MCO Applications 24th January 2011, Washington DC JSTC 24 January 2011 1
Semiconductor as enabling industry Semiconductors are everywhere and can be found as advanced solutions in (examples): PC Power Supplies Innovations in Lighting Intelligent car key Cold-chain- food control MEMS Oscillator Ultra Low Power devices JSTC 17 January 2011 2
New types of semiconductor products Semiconductors are an industry of rapid technological development, enabling such societal, consumer and business needs as: increased performance ultra miniaturization energy saving in cars, PCs, home electrical appliances and electronic equipment cost saving As a result, a diverse range of high-functional super-high density packaged products - incorporating combinations of integrated circuits and discrete components - has been emerging as an integrated circuit configuration and has been in high demand in recent years JSTC 24 January 2011 3
GAMS & the social contribution of MCO Excerpt from the GAMS Chair s Summary September 16, 2010: «GAMS recognizes the social contribution of semiconductors as one that serves an important role in enabling efficiency and renewable energy thereby reducing global warming and promoting energy security. [ ] GAMS welcomes the report by the SIRIJ [Semiconductor Industry Research Institute Japan] which shows that increased energy consumed by ICT products can enable substantially lower consumption in the rest of the economy. GAMS has also noted the particular role played by newly developed semiconductors such as MCO in this respect. Based on the social contribution of semiconductors, GAMS underlined the importance of facilitating the growth of the market for such semiconductor products through zero duties on MCO with an appropriate definition that captures these new trends» JSTC 24 January 2011 4
New Markets in a Symbiotic Society presentation to GAMS Source: Semiconductor Research Institute Japan JSTC 24 January 2011 5
Market: Saving Potential by Using Power Electronics POWER SUPPLY LIGHTING INDUCTIVE COOKING TRACTION DRIVES MOTOR CONTROL FAN MOTOR DRIVES and AIR CONDITIONER STAND-BY POWER (TV) 1% Saving potential 25% Saving potential 25% Saving potential 20-30% Saving potential 30-40% Saving potential 30-40% Saving potential 90% Saving potential (using electronic ballast) (using induction instead of electric ovens) (using power semiconductors e.g. recuperation of braking energy) (using inverters) (using Intelligent Compressor Control) Source: eupec GmbH; BVG- Berlin; Siemens / ECPE, 10/2005 JSTC 24 January 2011 6
The case of MCO Multicomponent/ Multi-chip like integrated circuits, e.g. : 1) Monolithic IC/Multichip IC and Passive components 2) Monolithic IC/Multichip IC and Active components 3) Monolithic IC/Multichip IC and Active & Passive Multi-chip integrated circuits & Monolithic integrated circuits are classified inside heading 8542 (under HS2007) Outside heading 8542!! Additional components in modern semiconductor products: resistors capacitors sensors based on variable resistance and capacitance inductors passive integrated networks piezo-electric elements Source: JEITA, ESIA JSTC 24 January 2011 7
Semiconductor Development Impact on Packaging 2008 A Analog/RF More than Moore: Diversification Passives HV Power Sensors Actuators Biochips Medical More Moore: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm.. V B Information Processing Digital content System-on-chip (SoC) C Interacting with people and environment Non-digital content System-in-package (SiP) A < B < C < D < E < F A = Monolithic ICs; B= Multichip (MCP); C = MCP + Discretes D = Passive Integration and Discretes; E = D + MEMS + Optical devices; Beyond CMOS F = Solution with through Silicon via (TSV) Each group may contain all or only parts of elements specified JSTC 24 January 2011 8 D E F
International Technology Roadmap for Semiconductors (ITRS) Semiconductor technology trends In the late 1960s, Intel co-founder Gordon Moore predicted the number of transistors on a chip would double every 18 months; an observation now referred to as Moore s law. Referred to as More Moore this trend continues, particularly for memories and microprocessors, which depend on size and power reduction for introduction of ever increasing complexity. At the same time, a greater variety of semiconductor devices can be combined on the same chip in SoCs [System-on-Chips] or in the same package using SiPs [System-in-Package]. This concept, known as More than Moore, adds a lot of other devices on top of the pure CMOS process such as analog/rf, passive, high-voltage (HV) power, sensor/actuator, biochip and MEMS components that are processed and embedded in the chip/package instead of being added at systems level. This improves system integration by an order of magnitude and opens new application fields. JSTC 24 January 2011 9
Evolution of semiconductor integration configurations A A B C D D E F Monolithic ICs, Included in HS2002 Multi Chip ICs, Included in HS2007 MCO ICs in production, not covered in HS2007 MCO ICs in development, not covered in HS2007 D A B C D E Note: B to D typically use BGA or similar packages. Packages with MEMS may differ JSTC 24 January 2011 10 10
Packaging History Single chip from 1950, WB in single Package A IC Power HF Chip Memory ASIC Mikroprozessor Opto Montage 1 Wire Bond Bumping Umhüllen Package PDIP PGA QFP SOJ BGA CSP FC VIC PDIP = Plastic Dual Inline Package PGA = Pin Grid Array QFP = Quad Flat Package SOJ = Small Outline J-Leaded BGA = Ball Grid Array CSP = Chip Size Package FC = Flip Chip (Package) VIC = Vertical integrated Circuit (TSV-Package) HF= High Frequency Such standard IC packages are used to assemble different monolithic semiconductor technologies Technology Performance 1970 PDIP QFP BGA Molding 2000 1985 JSTC 24 January 2011 11
Examples of Semiconductor product evolution shown in following slides Slide 13: Monolithic IC (type A) Slide 14 + 15: Multi-chip IC (type B) Slide 16: Multi-chip plus discrete elements integrated into single package (type C) Slides 17, 18: Solution with passive integration and discrete elements (type D) Slides 19, 20, 21: Solutions with passive integration/semiconductor technology based MEMS/optical and discrete elements (type E) Slide 22: 3D integration with multiple types of elements (type F) JSTC 24 January 2011 12
Standard Telecom PCB Board (ADSL): Single Chip mounted on a PCB together with passives A ADSL Digital Processor A ADSL Line Driver A Transformer A A A A A JSTC 24 January 2011 13
Examples for leadframe MCPs, chip to chip wire bonding DECT MCP / since 1995 in volume B P-TQFP-144-3 8 interconnections, 1997 onwards TV Megatext P-MQFP-64-8 65 interconnections, 1998 onwards JSTC 24 January 2011 14
Examples for leadframe with substrate, wire bonding. Used in TV set for video-text TV Text MCP / since 1999 in volume B 2 layer thin film on silicon substrate ~ 260 wires std. LF die pad production, 1999-2003 Flash thin film on silicon substrate Logic + Flash P-SDIP-52-3, ~14x46x4.8mm, JSTC 24 January 2011 15
Bluetooth Module C Top and bottom views of module, Schematic diagram of the module. Note the capacitors and resisters around the logic dies, U1 and U2 (Source: National Semiconductor) JSTC 24 January 2011 16 16
Standard ADSL system line cards SiP plus integrated passives, 2005 D History 2 x Passives Integrated Filter Caps Integration of four channels per package inclusive passive components JSTC 24 January 2011 17
IC Package with TV reception functionality D Pictures show components with several lc dies, discrete and integrated passive circuit elements before plastic molding into standard IC package Monolithic IC die 2.25mm 2 Passive integration Monolithic IC die 3.5mm 2 Substrate Monolithic IC die 16mm 2 JSTC 24 January 2011 18 18
Silicon Microphone Device, 2007 E Application Consumer application with special focus on mobile phones. Notebooks Cameras Also suitable for automotive, industrial or medical applications, where microphones are directly assembled onto the PCB and where size as well as temperature immunity matter Technology The Silicon Microphone Device consists of two chips combined in a single package. The MEMS chip is capacitor made up of a stiff and perforated backplate and a flexible membrane on silicon substrate. It transfers the sound waves into capacity variations. The ASIC chip converts the capacity variations into an electrical signal. JSTC 24 January 2011 19 19
Tire Pressure Monitoring Sensor, 2008 E Mainly used in cars Helps reduce road fatalities by monitoring tyres inflation and warning the driver in case of under-inflation Contributes to lower fuel energy The IC contains 2 chips inside a standard plastic semiconductor package. A MEMS sensor die capable of measuring pressure and acceleration A signal conditioning ASIC. The IC will provide output data: MEMS Pressure (from the MEMS sensor) Sensor Acceleration From the MEMS sensor) Temperature (from the ASIC) Battery voltage (from the ASIC) ASIC JSTC 24 January 2011 20 20
Optical Modules E Isometric View of Final Module Top View of Final Module Cross-section of Final Module Actuator Assembly Exploded View IR Holder Assembly Substrate & Die Assembly Actuator Sub-components - Assembled by supplier IR Glass AF85 VCM Module Design June 2008 21
Solution with 3D Integration (Future oriented) F Bulk Acoustic Wave filter and Tire Pressure Sensor in Through Silicon Via (TSV) realization. Source:SINTEF Source: IZM Munich TSV Source: SINTEF, e-cubes Project JSTC 24 January 2011 22 22
Semiconductor (and MCOs) are not PCBs or end use systems Semiconductor products are clearly distinguished from PCB (Printed Circuit Board) products and end use systems, for: Different connection techniques: all examples shown demonstrated that by connection techniques typical of semiconductor industry at package level the result is a clear semiconductor product Interconnection Wire bonding Flip chip Die attach Packaging (Molding) Element relative density JSTC 24 January 2011 23
MCO definition background Consecutive definition proposals for MCOs: November 2007: Japanese Gov definition proposal based on the World Semiconductor Council proposal October 2008: US Gov definition proposal more restrictive in scope February 2010: European Commission non-paper, built on the definition proposals by Japan and US WSC proposal of 2007 (scope) JSTC list of MCO products November 2010 WCO does not take up MCO definition issue. December 2010 USITC sends invitation per the GAMS summary of the Kobe meeting; GAMS invited its members to consult their customs experts without delay to start to develop and finalize preferably before April 2001 a definition of what constitutes multicomponent (MCO) products...gams envisages to reach a consensus on duty free treatment in its GAMS 2011 meeting. JSTC 24 January 2011 24
What are MCOs? A summary MCOs are products manufactured in semiconductor technology* They perform multiple functions thanks to the variety of components integrated in a single unit MCOs are combinations of one or more monolithic, hybrid and/or multi-chip integrated circuits with one or more other elements and are formed into a single body, for connection to a printed circuit board (PCB) or other carrier and which are formed to all intents and purposes indivisibly Even if they have become functionally very powerful, they are not enddevices or finished products. They remain semiconductors. As MCOs currently have to be classified according to their function, they can be found in a broad variety of headings (e.g. as parts of refrigerators or washing machines) * please see Note 8b to HS Chapter 85 JSTC 24 January 2011 25
Back up JSTC 24 January 2011 26
Definition proposals (1) November 2007 Proposed industry (WSC) definition for a multi-component IC (forwarded by the Japanese Government to WCO on November 9, 2007) A multi-component IC is an electronic microcircuit consisting of one or more monolithic, hybrid and/or multi-chip ICs combined with one or more discrete active and/or passive elements and/or other components - including but not limited to MEMS, optoelectronic components, sensor components and/or optical elements - interconnected to all intents and purposes indivisibly, whether or not on one or more flexible or inflexible substrates, with or without leadframes. [April 2008: Revised World Semiconductor Council (WSC) text drafted to meet Authorities concerns, approved by 5 Semiconductor Industry Associations: Multi-component integrated circuits which are combinations of one or more monolithic, hybrid and/or multi-chip integrated circuits with one or more discrete active and/or passive elements, integrated passive dies, micro-electromechanical systems (MEMS), sensors, actuators, piezoelectric, optoelectronic*, and/or optical elements that are formed into a single body**, for connection to a printed circuit board (PCB) or other carrier and which, after manufacturing, would not be susceptible to cost effective removal or replacement of individual elements or the inclusion of elements that were not integrated into the multi-component integrated circuit at the time of original manufacture. *e.g. LED] JSTC 24 January 2011 27
Definition proposals (2) September 2008 Draft definition circulated by the United States Government "Multi-component integrated circuits are combinations of one or more monolithic, hybrid or multi-chip integrated circuits with one or more components classifiable under heading 85.32, 85.33 or 85.41 and formed to all intents and purposes indivisibly with or without a substrate into a single body as a component of a kind used for assembly onto [mounting on?] a printed circuit board (PCB) or other carrier [platform?]. JSTC 24 January 2011 28
Definition proposals (2) February 2010 (confirmed in August 2010) European Commission definition of MCOs: Draft proposal for a definition of multi-component integrated circuits (MCOs) for the purposes of an agreement on duty free tariff treatment "This agreement covers so-called "multi-component integrated circuits", other than those of HS heading 8542 by virtue of Note 8 to Chapter 85 of the HS nomenclature, falling under HS headings [8473, 8504, 8517, 8518, 8522, 8523, 8525, 8528, 8529, 8535, 8536, 8537, 8543, 8548, 9026, 9030, 9031, 9032 and 9504]. In this context a "multi-component integrated circuit" is defined as a combination of one or more monolithic, hybrid and/or multichip integrated circuits with one or more components of HS headings [8504, 8505, 8517, 8518, 8522, 8529, 8532, 8533, 8534, 8541, 8543, 8548, 9001,9002, 9026 and 9031] [or other semiconductor-based devices], interconnected and combined to all intents and purposes indivisibly into a single package for assembly onto a printed circuit board or other carrier." JSTC 24 January 2011 29