DATASHEET. Features. Pin Configuration ISL LD ODFN (2.0x2.1x0.7mm) TOP VIEW. Applications ISL29030

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DATASHEET ISL29030 Low Power Ambient Light and Proximity Sensor with Intelligent Interrupt and Sleep Modes - Analog and Digital Out FN6872 Rev 1.00 The ISL29030 is an integrated ambient and infrared light-to-digital converter with a built-in IR LED driver and I 2 C Interface (SMBus Compatible). This device uses two independent ADCs for concurrently measuring ambient light and proximity in parallel. The flexible interrupt scheme is designed for minimal microcontroller utilization. For ambient light sensor (ALS) data conversions, an ADC converts photodiode current (with a light sensitivity range of 2000 Lux) in 100ms per sample. The ADC rejects 50Hz/60Hz flicker noise caused by artificial light sources. The I ALS pin provides an analog output current proportional to the measured light (420μA FSR). For proximity sensor (Prox) data conversions, the built-in driver turns on an external infrared LED and the proximity sensor ADC converts the reflected IR intensity to digital. This ADC rejects ambient IR noise (such as sunlight) and has a 540μs conversion time. The ISL29030 provides low power operation of ALS and proximity sensing with a typical 138μA normal operation current (110μA for sensors and internal circuitry, ~28μA for external LED) with 220mA current pulses for a net 100μs, repeating every 800ms (or under). The ISL29030 uses both a hardware pin and software bits to indicate an interrupt event has occurred. An ALS interrupt is defined as a measurement which is outside a set window. A proximity interrupt is defined as a measurement over a threshold limit. The user may also require that both ALS/prox interrupts occur at once, up to 16 times in a row before activating the interrupt pin. The ISL29030 is designed to operate from 2.25V to 3.63V over the -40 C to +85 C ambient temperature range. It is packaged in a clear, lead-free 8 lead ODFN package. Pin Configuration ISL29030 8 LD ODFN (2.0x2.1x0.7mm) TOP VIEW I ALS VDD GND REXT 1 2 3 THERMAL PAD 8 7 6 4 5 IRDR INT SDA SCL *THERMAL PAD CAN BE CONNECTED TO GND OR ELECTRICALLY ISOLATED Features Works Under All Light Sources Including Sunlight Dual ADCs Measure ALS/Prox Concurrently Intelligent Interrupt Scheme Simplifies μc Code Ambient Light Sensing Simple Output Code Directly Proportional to lux 50Hz/60Hz Flicker Noise and IR Rejection Light Sensor Close to Human Eye Response Selectable 125/2000 Lux Range Analog 420μA Output Pin I ALS Proportional to Lux Proximity Sensing Proximity Sensor with Broad IR Spectrum - Can Use 850nm and 950nm External IR LEDs IR LED Driver with I 2 C Programmable Sink Currents - Net 100μs Pulse with 110mA or 220mA Amplitudes - Periodic Sleep Time up to 800ms Between Pulses Ambient IR Noise Cancellation (Including Sunlight) Intelligent and Flexible Interrupts Independent ALS/Prox Interrupt Thresholds Adjustable Interrupt Persistency - 1/4/8/16 Consecutive Triggers Required Before Interrupt Ultra Low Power 138μA DC Typical Supply Current for ALS/Prox Sensing - 110μA for Sensors and Internal Circuitry - 28μA Typical Current for External IR LED (Assuming 220mA for 100μs Every 800ms) <1.0μA Supply Current When Powered Down Easy to Use Set Registers; Wait for Interrupt I 2 C (SMBus Compatible) Output Temperature Compensated Tiny ODFN8 2.0x2.1x0.7 (mm) Package Additional Features 1.7V to 3.63V Supply for I 2 C Interface 2.25V to 3.63V Sensor Power Supply Pb-Free (RoHS compliant) Applications Display and Keypad Dimming Adjustment and Proximity Sensing for: - Mobile Devices: Smart Phone, PDA, GPS - Computing Devices: Laptop PC, Netbook - Consumer Devices: LCD-TV, Digital Picture Frame, Digital Camera Industrial and Medical Light and Proximity Sensing FN6872 Rev 1.00 Page 1 of 17

Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION - T.PAD Thermal Pad (connect to GND or float) 1 I ALS Analog Current Output (Proportional to ALS/IR Data Count: 420µA FSR) 2 VDD Positive supply: 2.25V to 3.63V 3 GND Ground 4 REXT External resistor (499k ; 1%) connects this pin to ground 5 SCL I 2 C clock line The I 2 C bus lines can be pulled from 1.7V to above V DD, 3.63V max 6 SDA I 2 C data line 7 INT Interrupt pin; Logic output (open-drain) for interrupt 8 IRDR IR LED driver pin - current flows into ISL29030 from LED cathode Block Diagram VDD 2 ALS PHOTODIODE ARRAY LIGHT DATA PROCESS ALS AND IR DUAL CHANNEL ADCs COMMAND REGISTER DATA REGISTER DAC 1 IALS IR PHOTODIODE ARRAY IREF FOSC I 2 C INTERRUPT 5 6 7 SCL SDA INT IR DRIVER 8 IRDR Ordering Information 4 3 REXT GND PART NUMBER (Notes 1, 2, 3) TEMP. RANGE ( C) PACKAGE TAPE AND REEL (Pb-free) PKG. DWG. # ISL29030IROZ-T7-40 to +85 8 Ld ODFN L8.2.1x2.0 ISL29030IROZ-EVALZ Evaluation Board NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL29030. For more information on MSL please see techbrief TB477. FN6872 Rev 1.00 Page 2 of 17

Absolute Maximum Ratings (T A = +25 C) V DD Supply Voltage between V DD and GND......................4.0V I 2 C Bus Pin Voltage (SCL, SDA)......................... -0.5V to 4.0V I 2 C Bus Pin Current (SCL, SDA).............................. <10mA R EXT Pin Voltage................................-0.5V to VDD + 0.5V IRDR Pin Voltage............................................5.5V I ALS Pin Voltage................................-0.5V to VDD + 0.5V INT Pin Voltage...................................... -0.5V to 4.0V INT Pin Current........................................... <10mA ESD Rating Human Body Model (Note 5)................................. 2kV Thermal Information Thermal Resistance (Typical, Note 4) JA ( C/W) 8 Ld ODFN..................................... 88 Maximum Die Temperature.................................+90 C Storage Temperature..............................-40 C to +100 C Operating Temperature.............................-40 C to +85 C Pb-Free Reflow Profile (*)............................... see TB477 *Peak temperature during solder reflow +235 C max CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with direct attach features. See Tech Brief TB379. 5. ESD on all pins is 2kV except for IRDR, which is 1.5kV. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: T J = T C = T A Electrical Specifications V DD = 3.0V, T A = +25 C, R EXT = 499k 1% tolerance. PARAMETER DESCRIPTION CONDITION MIN (Note 10) TYP MAX (Note 10) UNIT V DD Power Supply Range 2.25 3.0 3.63 V SR_V DD Input Power-up Slew Rate V DD Rising Edge between 0.4V and 2.25V 0.5 V/ms I DD_OFF Supply Current when Powered Down ALS_EN = 0; PROX_EN = 0 0.1 0.8 µa I DD_NORM Supply Current for ALS+Prox in Sleep Time ALS_EN = 1; PROX_EN = 1 116 135 µa I DD_PRX_SLP Supply Current for Prox in Sleep Time ALS_EN = 0; PROX_EN = 1 85 µa I DD_ALS Supply Current for ALS ALS_EN = 1; PROX_EN = 0 102 µa f OSC Internal Oscillator Frequency 5.25 MHz t INTGR_ALS 12-bit ALS Integration/Conversion Time 88 100 112 ms t INTGR_PROX 8-bit Prox Integration/Conversion Time 0.54 ms I ALS_OFF I ALS Output Current when ALS = Disabled ALS_EN = 0; V I_ALS = 0V 3 100 na I ALS_0 I ALS Output Current When Dark ALS_EN = 1; ALS_RANGE = 1; E = 0 Lux 0.1 0.6 µa I ALS_1 Current Output under Specified Conditions E = 53 lux, Fluorescent (Note 6), ALS_RANGE = 0 I ALS_2 Current Output under Specified Conditions E = 320 lux, Fluorescent (Note 6) ALS_RANGE = 1 161 µa 40 60 80 µa I ALS_F I ALS Output Current At Full Scale ALS_EN = 1; ALS Code = 4095 380 420 460 µa V I_ALS Compliance Voltage on I ALS w/ 5% Variation in Output Current ALS_EN = 1; ALS Code = 4095 0 VDD-0.8 V DATA ALS_0 ALS Result when Dark E AMBIENT = 0 lux, 2k Range 1 3 Counts DATA ALS_F Full Scale ALS ADC Code E AMBIENT > Selected Range Maximum Lux (Note 9) 4095 Counts ΔDATA DATA Count Output Variation Over Three Light Sources: Fluorescent, Incandescent and Sunlight Ambient Light Sensing ±10 % DATA ALS_1 Light Count Output with LSB of 0.0326 lux/count E = 53 lux, Fluorescent (Notes 6, 9), ALS_RANGE = 0 1638 Counts FN6872 Rev 1.00 Page 3 of 17

Electrical Specifications V DD = 3.0V, T A = +25 C, R EXT = 499k 1% tolerance. (Continued) PARAMETER DESCRIPTION CONDITION MIN (Note 10) TYP MAX (Note 10) UNIT DATA ALS_2 Light Count Output With LSB of 0.522 lux/count E = 320 lux, Fluorescent (Note 6) ALS_RANGE = 1 460 614 768 Counts DATA PROX_0 Prox Measurement w/o Object in Path 1 2 Counts DATA PROX_F Full Scale Prox ADC Code 255 Counts DATA PROX_1 Prox Measurement Result (Note 7) 35 46 57 Counts t r Rise Time for IRDR Sink Current R LOAD = 15 at IRDR pin, 20% to 80% 500 ns t f Fall time for IRDR Sink Current R LOAD = 15 at IRDR pin, 80% to 20% 500 ns I IRDR_0 IRDR Sink Current PROX_DR = 0; V IRDR = 0.5V 98 110 120 ma I IRDR_1 IRDR Sink Current PROX_DR = 1; V IRDR = 0.5V 220 ma I IRDR_LEAK IRDR Leakage Current PROX_EN = 0; V DD = 3.63V (Note 8) -1 0.001 1 µa V IRDR Acceptable Voltage Range on IRDR Pin Register bit PROX_DR = 0 0.5 4.3 V t PULSE Net I IRDR On Time Per PROX Reading 100 µs V REF Voltage of R EXT Pin 0.51 V F I 2 C I 2 C Clock Rate Range 400 khz V I 2 C Supply Voltage Range for I 2 C Interface 1.7 3.63 V V IL SCL and SDA Input Low Voltage 0.55 V V IH SCL and SDA Input High Voltage 1.25 V I SDA SDA Current Sinking Capability V OL = 0.4V 3 5 ma I INT INT Current Sinking Capability V OL = 0.4V 3 5 ma PSRR IRDR ( I IRDR )/( V IRDR ) PROX_DR = 0; V IRDR = 0.5V to 4.3V 4 ma/v NOTES: 6. An LED is used in production test. The LED irradiance is calibrated to produce the same DATA count against a fluorescent light source of the same lux level. 7. An 850nm infrared LED is used to test PROX/IR sensitivity in an internal test mode. 8. Ability to guarantee I IRDR leakage of ~1nA is limited by test hardware. 9. For ALS applications under light-distorting glass, please see the section titled ALS Range 1 Considerations on page 11. 10. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. I 2 C Electrical Specifications For SCL and SDA unless otherwise noted, V DD = 3V, T A = +25 C, R EXT = 499kΩ 1% tolerance (Note 11). PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT V I 2 C Supply Voltage Range for I 2 C Interface 1.7 3.63 V f SCL SCL Clock Frequency 400 khz V IL SCL and SDA Input Low Voltage 0.55 V V IH SCL and SDA Input High Voltage 1.25 V V hys Hysteresis of Schmitt Trigger Input 0.05V DD V V OL Low-level Output Voltage (Open-drain) at 4mA Sink Current 0.4 V I i Input Leakage for each SDA, SCL Pin -10 10 µa t SP Pulse Width of Spikes that must be Suppressed by the Input Filter 50 ns t AA SCL Falling Edge to SDA Output Data Valid 900 ns FN6872 Rev 1.00 Page 4 of 17

I 2 C Electrical Specifications For SCL and SDA unless otherwise noted, V DD = 3V, T A = +25 C, R EXT = 499kΩ 1% tolerance (Note 11). (Continued) PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT C i Capacitance for each SDA and SCL Pin 10 pf t HD:STA Hold Time (Repeated) START Condition After this period, the first clock pulse is generated 600 ns t LOW LOW Period of the SCL Clock Measured at the 30% of VDD crossing 1300 ns t HIGH HIGH period of the SCL Clock 600 ns t SU:STA Set-up Time for a Repeated START Condition 600 ns t HD:DAT Data Hold Time 30 ns t SU:DAT Data Set-up Time 100 ns t R Rise Time of both SDA and SCL Signals (Note 12) 20 + 0.1xC b ns t F Fall Time of both SDA and SCL Signals (Note 12) 20 + 0.1xC b ns t SU:STO Set-up Time for STOP Condition 600 ns t BUF Bus Free Time Between a STOP and START Condition 1300 ns C b Capacitive Load for Each Bus Line 400 pf R pull-up SDA and SCL system bus pull-up resistor Maximum is determined by t R and t F 1 k t VD;DAT Data Valid Time 0.9 µs t VD:ACK Data Valid Acknowledge Time 0.9 µs V nl Noise Margin at the LOW Level 0.1VDD V V nh Noise Margin at the HIGH Level 0.2VDD V NOTES: 11. I 2 C limits are based on design/simulation and are not production tested. 12. C b is the capacitance of the bus in pf. FN6872 Rev 1.00 Page 5 of 17

FIGURE 1. I 2 C TIMING DIAGRAM Register Map There are ten 8-bit registers accessible via I 2 C. Registers 0x1 and 0x2 define the operation mode of the device. Registers 0x3 through 0x7 store the various ALS/IR/Prox thresholds which trigger interrupt events. Registers 0x8 through 0xA store the results of ALS/IR/Prox ADC conversions. TABLE 1. ISL29030 REGISTERS AND REGISTER BITS BIT ADDR REG NAME 7 6 5 4 3 2 1 0 DEFAULT 0x00 (n/a) (Reserved) (n/a) 0x01 CONFIGURE PROX EN PROX_SLP[2:0] PROX_DR ALS_EN ALS_RANGE ALSIR_MODE 0x00 0x02 INTERRUPT PROX_FLAG PROX_PRST[1:0] (Write 0) ALS_FLAG ALS_PRST[1:0] INT_CTRL 0x00 0x03 PROX_LT PROX_LT[7:0] 0x00 0x04 PROX_HT PROX_HT[7:0] 0xFF 0x05 ALSIR_TH1 ALSIR_LT[7:0] 0x00 0x06 ALSIR_TH2 ALSIR_HT[3:0] ALSIR_LT[11:8] 0xF0 0x07 ALSIR_TH3 ALSIR_HT[11:4] 0xFF 0x08 PROX_DATA PROX_DATA[7:0] 0x00 0x09 ALSIR_DT1 ALSIR_DATA[7:0] 0x00 0x0A ALSIR_DT2 (Unused) ALSIR_DATA[11:8] 0x00 0x0E TEST1 (Write as 0x00) 0x00 0x0F TEST2 (Write as 0x00) 0x00 FN6872 Rev 1.00 Page 6 of 17

Register Descriptions TABLE 2. REGISTER 0x00 (RESERVED) BIT # ACCESS DEFAULT NAME FUNCTION/OPERATION 7:0 RO (n/a) (n/a) Reserved - no need to read or write TABLE 3. REGISTER 0x01 (CONFIGURE) - PROX/ALS CONFIGURATION BIT # ACCESS DEFAULT NAME FUNCTION/OPERATION 7 RW 0x00 6:4 RW 0x00 3 RW 0x00 2 RW 0x00 1 RW 0x00 0 RW 0x00 PROX_EN (Prox Enable) PROX_SLP (Prox Sleep) PROX_DR (Prox Drive) ALS_EN (ALS Enable) ALS_RANGE (ALS Range) ALSIR_MODE (ALSIR Mode) When = 0, proximity sensing is disabled When = 1, continuous proximity sensing is enabled. Prox data will be ready 0.54ms after this bit is set high For bits 6:4 = (see the following) 111; sleep time between prox IR LED pulses is 0.0ms (run continuously) 110; sleep time between prox IR LED pulses is 12.5ms 101; sleep time between prox IR LED pulses is 50ms 100; sleep time between prox IR LED pulses is 75ms 011; sleep time between prox IR LED pulses is 100ms 010; sleep time between prox IR LED pulses is 200ms 001; sleep time between prox IR LED pulses is 400ms 000; sleep time between prox IR LED pulses is 800ms When = 0, IRDR behaves as a pulsed 110mA current sink When = 1, IRDR behaves as a pulsed 220mA current sink When = 0, ALS/IR sensing is disabled When = 1, continuous ALS/IR sensing is enabled with new data ready every 100ms When = 0, ALS is in low-lux range When = 1, ALS is in high-lux range When = 0, ALS/IR data register contains visible ALS sensing data When = 1, ALS/IR data register contains IR spectrum sensing data TABLE 4. REGISTER 0x02 (INTERRUPT) - PROX/ALS INTERRUPT CONTROL 7 FLAG 0x00 6:5 RW 0x00 4 RW 0x00 3 FLAG 0x00 2:1 RW 0x00 0 RW 0x00 PROX_FLAG (Prox Flag) PROX_PRST (Prox Persist) Unused (Write 0) ALS_FLAG (ALS FLAG) ALS_PRST (ALS Persist) INT_CTRL (Interrupt Control) When = 0, no Prox interrupt event has occurred since power-on or last clear When = 1, a Prox interrupt event occurred. Clearable by writing 0 For bits 6:5 = (see the following) 00; set PROX_FLAG if 1 conversion result trips the threshold value 01; set PROX_FLAG if 4 conversion results trip the threshold value 10; set PROX_FLAG if 8 conversion results trip the threshold value 11; set PROX_FLAG if 16 conversion results trip the threshold value Unused register bit - write 0 When = 0, no ALS interrupt event has occurred since power-on or last clear When = 1, an ALS interrupt event occurred. Clearable by writing 0 For bits 2:1 = (see the following) 00; set ALS_FLAG if 1 conversion is outside the set window 01; set ALS_FLAG if 4 conversions are outside the set window 10; set ALS_FLAG if 8 conversions are outside the set window 11; set ALS_FLAG if 16 conversions are outside the set window When = 0, set INT pin low if PROX_FLAG or ALS_FLAG high (logical OR) When = 1, set INT pin low if PROX_FLAG and ALS_FLAG high (logical AND) TABLE 5. REGISTER 0x03 (PROX_LT) - INTERRUPT LOW THRESHOLD FOR PROXIMITY SENSOR 7:0 RW 0x00 PROX_LT (Prox Threshold) 8-bit interrupt low threshold for proximity sensing FN6872 Rev 1.00 Page 7 of 17

TABLE 6. REGISTER 0x04 (PROX_HT) - INTERRUPT HIGH THRESHOLD FOR PROXIMITY SENSOR 7:0 RW 0xFF PROX_HT (Prox Threshold) 8-bit interrupt high threshold for proximity sensing TABLE 7. REGISTER 0x05 (ALSIR_TH1) - INTERRUPT LOW THRESHOLD FOR ALS/IR 7:0 RW 0x00 ALSIR_LT[7:0] (ALS/IR Low Thr.) Lower 8 bits (of 12 bits) for ALS/IR low interrupt threshold TABLE 8. REGISTER 0x06 (ALSIR_TH2) - INTERRUPT LOW/HIGH THRESHOLDS FOR ALS/IR 7:4 RW 0x0F 3:0 RW 0x00 ALSIR_HT[3:0] (ALS/IR High Thr.) ALSIR_LT[11:8] (ALS/IR Low Thr.) Lower 4 bits (of 12 bits) for ALS/IR high interrupt threshold Upper 4 bits (of 12 bits) for ALS/IR low interrupt threshold TABLE 9. REGISTER 0x07 (ALSIR_TH3) - INTERRUPT HIGH THRESHOLD FOR ALS/IR 7:0 RW 0xFF ALSIR_HT[11:4] (ALS/IR High Thr.) Upper 8 bits (of 12 bits) for ALS/IR high interrupt threshold TABLE 10. REGISTER 0x08 (PROX_DATA) - PROXIMITY SENSOR DATA 7:0 RO 0x00 PROX_DATA (Proximity Data) Results of 8-bit proximity sensor ADC conversion TABLE 11. REGISTER 0x09 (ALSIR_DT1) - ALS/IR SENSOR DATA (LOWER 8 BITS) 7:0 RO 0x00 ALSIR_DATA (ALS/IR Data) Lower 8 bits (of 12 bits) from result of ALS/IR sensor conversion TABLE 12. REGISTER 0x0A (ALSIR_DT2) - ALS/IR SENSOR DATA (UPPER 4 BITS) 7:4 RO 0x00 (Unused) Unused bits. 3:0 RO 0x00 ALSIR_DATA (ALS/IR Data) Upper 4 bits (of 12 bits) from result of ALS/IR sensor conversion TABLE 13. REGISTER 0x0E (TEST1) - TEST MODE 7:0 RW 0x00 (Write as 0x00) Test mode register. When 0x00, in normal operation. TABLE 14. REGISTER 0x0F (TEST2) - TEST MODE 2 7:0 RW 0x00 (Write as 0x00) Test mode register. When 0x00, in normal operation. FN6872 Rev 1.00 Page 8 of 17

I 2 C DATA START DEVICE ADDRESS W A REGISTER ADDRESS STOP START DEVICE ADDRESS A DATA BYTE0 I 2 C SDA MASTER A6 A5 A4 A3 A2 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A A6 A5 A4 A3 A2 A1 A0 W A SDA DRIVEN BY ISL29030 I 2 C SDA SLAVE (ISL29030) SDA DRIVEN BY MASTER A SDA DRIVEN BY MASTER A SDA DRIVEN BY MASTER A D7 D6 D5 D4 D3 D2 D1 D0 I 2 C CLK 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 FIGURE 2. I 2 C DRIVER TIMING DIAGRAM FOR MASTER AND SLAVE CONNECTED TO COMMON BUS Principles of Operation I 2 C Interface The ISL29030 s I 2 C interface slave address is internally hardwired as 0b1000100. Figure 2 shows a sample one-byte read. The I 2 C bus master always drives the SCL (clock) line, while either the master or the slave can drive the SDA (data) line. Every I 2 C transaction begins with the master asserting a start condition (SDA falling while SCL remains high). The first transmitted byte is initiated by the master and includes 7 address bits and a R/W bit. The slave is responsible for pulling SDA low during the ACK bit after every transmitted byte. Each I 2 C transaction ends with the master asserting a stop condition (SDA rising while SCL remains high). For more information about the I 2 C standard, please consult the Philips I 2 C specification documents. Photodiodes and ADCs The ISL29030 contains two photodiode arrays which convert photons (light) into current. The ALS photodiodes are constructed to mimic the human eye s wavelength response curve to visible light (see Figure 7). The ALS photodiodes current output is digitized by a 12-bit ADC in 100ms. These 12 bits can be accessed by reading from I 2 C registers 0x9 and 0xA when the ADC conversion is completed. The ALS converter is a charge-balancing integrating 12-bit ADC. Charge-balancing is best for converting small current signals in the presence of periodic AC noise. Integrating over 100ms highly rejects both 50Hz and 60Hz light flicker by picking the lowest integer number of cycles for both 50Hz/60Hz frequencies. FN6872 Rev 1.00 Page 9 of 17

ALS CONVERSION TIME = 100ms (FIXED) SEVERAL µs BETWEEN CONVERSIONS ALS ACTIVE 100ms 100ms 100ms 100ms 100ms TIME PROX SENSOR ACTIVE 0.54ms FOR PROX CONVERSION TIME IRDR (CURRENT DRIVER) SERIES OF CURRENT PULSES TOTALING 0.1ms TIME SLEEP TIME (PROX_SLP) FIGURE 3. TIMING DIAGRAM FOR PROX/ALS EVENTS - NOT TO SCALE The proximity sensor is an 8-bit ADC which operates in a similar fashion. When proximity sensing is enabled, the IRDR pin will drive a user-supplied infrared LED, the emitted IR reflects off an object (i.e., a human head) back into the ISL29030, and a sensor converts the reflected IR wave to a current signal in 0.54ms. The ADC subtracts the IR reading before and after the LED is driven (to remove ambient IR such as sunlight), and converts this value to a digital count stored in Register 0x8. The ISL29030 is designed to run two conversions concurrently: a proximity conversion and an ALS (or IR) conversion. Please note that because of the conversion times, the user must let the ADCs perform one full conversion first before reading from I 2 C Registers PROX_DATA (wait 0.54ms) or ALSIR_DT1/2 (wait 100ms). The timing between ALS and Prox conversions is arbitrary (as shown in Figure 3). The ALS runs continuously with new data available every 100ms. The proximity sensor runs continuously with a time between conversions decided by PROX_SLP (Register 1 Bits [6:4]). Ambient Light and IR Sensing The ISL29030 is set for ambient light sensing when Register bit ALSIR_MODE = 0 and ALR_EN = 1. The light-wavelength response of the ALS appears as shown in Figure 6. ALS measuring mode (as opposed to IR measuring mode) is set by default. When the part is programmed for infrared (IR) sensing (ALSIR_MODE = 1; ALS_EN = 1), infrared light is converted into a current and digitized by the same ALS ADC. The result of an IR conversion is strongly related to the amount of IR energy incident on our sensor, but is unitless and is referred to in digital counts. Proximity Sensing When proximity sensing is enabled (PROX_EN = 1), the external IR LED is driven for 0.1ms by the built-in IR LED driver through the IRDR pin. The amplitude of the IR LED current depends on Register 1 bit 3: PROX_DR. If this bit is low, the load will see a fixed 110mA current pulse. If this bit is high, the load on IRDR will see a fixed 220mA current pulse as seen in Figure 4. 220mA (PROX_DR = 1) 110mA (PROX_DR = 0) FIGURE 4. CURRENT DRIVE MODE OPTIONS When the IR from the LED reaches an object and gets reflected back into the ISL29030, the reflected IR light is converted into current as per the IR spectral response shown in Figure 7. One entire proximity measurement takes 0.54ms for one conversion (which includes 0.1ms spent driving the LED), and the period between proximity measurements is decided by PROX_SLP (sleep time) in Register 1 Bits 6:4. Average LED driving current consumption is given by Equation 1. A typical IRDR scheme is 220mA amplitude pulses every 800ms, which yields 28μA DC. Total Current Consumption Total current consumption is the sum of I DD and I IRDR. The IRDR pin sinks current (as shown in Figure 4) and the average IRDR current can be calculated using Equation 1. I DD depends on voltage and the mode-of-operation as seen in Figure 11. Interrupt Function (IRDR IS HI-Z WHEN NOT DRIVING) PIN 8 - IRDR I lrdr; PEAK 100 s I lrdr; AVE = ----------------------------------------------------- (EQ. 1) T SLEEP The ISL29030 has an intelligent interrupt scheme designed to shift some logic processing away from intensive microcontroller I 2 C polling routines (which consume power) and towards a more FN6872 Rev 1.00 Page 10 of 17

independent light sensor which can instruct a system to wake up or go to sleep. An ALS interrupt event (ALS_FLAG) is governed by Registers 5 through 7. The user writes a high and low threshold value to these registers and the ISL29030 will issue an ALS interrupt flag if the actual count stored in Registers 0x9 and 0xA are outside the user s programmed window. The user must write 0 to clear the ALS_FLAG. A proximity interrupt event (PROX_FLAG) is governed by the high and low thresholds in registers 3 and 4 (PROX_LT and PROX_HT). PROX_FLAG is set when the measured proximity data is more than the higher threshold X-times-in-a-row (X is set by user; see following paragraph). The proximity interrupt flag is cleared when the prox data is lower than the low proximity threshold X-times-in-a-row, or when the user writes 0 to PROX_FLAG. Interrupt persistency is another useful option available for both ALS and proximity measurements. Persistency requires X-in-arow interrupt flags before the INT pin is driven low. Both ALS and Prox have their own independent interrupt persistency options. See ALS_PRST and PROX_PRST bits in Register 2. The final interrupt option is the ability to AND or OR the two interrupt flags using Register 2 Bit 0 (INT_CTRL). If the user wants both ALS/Prox interrupts to happen at the same time before changing the state of the interrupt pin, set this bit high. If the user wants the interrupt pin to change state when either the ALS or the Proximity interrupt flag goes high, leave this bit to its default of 0. Analog-Out I ALS Pin When ALS_EN = 1, The analog I ALS output pin sources a current directly proportional to the digital count stored in register bits ALSIRDATA[11:0]. When ALS_EN = 0, this pin is in a high impedance state. See Figure 15 for the effects of the compliance voltage V I_ALS on I ALS. ALS Range 1 Considerations When measuring ALS counts higher than 1800 on range 1 (ALSIR_MODE = 0, ALS_RANGE = 0, ALS_DATA > 1800), switch to range 2 (change the ALS_RANGE bit from 0 to 1 ) and remeasure ALS counts. This recommendation pertains only to applications where the light incident upon the sensor is IR-heavy and is distorted by tinted glass that increases the ratio of infrared to visible light. For more information, see the separate ALS Range 1 Considerations document. V DD Power-up and Power Supply Considerations Upon power-up, please ensure a V DD slew rate of 0.5V/ms or greater. After power-up, or if the user s power supply temporarily deviates from our specification (2.25V to 3.63V), Intersil recommends the user write the following: write 0x00 to register 0x01, write 0x29 to register 0x0F, write 0x00 to register 0x0E, and write 0x00 to register 0x0F. The user should then wait ~1ms or more and then rewrite all registers to the desired values. If the user prefers a hardware reset method instead of writing to test registers: set V DD =0V for 1 second or more, power back up at the required slew rate, and write registers to the desired values. Power-Down The power-down can be set 2 ways by the user. The first is to set both PROX_EN and ALS_EN bits to 0 in Register 1. The second and more simple way is to set all bits in Register 1 to 0 (0x00). Calculating Lux The ISL29030 s ADC output codes are directly proportional to lux when in ALS mode (see ALSIR_MODE bit). E calc = RANGE OUT ADC (EQ. 2) In Equation 2, E calc is the calculated lux reading and OUT represents the ADC code. The constant to plug in is determined by the range bit ALS_RANGE (register 0x1 bit 1) and is independent of the light source type. TABLE 15. ALS SENSITIVITY AT DIFFERENT RANGES α RANGE ALS_RANGE (Lux/Count) 0 0.0326 1 0.522 Table 15 shows two different scale factors: one for the low range (ALS_RANGE = 0) and the other for the high range (ALS_RANGE = 1). Noise Rejection Charge balancing ADC s have excellent noise-rejection characteristics for periodic noise sources whose frequency is an integer multiple of the conversion rate. For instance, a 60Hz AC unwanted signal s sum from 0ms to k*16.66ms (k = 1,2...k i ) is zero. Similarly, setting the device s integration time to be an integer multiple of the periodic noise signal greatly improves the light sensor output signal in the presence of noise. Since wall sockets may output at 60Hz or 50Hz, our integration time is 100ms: the lowest common integer number of cycles for both frequencies. Proximity Detection of Various Objects Proximity sensing relies on the amount of IR reflected back from objects. A perfectly black object would absorb all light and reflect no photons. The ISL29030 is sensitive enough to detect black ESD foam which reflects only 1% of IR. For biological objects, blonde hair reflects more than brown hair and customers may notice that skin tissue is much more reflective than hair. IR penetrates into the skin and is reflected or scattered back from within. As a result, the proximity count peaks at contact and monotonically decreases as skin moves away. The reflective characteristics of skin are very different from that of paper. Typical Circuit A typical application for the ISL29030 is shown in Figure 5. The ISL29030 s I 2 C address is internally hardwired as 0b1000100. The device can be tied onto a system s I 2 C bus together with other I 2 C compliant devices. FN6872 Rev 1.00 Page 11 of 17

Soldering Considerations Convection heating is recommended for reflow soldering; directinfrared heating is not recommended. The plastic ODFN package does not require a custom reflow soldering profile, and is qualified to +260 C. A standard reflow soldering profile with a +260 C maximum is recommended. (http://www.intersil.com/data/tb/tb477.pdf) Suggested PCB Footprint It is important that users check the Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead (ODFN) Package before starting ODFN product board mounting. (http://www.intersil.com/data/tb/tb477.pdf) Layout Considerations The ISL29030 is relatively insensitive to layout. Like other I 2 C devices, it is intended to provide excellent performance even in significantly noisy environments. There are only a few considerations that will ensure best performance. Route the supply and I 2 C traces as far as possible from all sources of noise. A 0.1µF and 1µF power supply decoupling capacitors need to be placed close to the device. V I2C_PULL-UP R1 10kΩ R2 10kΩ R3 10kΩ I 2 C MASTER MICROCONTROLLER V DD V IR-LED INT SDA SCL C1 1µF C2 0.1µF V SLAVE_0 1 I ALS IRDR 8 3.5kΩ 2 VDD INT 7 3 GND SDA 6 4 REXT SCL 5 SLAVE_1 SDA SCL I 2 C SLAVE_n SDA SCL REXT 499kΩ ISL29030 FIGURE 5. ISL29030 TYPICAL CIRCUIT FN6872 Rev 1.00 Page 12 of 17

Typical Performance Curves V DD = 3.0V, R EXT = 499k NORMALIZED INTENSITY 1.0 1.0 HUMAN EYE 0.9 FLUORESCENT 0.9 IR/PROX 0.8 0.8 ALS 0.7 0.7 0.6 0.6 0.5 HALOGEN INCAND. 0.5 0.4 SUN 0.4 0.3 0.3 0.2 0.2 0.1 0.1 0 0.0 350 550 750 950 300 400 500 600 700 800 900 1000 1100 WAVELENGTH (nm) WAVELENGTH (nm) NORMALIZED RESPONSE FIGURE 6. SPECTRUM OF FOUR LIGHT SOURCES NORMALIZED BY LUMINOUS INTENSITY (LUX) FIGURE 7. ISL29030 SENSITIVITY TO DIFFERENT WAVELENGTHS NORMALIZED SENSITIVITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0-90 -60-30 0 30 60 90 ANGULAR OFFSET ( ) FIGURE 8. ANGULAR SENSITIVITY LUX METER READING (LX) 2500 2000 1500 1000 500 HALOGEN INCANDESCENT FLUORESCENT 0 0 1000 2000 3000 4000 5000 ALS CODE (12-BIT) FIGURE 9. ALS LINEARITY OVER 3 LIGHT SOURCES (2000 LUX RANGE) 300 160 250 18% GREY CARD 140 ALS+PROX (DURING PROX SLEEP) PROX COUNTS (8-BIT) 200 150 100 50 220mA MODE 110mA MODE WHITE COPY PAPER MEASURED I DD (µa) 120 100 80 60 ALS-ONLY PROX (DURING PROX SLEEP) 0 0 20 40 60 80 100 120 140 160 180 200 DISTANCE (mm) FIGURE 10. PROX COUNTS vs DISTANCE WITH 10CM x 10CM REFLECTOR (USING ISL29030 EVALUATION BOARD) 40 2.25 2.40 2.55 2.70 2.85 3.00 3.15 3.30 3.45 3.60 INPUT V DD (V) FIGURE 11. V DD vs I DD FOR VARIOUS MODES OF OPERATION (I ALS PIN FLOATING) FN6872 Rev 1.00 Page 13 of 17

Typical Performance Curves V DD = 3.0V, R EXT = 499k (Continued) 240 220 220mA-MODE (PROX_DR = 1) 50 40 30 I IRDR (ma) 200 180 160 140 120 110mA-MODE (PROX_DR = 0) 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 V IRDR (V) ALS COUNT CHANGE FROM +25 C (%) 20 10 0-10 -20-30 -40-50 -40-20 0 20 40 60 80 TEMPERATURE ( C) FIGURE 12. IRDR PULSE AMPLITUDE vs V IRDR FIGURE 13. STABILITY OF ALS COUNT OVER-TEMPERATURE (AT 300 LUX) ALS CODE (12-BIT) 10 9 8 7 6 5 4 3 2 1 0-40 10 60 TEMPERATURE ( C) I ALS (%) 100 80 I ALS (%) 60 40 20 0 0 0.5 1.0 1.5 2.0 2.5 3.0 V I_ALS (V) FIGURE 14. STABILITY OF ALS COUNT OVER-TEMPERATURE (AT 0.00 LUX) FIGURE 15. COMPLIANCE VOLTAGE V I_ALS 'S EFFECTS ON I ALS (REFERENCED TO V I_ALS = 0V) FN6872 Rev 1.00 Page 14 of 17

2.10 1 8 2 7 2.00 SENSOR OFFSET 0.43 3 6 0.50 4 5 0.42 FIGURE 16. 8 LD ODFN SENSOR LOCATION OUTLINE - DIMENSIONS IN mm FN6872 Rev 1.00 Page 15 of 17

Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION CHANGE 4/19/11 FN6872.1 Corrected Tech Brief reference in Note 3 of Ordering Information on page 2 from TB363 to TB477. Added Note 10 to MIN MAX columns of Electrical Specifications on page 3. Updated Package Outline Drawing on page 17 as follows: -In the bottom view image, added a dimension from the edge of the package to the edge of the first lead, which is 0.15mm. Also added a dimension from the edge of the package (top edge in the picture) to the center of the lead, which is 0.25mm -Changed the drawing in the bottom view to show the new look of the pin#1 indicator -Corrected note 4 from "Dimension b applies.." to "Dimension applies..." -Added note 4 callout to bottom view -Enclosed Note #'s 4, 5, 6 in triangles 10/18/10 Updates to test methodology, addition of "ALS Range 1 Considerations" paragraph, updates to "Power-Up" Sequence, test register clarification, I_als FSR typo fixes 6/15/10 FN6872.0 Initial release. About Intersil Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors. The company's products address some of the fastest growing markets within the industrial and infrastructure, personal computing and high-end consumer markets. For more information about Intersil or to find out how to become a member of our winning team, visit our website and career page at www.intersil.com. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective product information page. Also, please check the product information page to ensure that you have the most updated datasheet: ISL29030 To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff Reliability reports are available from our website at: http://rel.intersil.com/reports/search.php Copyright Intersil Americas LLC 2010-2012. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6872 Rev 1.00 Page 16 of 17

Package Outline Drawing L8.2.1x2.0 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 3, 1/11 2.10 A B 0.25 0.15 6 PIN 1 INDEX AREA 6 PIN 1 INDEX AREA 0.50 2.00 1.50 1.50 0.20±0.05 4 (2X) 0.10 0.10 M C A B TOP VIEW 8X 0. 35 ± 0. 05 0.75 BOTTOM VIEW 2.50 2.10 0.70±0.05 SIDE VIEW SEE DETAIL "X" 0.10 C C BASE PLANE SEATING PLANE 0.08 C (6x0.50) (1.50) (8x0.20) C 0. 2 REF 5 (8x0.55) (0.75) (8x0.20) 0. 00 MIN. 0. 05 MAX. DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. 2. 3. 4. 5. 6. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. Dimensioning and tolerancing conform to ASME Y14.5m-1994. Unless otherwise specified, tolerance : Decimal ± 0.05 Dimension applies to the metallized terminal and is measured between 0.25mm and 0.35mm from the terminal tip. Tiebar shown (if present) is a non-functional feature. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. FN6872 Rev 1.00 Page 17 of 17