472) 188.1 (.4) max. Embossment Direction of feed Center lines of cavity 1.5 (.59) Fig. 16 - Tape and Packing (1 pieces on reel) SOLDER PROFILES 2nd line Temperature ( C) 3 25 2 15 1 5 235 C to 26 C Wirst wave ca. 2 K/s 1 C to 13 C 5 s 2 K/s Axis Title Second wave ca. 2 K/s Forced cooling Lead temperature Full line: typical Dotted lines: process limits ca. 5 K/s 1 1 1 1st line 2nd line 2nd line Temperature ( C) 3 25 2 15 1 5 Axis Title Max. 26 C 255 C 245 C 24 C 217 C Max. 3 s Max. 12 s Max. 1 s Max. ramp down 6 C/s Max. ramp up 3 C/s 1 1 1 1st line 2nd line 94 8626 1 5 1 15 2 25 Time (s) Fig. 17 - Recommended Wave Soldering Double Wave Profile for DIP Devices 19841 1 5 1 15 2 25 3 Time (s) Fig. 18 - Recommended Lead (Pb)-free Reflow Solder Profile for SMD Devices HANDLING AND STORAGE CONDITIONS ESD level: HBM class 2 Floor life: unlimited Conditions: T amb < 3 C, RH < 85 % Moisture sensitivity level 1, according to J-STD-2 Rev. 1.1, 12-Dec-17 8 Document Number: 83312

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