FT01MHNG FT01MVNG. 530 nm DC-1 MBd RedLink Fiber Optic Transmitter Datasheet DESCRIPTION FEATURES APPLICATIONS AVAILABLE OPTIONS

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FT01MHNG FT01MVNG 530 nm DC-1 MBd RedLink Fiber Optic Transmitter Datasheet DESCRIPTION The Firecomms DC to 1 MBd green 530 nm transmitter is designed for maximum distance at low speed communication in Plastic Optic Fiber (POF). It is housed in a non-conducting plastic RedLink connector. The housings are compatible with the Versatile Link style fiber plug and are optimized for use with both POF and Polymer Clad Silica (PCS). The transmitter can be driven from TTL type logic drivers. It operates over the industrial temperature range of -40 ⁰C to +85 ⁰C, supporting many industrial applications where reliable command and control response is required in electrically harsh environments. The transmitter utilizes an eye-safe, highly-efficient gallium nitride LED. Since the attenuation of POF is lower at green wavelengths a maximum link distance of greater than 150 m can be easily achieved. The transmitter operates over a wide range of drive current that can be adjusted using a serial resistor to minimize current consumption for known fiber distances. AVAILABLE OPTIONS Table 1 ORDERING INFORMATION / PART NUMBERS 1 MBd Horizontal Package Non-Inverting, TTL 1 MBd Vertical Package Non-Inverting, TTL FT01MHNG FT01MVNG FEATURES Optimized for data transmission from DC to 1 MBd Visible LED at green wavelength (530 nm) Extended length applications over POF (150-200 m, depending on data rate) Industrial temperature range -40 ⁰C to +85 ⁰C RoHS compliant and flame retardant (UL 94 V-0) connector housings TTL/CMOS compatible for ease of design Low pulse width distortion Low current consumption Compatible with Versatile Link cables and connectors APPLICATIONS Application Standard Distance Speed Table 2 APPLICATIONS Motor Control, Voltage Isolation, Drives, Inverters, Industrial Control, Gaming, Medical Imaging Low-speed serial RS232, RS485, CAN Bus, Modbus, Profibus 150 200 meters Step Index (SI) POF depending upon ambient temperature and installation conditions DC to 1 MBd 1

SPECIFICATIONS Table 3 TRANSMITTER PIN DESCRIPTION Pin Name Symbol 1 LED ANODE TD + 2 LED CATHODE TD - 3 LED ANODE TD + 4 LED ANODE TD + 5 Retaining Pin Gnd 8 Retaining Pin Gnd 5, Gnd 8, Gnd FIGURE 1 Transmitter pin-out, top view 4, TD + 3, TD + 2, TD - 1, TD + Table 4 REGULATORY COMPLIANCE Parameter Symbol Standard Level Electrostatic Discharge, Human Body Model (contact ESD) HBM Mil-STD-883 Level 2 (4 kv) Radiated Emissions Immunity Vm -1 IEC 61000-4-3 15 Vm -1 UL Certification UL 60950-1 Files No. E362227 Storage Compliance MSL J-STD-020 2a (4-week floor life) Restriction of Hazardous Substances Directive RoHS Directive 2011/65/EU Certified compliant Eye Safety IEC 60825-1 LED Class 1 RECOMMENDED APPLICATION CIRCUIT 5 C1, 4.7µF R1, 100Ω 4 Vcc (5V) 3 2 1 1/2 SN75451 DATA 8 FIGURE 2 Recommended transmitter application circuit. See note 4 Table 6 2

SPECIFICATIONS Table 5 ABSOLUTE MAXIMUM RATINGS These are the absolute maximum ratings at or beyond which the component can be expected to be damaged. Notes: 1. 260 C for 10 sec, one time only, at least 2.2 mm away from lead root 2. When peak forward current exceeds 20 ma then the duty cycle must maintain a pulse width (PW) less than 1 µs and average forward current less than or equal to 20 ma. [20 ma IFPK 40 ma IFAVG 20 ma AND PW 1 µs] Parameter Symbol Minimum Maximum Unit Storage Temperature Tstg -40 +85 C Operating Temperature Top -40 +85 C Soldering Temperature [1] Tsld +260 [1] C TX Reverse Input Voltage VBR 5 V TX Peak Forward Input Current [2] IFPK 40 ma TX Average Forward Input Current [2] IFAVG 20 ma Transmitter Input, V in 50% tpropdly-lh tpropdly-hl Optical Output, P o 80% 50% 20% tr tf FIGURE 3 Transmitter Propagation Delay and rise/fall time definitions as per application circuit of Figure 2 FIGURE 4 Graph of peak drive current against series resistance (R1) 3

SPECIFICATIONS Table 6 TRANSMITTER ELECTRICAL AND OPTICAL CHARACTERISTICS Test Conditions: 1. Test data was validated over the full temperature range of -40 C to +85 C, and over the full drive current range 2. Optical power for POF is measured when coupled into 0.5 m of a 1 mm diameter 0.5 NA POF and a large area detector 3. As measured in the given application circuit (non-inverting) as shown in Figure 2 with 50 cm of 0.5 NA POF 4. Pins 5 and 8 are used for mounting and retaining purposes only. Connect to ground. Parameter Symbol Min Typical Max Unit Test Condition Output Power P -2 1 4 dbm I FDC = 20 ma Peak Emission λ p 520 530 540 nm I FDC = 20 ma Spectral Width RMS 15 20 30 nm I FDC = 20 ma Forward Voltage V F 2.5 3.0 3.5 V I FDC = 20 ma Reverse Input Breakdown Voltage V BR 10 V I FDC = -10µA Data Rate DC 1 MBd Optical Rise Time (20 % - 80 %) t r 50 90 ns I FAVG = 10 ma [3] Optical Fall Time (80 % - 20 %) t f 40 100 ns I FAVG = 10 ma [3] Propagation Delay Low-to-High (Electrical-to-Optical) Propagation Delay High-to-Low (Electrical-to-Optical) PropDly_LH 49 67 96 ns IFAVG = 10 ma [3] Fig 3 PropDly_HL 27 34 53 ns IFAVG = 10 ma [3] Fig 3 Pulse Width Distortion PWD -18-34 -52 ns IFAVG = 10 ma [3] Fig 3 4

4.00 4.00 VF Forward Voltage (V) 3.50 3.00 2.50 2.00 1.50-40'C +25'C +85'C POF Coupled Power (dbm) 2.00 0.00-2.00-4.00-6.00-8.00-10.00-12.00-40'C +25'C +85'C 1.00 1.0 10.0 100.0-14.00 1.0 10.0 100.0 I F,DC -Transmitter Drive Current (ma) FIGURE 5 Typical forward voltage vs. drive current I F,DC -Transmitter Drive Current (ma) FIGURE 6 Typical optical output power vs. drive current -20.00 1.2-25.00 1 PWD-(ns) -30.00-35.00-40.00 4.5 V 5.0 V 5.5 V Normalised Intensity 0.8 0.6 0.4 +85 'C +25 'C -40 'C -45.00 0.2-50.00-40'C 25'C 85'C Temperature ( o C) FIGURE 7 Typical pulse width distortion vs. temperature 0 400 450 500 550 600 650 700 Wavelength (nm) FIGURE 8 Typical spectra vs. temperature 5

MECHANICAL DATA, HORIZONTAL 2.54 (3x) 4.2 3.56 min. 3.81 max. 0.64 0.25 (4X) 0.64 (2x) Front View Side View Rear View 0.5 (4x) 2.54 (3x) 1.27 1.27 Ø1.01 (6x) Pin 1 Indicator Date Code Dust Cap 1.90 min. 10.16 2.83 2 4 3 2 1 8 5 Product Number 5.08 12.35 18.9 22.9 PCB Hole Details Top View Top View FIGURE 9 Mechanical dimensions of the horizontal connectors and PCB footprint, which is a top view General dimensional tolerance is ± 0.2 mm 26.9 16.2 Part Name: RedLink Tx Lot No: RD20160402006 Part Number: FT01MHNG Date Code: 1622A Quantity: 40 515 FIGURE 10 Packing tube for Firecomms Horizontal RedLink Transmitters 6

MECHANICAL DATA, VERTICAL Product Number Date Code 18.90 Ø1.01 (6x) 2.54 (3x) 0.5 (4x) Pin 1 Indicator 4.2 2.79 min. 3.30 max. 0.64 0.25 (4X) Ø0.64 (2x) Front View Side View Rear View 1.57 4.42 5.08 10.16 2.0 Dust Cap 5 8 1.74 1 2 3 4 22.9 18.28 2.54 (3x) 1.27 Top View PCB Hole Details Top View FIGURE 11 Mechanical dimensions of the vertical transmitter components and PCB footprint, which is a top view General dimensional tolerance is ± 0.2 mm 30.6 20.7 Part Name: RedLink Tx Lot No: RD20160402006 Part Number: FT01MVNG Date Code: 1632E Quantity: 40 515 FIGURE 12 Packing tube for Firecomms Vertical RedLink Transmitters 7

PART HANDLING The Firecomms DC-1 MBd 530 nm RedLink transmitter devices are color coded green. They are autoinsertable. They are tested for handling in static-controlled assembly processes (HBM). Cleaning, degreasing and post solder washing should be carried out using standard solutions compatible with both plastics and the environment. For example, recommended solutions for degreasing are alcohols (methyl, isopropyl and isobutyl). Acetone, ethyl acetate, phenol or similar solution based products are not permitted. In the soldering process, non-halogenated water soluble fluxes are recommended. These products are not suitable for use in reflow solder processes (infrared/vapor-phase reflow). The dust plug should remain in place during soldering, washing and drying processes to avoid contamination of the active optical area of each part. The Moisture Sensitivity Level (MSL) classification of this device is 2a according to JEDEC J-STD-020. The shelf life of an unopened MBB (Moisture Barrier Bag) is 24 months at < 40 C and < 90 % R.H. Once the Moisture Barrier Bag is opened the devices can be either a) Stored in normal factory conditions < 30 C and < 60 % R.H. for a maximum of 672 hours (4 Weeks) prior to soldering. b) Stored at < 10 % R.H. (Dry Cabinet). 8

PACKING INFORMATION Components are packed in PVC anti-static tubes in moisture barrier bags. Bags should be opened only in static-controlled locations, and standard procedures should be followed for handling moisture sensitive components. Table 7 PACKING INFORMATION Horizontal Vertical Components per Tube 40 40 Tube Length 515 mm 515 mm Tube Height 16.2 mm 21.0 mm Tube Depth 26.9 mm 30.8 mm Tubes per Bag 5 5 Bags per Inner Carton 1 1 Inner Carton Length 630 mm 630 mm Inner Carton Width 70 mm 70 mm Inner Carton Height 105 mm 105 mm Weight per Inner Carton, Complete 0.77 kg 0.92 kg Components per Inner Carton 200 200 Inner Cartons per Outer Carton 10 10 Outer Carton Length 650 mm 650 mm Outer Carton Width 235 mm 235 mm Outer Carton Height 376 mm 376 mm Weight per Outer Carton, Complete 8.15 kg 9.62 kg Components per Outer Carton 2,000 2,000 For the most recent revision or further information please visit www.firecomms.com or contact the company directly at the following address, Firecomms Ltd, 2200 Airport Business Park, Cork, IRELAND. Copyright 2004-2018 Firecomms. All rights reserved. Firecomms refers to Firecomms Limited and/or its subsidiaries. Firecomms assumes no responsibility for inaccuracies or omissions in the information contained in this document. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 9