Evangéline BENEVENT Università Mediterranea di Reggio Calabria DIMET 1
Evolution of electronic circuits: high frequency and complexity Moore s law More than Moore System-In-Package System-On-Package Applications Design of MMIC 2
Evolution of electronic circuits: high frequency and complexity 1948: invention of the transistor. During the seventies: the bipolar transistor is competed with the FET (field effect transistor) in GaAs (gallium arsenide). At that time, the electronic circuits are realized in printed circuits. The active and passive components were soldered on a substrate with previously arranged connection lines. 1975: first MMIC based on a FET, an input matching circuit, an inductance and a capacitance which make up a 10 GHz amplifier [1]. [1] R.S. Pengelly, Broad band lumped element X-band GaAs FET amplifiers, Proceedings of 5th European Microwave Conference, Sept. 1975, p. 301-305. 3
Evolution of electronic circuits: high frequency and complexity What s a MMIC? Definition: Monolithic Microwave Integrated Circuits. The components are made by a series of depositions (photolithography) on a single substrate. All the components are made at the same time: Mass-manufacturing process. This technology permits to manufacture several identical circuit on a single wafer. 2.4 GHz Distributed active transformer power amplifier, Caltech (USA). 4
Moore s law Moore s law has predicted that the number of transistors on an IC doubles every 18 months. In the computing world, having more transistors on a chip means more speed and possibly more functions. In electronic world, reducing the size of components means miniaturization of ICs and introduction of electronic circuits in many new objects. 5
More than Moore But in many cases, those Moore's Law ICs deal with only 10 percent of the system. The other 90 percent is still there, showing up as an array of bulky discrete passive components such as resistors, capacitors, inductors, antennas, filters, and switches, interconnected over a printed-circuit board or two. Real miniaturization requires something more! By 2010, the "More Than Moore's Law" movement which focuses on system integration rather than transistor density will lead to revolutionary megafunction electronics. New applications require to integrate a strong diversity of functions such as voice, video, data, RF communication, sensing, and so on. 6
More than Moore Two new ways for system integration: System-In-Package (SiP), System-On-Package (SoP). System-In-Package: A system-in-a-package or system in package (SiP) is a number of integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically or horizontally on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. 7
More than Moore System-In-Package: Flip-chip technique Bond-wire technique 8
More than Moore System-On-Package: System-On-Package approach was recently proposed by the Microsystems Packaging Research Center at the Georgia Institute of Technology, in Atlanta. System-On-Package leapfrogs well beyond Moore's Law. It combines ICs with micrometer-scale thin-film versions of discrete components, and it embeds everything in a new type of tiny package. 9
Applications: Civil applications: Mobile phones: 1.8 GHz, Satellite television: 11 GHz, Automotive sector: sensors, anti-collision radar (77 GHz), toll without stopping of the cars, monitoring systems of roads or tunnel, etc. Rail transports, Air navigation: means of localization (GPS, GALILEO), communications with the crew, etc. Military applications. Satellite, Communications, Etc. 10
Applications: Telecommunications: Fixed or mobile radio link, Local network (HiperLAN for Europe), Point-to-multipoint digital microwave radio, Connections between computers and its accessories, Etc. Example of standards: 802.11 standard (USA): 2.4 GHz communication, 1 Mbit/s throughput, 802.11a standard (USA): 5 GHz communication, 54 Mbit/s, 802.11b standard (WiFi, USA): 1 or 5.5 or 11 Mbit/s at 2.4 GHz. 802.15.4 standard (WPAN): 2.45 GHz (World), Etc. 11
Design of MMIC Choice of the substrate and materials linked to the application. Known components and circuits: New components and circuits with extended capabilities of frequency, power, noise, losses, etc. Polarization of active components. Linear and non-linear simulation, and electromagnetic simulation: Use of complete models of components, with parasitic elements. Layout. Packaging? After manufacturing: tests. 12
Evangéline BENEVENT Università Mediterranea di Reggio Calabria DIMET Thank you for your attention! 13