TPDV640RG TPDV840RG TPDV1240RG

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TPDVxx4 4 A high voltage Triacs Features On-state current (I T(RMS) ): 4 A Max. blocking voltage (V DRM /V RRM ): 12 V Gate current (I GT ): 2 ma Commutation @ 1 V/µs: up to 142 A/ms Noise immunity: 5 V/µs insulated package: 2,5 V rms (UL recognized: E81734). G A2 A1 Description The TPDVxx4 series use a high performance alternistor technology. Featuring very high commutation levels and high surge current capability, this family is well adapted to power control on inductive load (motor, transformer...) A1 A2 G TOP3 insulated Table 1. Device summary Parameter TPDV64RG TPDV84RG TPDV124RG Blocking voltage V DRM /V RRM 6 V 8 V 12 V On-state current I T(RMS) Gate current I GT 4 A 2 ma March 211 Doc ID 1827 Rev 1 1/7 www.st.com 7

Characteristics TPDVxx4 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit I T(RMS) On-state rms current (18 conduction angle) T c = 75 C 4 A I TSM Non repetitive surge peak on-state current t p = 2.5 ms 59 t p = 8.3 ms T j = 25 C 37 t p = 1 ms 35 I 2 t I 2 t value for fusing t p = 1 ms T j = 25 C 61 A 2 S di/dt V DRM V RRM T stg T j Critical rate of rise of on-state current I G = 5 ma, di G /dt = 1 A/µs Repetitive peak off-state voltage Storage junction temperature range Operating junction temperature range Repetitive F = 5 Hz 2 Non repetitive 1 TPDV64 6 TPDV84 T j = 125 C 8 TPDV124 12-4 to + 15-4 to + 125 T L Maximum lead temperature for soldering during 1s at 2mm from case 26 C V INS(RMS) (1) Insulation rms voltage 25 V 1. A1, A2, gate terminals to case for 1 minute Table 3. Electrical Characteristics (T j = 25 C, unless otherwise specified) Symbol Test conditions Quadrant Value Unit I GT MAX. 2 ma V D = 12 V DC, R L = 33 Ω I - II - III V GT MAX. 1.5 V V GD V D = V DRM R L = 3.3 kω T j = 125 C I - II - III MIN..2 V t gt V D = V DRM I G = 5 ma di G /dt = 3 A/µs I - II - III TYP. 2.5 µs I H (1) I T = 5 ma Gate open MAX. 5 ma I L I G = 1.2 x I GT I - III 1 TYP. II 2 Linear slope up to: dv/dt T V D = 67 % V DRM Gate open j = 125 C MIN. 5 V/µs V (1) TM I TM = 35 A t p = 38 µs MAX. 1.8 V I DRM T j = 25 C 2 µa V I DRM = V RRM MAX. RRM T j = 125 C 8 ma (di/dt)c (1) (dv/dt)c = 2 V/µs 35 T j = 125 C MIN. A/ms (dv/dt)c = 1 V/µs 142 1. For either polarity of electrode A 2 voltage with reference to electrode A 1. A A/µs V C ma 2/7 Doc ID 1827 Rev 1

TPDVxx4 Characteristics Table 4. Gate characteristics (maximum values) Symbol Parameter Value Unit P G(AV) Average gate power dissipation 1 W P GM Peak gate power dissipation t p = 2 µs 4 W I GM Peak gate current t p = 2 µs 8 A V GM Peak positive gate voltage t p = 2 µs 16 V Table 5. Thermal resistance Symbol Parameter Value Unit R th(j-a) Junction to ambient 5 C/W R th(j-c) DC Junction to case for DC 1.2 C/W R th(j-c) AC Junction to case for 36 Conduction angle (F = 5 Hz).9 C/W Figure 1. Max. rms power dissipation versus on-state rms current (F = 5 Hz). (curves limited by (di/dt)c) Figure 2. Max. rms power dissipation and max. allowable temperatures (T amb and T case ) for various R th P(W) 6 5 4 3 α = 6 α = 9 α = 12 α = 18 2 α = 3 18 α 1 α I T(RMS) (A) 5 1 15 2 25 3 35 4 6 5 4 3 2 P(W) T ( C) case R th =.75 C/W R th =.5 C/W R th =.25 C/W R th = C/W 1 115 T amb( C) 125 2 4 6 8 1 12 14 75 85 95 15 Figure 3. On-state rms current versus case temperature Figure 4. Relative variation of thermal impedance versus pulse duration I T(RMS) (A) 5 1. K=[Z th(j-c) /Rth(j-c)] 4 α = 18 Zth(j-c) 3.1 2 1.1 Zth(j-a) T case( C) 25 5 75 1 125 t p(s). 1E-3 1E-2 1E-1 1E+ 1E+1 1E+2 1E+3 Doc ID 1827 Rev 1 3/7

Characteristics TPDVxx4 Figure 5. Relative variation of gate trigger current and holding current versus junction temperature Figure 6. Non repetitive surge peak on-state current versus number of cycles I GT,I H,I L[T] j / I GT,I H,I L[T j=25 C] 2.5 I TSM(A) 35 2 3 t p=1ms 1.5 IGT 25 2 One cycle 1 IH & IL 15 initial=25 C.5 T ( C) j -4-3 -2-1 1 2 3 4 5 6 7 8 9 1 11 12 13 1 5 Number of cycles 1 1 1 1 Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse and corresponding values of I 2 t Figure 8. On-state characteristics (maximum values) 1 2 2 I TSM(A), I t (A s) initial = 25 C I TM(A) 1 1 =max 1 2 I t ITSM 1 T j=25 C t p(ms) 1 1 2 5 1 V TM(V) max.: V t=1.2v R d=12mω 1 1 2 3 4 5 6 Figure 9. Safe operating area below curve (dv/dt)c(v/µs) 1 initial = 25 C 1 1 (di/dt)c(a/ms) 1 1 1 1 4/7 Doc ID 1827 Rev 1

TPDVxx4 Package information 2 Package information Epoxy meets UL94,V Cooling method: C (by conduction) Recommended torque value:.9 to 1.2 N m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 6. TOP3 insulated dimensions Ref. Millimeters Dimensions Inches R H ØL B A Min. Max. Min. Max. A 4.4 4.6.173.181 B 1.45 1.55.57.61 K F G C 14.35 15.6.565.614 D.5.7.2.28 E 2.7 2.9.16.114 F 15.8 16.5.622.65 P C G 2.4 21.1.815.831 H 15.1 15.5.594.61 J 5.4 5.65.213.222 J J E D K 3.4 3.65.134.144 ØL 4.8 4.17.161.164 P 1.2 1.4.47.55 R 4.6 typ..181 typ. Doc ID 1827 Rev 1 5/7

Ordering information TPDVxx4 3 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty Delivery mode TPDV64RG TPDV84RG TPDV124RG TPDV64 TPDV84 TPDV124 TOP3 insulated 4.5 g 3 Tube 4 Revision history Table 8. Document revision history Date Revision Changes 3-mar-211 1 First issue. 6/7 Doc ID 1827 Rev 1

TPDVxx4 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 211 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 1827 Rev 1 7/7