2N7000 2N7002 NDF7000A NDS7002A N-Channel Enhancement Mode Field Effect Transistor

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Transcription:

2N7000 2N7002 NDF7000A NDS7002A N-Channel Enhancement Mode Field Effect Transistor General Description These n-channel enhancement mode field effect transistors are produced using National s very high cell density third generation DMOS technology These products have been designed to minimize on-state resistance provide rugged and reliable performance and fast switching They can be used with a minimum of effort in most applications requiring up to 400 ma DC and can deliver pulsed currents up to 2A This product is particularly suited to low voltage low current applications such as small servo motor controls power MOSFET gate drivers and other switching applications TO-92 7000 Series TL G 11378 1 Absolute Maximum Ratings Features Y Y Y Y Y TO-236 AB (SOT-23) 7002 Series Efficient high density cell design approaching (3 million in2) Voltage controlled small signal switch Rugged High saturation current Low RDS (ON) TL G 11378 2 March 1993 TL G 11378 3 Symbol Parameter 2N7000 2N7002 NDF7000A NDS7002A Units V DSS Drain-Source Voltage 60 V V DGR Drain-Gate Voltage (R GS s 1MX) 60 V V GSS Gate-Source Voltage g40 V I D Drain Current Continuous 200 115 400 280 ma Pulsed 500 800 2000 1500 ma P D Total Power Dissipation T A e 25 C 400 200 625 300 mw Derating above 25 C 3 2 1 6 5 2 4 mw C T J T STG Operating and Storage Temperature Range b55 to 150 b65 to 150 C T L Maximum Lead Temperature for Soldering Purposes from Case for 10 Seconds 300 C 2N7000 2N7002 NDF7000A NDS7002A N-Channel Enhancement Mode Field Effect Transistor C1995 National Semiconductor Corporation TL G 11378 RRD-B30M115 Printed in U S A

2N7000 Electrical Characteristics T C e 25 C unless otherwise noted Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS e 0V I D e 10 ma 60 V I DSS Zero Gate Voltage Drain Current V DS e 48V V GS e 0V 1 ma T C e 125 C 1 ma I GSSF Gate-Body Leakage Forward V GS eb15v V DS e 0V b10 na ON CHARACTERISTICS V GS(th) Gate Threshold Voltage V DS e V GS I D e1 ma 0 8 2 1 3 V r DS(ON) Static Drain-Source V GS e 10V I D e 0 5A 1 2 5 X On-Resistance T C e 125 C 1 9 9 X V DS(ON) Drain-Source On-Voltage V GS e 10V I D e 0 5A 0 6 2 5 V V GS e 4 5V I D e 75 ma 0 14 0 4 V I D(ON) On-State Drain Current V GS e 4 5V V DS e 10V 75 600 ma g FS Forward Transconductance V DS e 10V I D e 200 ma 100 320 ms DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS e 25V V GS e 0V f e 1 0 MHz 20 60 pf C oss Output Capacitance 11 25 pf C rss Reverse Transfer Capacitance 4 5 pf SWITCHING CHARACTERISTICS t on Turn-On Time V DD e 15V I D e 0 5V V GS e 10V 10 ns t off Turn-Off Time R G e 25X R L e25x 10 ns BODY-DRAIN DIODE RATINGS I S Maximum Continuous Drain-Source Diode Forward Current 200 ma I SM Maximum Pulsed Drain-Source Diode Forward Current 500 ma V SD Drain-Source Diode Forward Voltage V GS e 0V I S e 200 ma 1 5 V THERMAL CHARACTERISTICS R ija Thermal Resistance Junction to Ambient 312 5 C W R ijc Thermal Resistance Junction to Case 40 C W Pulse Test Pulse Width s 300 ms Duty Cycle s 2 0% 2

2N7002 Electrical Characteristics T C e 25 C unless otherwise noted Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS e 0V I D e 10 ma 60 V I DSS Zero Gate Voltage Drain Current V DS e 60V V GS e 0V 1 ma T C e 125 C 500 ma I GSSF Gate-Body Leakage Forward V GS e 20V 100 na I GSSR Gate-Body Leakage Reverse V GS eb20v b100 na ON CHARACTERISTICS V GS(th) Gate Threshold Voltage V DS e V GS I D e250 ma 1 2 1 2 5 V r DS(ON) Static Drain-Source V GS e 10V I D e 0 5A 1 2 7 5 X On-Resistance T C e 125 C 2 13 5 X V GS e 5V I D e 50 ma 1 7 7 5 X T C e 125 C 2 8 13 5 X V DS(ON) Drain-Source On-Voltage V GS e 10V I D e 0 5A 0 6 3 75 V V GS e 5V I D e 50 ma 0 09 1 5 V I D(ON) On-State Drain Current V GS e 10V V DS t 2V DS(ON) 500 2700 ma g FS Forward Transconductance V DS t 2V DS(ON) I D e200 ma 80 320 ms DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS e 25V V GS e 0V f e 1 0 MHz 20 50 pf C oss Output Capacitance 11 25 pf C rss Reverse Transfer Capacitance 4 5 pf SWITCHING CHARACTERISTICS t ON Turn-On Time V DD e 30V I D e 200 ma V GS e 10V 20 ns t OFF Turn-Off Time R GEN e 25X R L e150x 20 ns BODY-DRAIN DIODE RATINGS I S Maximum Continuous Drain-Source Diode Forward Current 115 ma I SM Maximum Pulsed Drain-Source Diode Forward Current 800 ma V SD Drain-Source Diode Forward Voltage V GS e 0V I S e 115 ma 1 5 V THERMAL CHARACTERISTICS R ija Thermal Resistance Junction to Ambient 625 C W Pulse Test Pulse Width s 300 ms Duty Cycle s 2 0% 3

NDF7000A Electrical Characteristics T C e 25 C unless otherwise noted Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS e 0V I D e 10 ma 60 V I DSS Zero Gate Voltage Drain Current V DS e 48V V GS e 0V 1 ma T C e 125 C 1 ma I GSSF Gate-Body Leakage Forward V GS eb15v b10 na ON CHARACTERISTICS V GS(th) Gate Threshold Voltage V DS e V GS I D e1 ma 0 8 2 1 3 V r DS(ON) Static Drain-Source V GS e 10V I D e 0 5A 1 2 2 X On-Resistance T C e 125 C 2 3 5 X V DS(ON) Drain-Source On-Voltage V GS e 10V I D e 500 ma 0 6 1 V V GS e 4 5V I D e 75 ma 0 14 0 225 V I D(ON) On-State Drain Current V GS e 4 5V V DS t 2V DS(ON) 400 600 ma g FS Forward Transconductance V DS t 2V DS(ON) I D e200 ma 100 320 ms DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS e 25V V GS e 0V f e 1 0 MHz 20 60 pf C oss Output Capacitance 11 25 pf C rss Reverse Transfer Capacitance 4 5 pf SWITCHING CHARACTERISTICS t on Turn-On Time V DD e 15V I D e 500 ma V GS e 10V 10 ns t off Turn-Off Time R G e 25X R L e25x 10 ns BODY-DRAIN DIODE RATINGS I S Maximum Continuous Drain-Source Diode Forward Current 400 ma I SM Maximum Pulsed Drain-Source Diode Forward Current 2000 ma V SD Drain-Source Diode Forward Voltage V GS e 0V I S e 400 ma 0 88 1 2 V THERMAL CHARACTERISTICS R ija Thermal Resistance Junction to Ambient 200 C W Pulse Test Pulse Width s 300 ms Duty Cycle s 2 0% 4

NDS7002A Electrical Characteristics T C e 25 C unless otherwise noted Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BV DSS Drain-Source Breakdown Voltage V GS e 0V I D e 10 ma 60 V I DSS Zero Gate Voltage Drain Current V DS e 60V V GS e 0V 1 ma T C e 125 C 500 ma I GSSF Gate-Body Leakage Forward V GS e 20V 100 na I GSSR Gate-Body Leakage Reverse V GS eb20v b100 na ON CHARACTERISTICS V GS(th) Gate Threshold Voltage V DS e V GS I D e250 ma 1 2 1 2 5 V r DS(ON) Static Drain-Source V GS e 10V I D e 0 5A 1 2 2 X On-Resistance T C e 125 C 2 3 5 X V GS e 5V I D e 50 ma 1 7 3 X T C e 125 C 2 8 5 X V DS(ON) Drain-Source On-Voltage V GS e 10V I D e 500 ma 0 6 1 V V GS e 5 0V I D e 50 ma 0 09 0 15 V I D(ON) On-State Drain Current V GS e 10V V DS t 2V DS(ON) 500 2700 ma g FS Forward Transconductance V DS t 2V DS(ON) I D e200 ma 80 320 ms DYNAMIC CHARACTERISTICS C iss Input Capacitance V DS e 25V V GS e 0V f e 1 0 MHz 20 50 pf C oss Output Capacitance 11 25 pf C rss Reverse Transfer Capacitance 4 5 pf SWITCHING CHARACTERISTICS t ON Turn-On Time V DD e 30V I D e 200 ma V GS e 10V 20 ns t OFF Turn-Off Time R G e 25X R L e150x 20 ns BODY-DRAIN DIODE RATINGS I S Maximum Continuous Drain-Source Diode Forward Current 280 ma I SM Maximum Pulsed Drain-Source Diode Forward Current 1500 ma V SD Drain-Source Diode Forward Voltage V GS e 0V I S e 400 ma 0 88 1 2 V THERMAL CHARACTERISTICS R ija Thermal Resistance Junction to Ambient 417 C W Pulse Test Pulse Width s 300 ms Duty Cycle s 2 0% 5

Typical Electrical Characteristics 2N7000 2N7002 NDF7000A NDS7002A TL G 11378 4 FIGURE 1 On-Region Characteristics TL G 11378 5 FIGURE 2 r DS(ON) Variation with Drain Current and Gate Voltage TL G 11378 6 FIGURE 3 Transfer Characteristics FIGURE 4 Breakdown Voltage Variation with Temperature TL G 11378 7 TL G 11378 8 FIGURE 5 Gate Threshold Variation with Temperature TL G 11378 9 FIGURE 6 On-Resistance Variation with Temperature 6

Typical Electrical Characteristics (Continued) 2N7000 2N7002 NDF7000A NDS7002A (Continued) FIGURE 7 On-Resistance vs Drain Current TL G 11378 10 TL G 11378 11 FIGURE 8 Body Diode Forward Voltage Variation with Current and Temperature TL G 11378 12 FIGURE 9 Capacitance vs Drain-Source Voltage TL G 11378 13 FIGURE 10 Gate Charge vs Gate-Source Voltage TL G 11378 14 FIGURE 11 2N7000 Safe Operating Area TL G 11378 15 FIGURE 12 2N7002 Safe Operating Area 7

Typical Electrical Characteristics (Continued) 2N7000 2N7002 NDF7000A NDS7002A (Continued) TL G 11378 16 FIGURE 13 NDF7000A Safe Operating Area TL G 11378 17 FIGURE 14 NDS7002A Safe Operating Area FIGURE 15 TO-92 Transient Thermal Response TL G 11378 18 FIGURE 16 SOT-23 Transient Thermal Response TL G 11378 19 8

Physical Dimensions inches (millimeters) TO-92 TL G 11378 20 9

2N7000 2N7002 NDF7000A NDS7002A N-Channel Enhancement Mode Field Effect Transistor Physical Dimensions inches (millimeters) (Continued) Note 1 Meets all JEDEC dimensional requirements for TO-236AB Note 2 Controlling dimension millimeters Note 3 Available also in TO-236AA Contact your local National Semiconductor representative for delivery and ordering information Note 4 Tape and reel is the standard packaging method for TO-236 LIFE SUPPORT POLICY TO-236AB (SOT-23) (Notes 3 4) TL G 11378 21 NATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a) are intended for surgical implant support device or system whose failure to perform can into the body or (b) support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectiveness be reasonably expected to result in a significant injury to the user National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd Japan Ltd 1111 West Bardin Road Fax (a49) 0-180-530 85 86 13th Floor Straight Block Tel 81-043-299-2309 Arlington TX 76017 Email cnjwge tevm2 nsc com Ocean Centre 5 Canton Rd Fax 81-043-299-2408 Tel 1(800) 272-9959 Deutsch Tel (a49) 0-180-530 85 85 Tsimshatsui Kowloon Fax 1(800) 737-7018 English Tel (a49) 0-180-532 78 32 Hong Kong Fran ais Tel (a49) 0-180-532 93 58 Tel (852) 2737-1600 Italiano Tel (a49) 0-180-534 16 80 Fax (852) 2736-9960 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications

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