31th March 2017, Annual ILC detector meeting Tohoku University Shunsuke Murai on behalf of FPCCD group

Similar documents
Initial Results from a Cryogenic Proton Irradiation of a p-channel CCD

Simulation of High Resistivity (CMOS) Pixels

VELO: the LHCb Vertex Detector

Why p-type is better than n-type? or Electric field in heavily irradiated silicon detectors

Evaluation of the Radiation Tolerance of SiGe Heterojunction Bipolar Transistors Under 24GeV Proton Exposure

Lawrence Berkeley National Laboratory Lawrence Berkeley National Laboratory

Investigating the Causes of and Possible Remedies for Sensor Damage in Digital Cameras Used on the OMEGA Laser Systems.

Strip Detectors. Principal: Silicon strip detector. Ingrid--MariaGregor,SemiconductorsasParticleDetectors. metallization (Al) p +--strips

CMS Phase II Tracker Upgrade GRK-Workshop in Bad Liebenzell

TPC Readout with GEMs & Pixels

PoS(EPS-HEP 2009)150. Silicon Detectors for the slhc - an Overview of Recent RD50 Results. Giulio Pellegrini 1. On behalf of CERN RD50 collaboration

The LHCb VELO Upgrade. Stefano de Capua on behalf of the LHCb VELO group

Silicon Sensor Developments for the CMS Tracker Upgrade

Signal-to. to-noise with SiGe. 7 th RD50 Workshop CERN. Hartmut F.-W. Sadrozinski. SCIPP UC Santa Cruz. Signal-to-Noise, SiGe 1

PoS(LHCP2018)031. ATLAS Forward Proton Detector

Proton induced leakage current in CCDs

Development of Readout ASIC for FPCCD Vertex Detector

Evaluation of the Radiation Tolerance of Several Generations of SiGe Heterojunction Bipolar Transistors Under Radiation Exposure

Pixel hybrid photon detectors

Attilio Andreazza INFN and Università di Milano for the ATLAS Collaboration The ATLAS Pixel Detector Efficiency Resolution Detector properties

CMS Tracker Upgrade for HL-LHC Sensors R&D. Hadi Behnamian, IPM On behalf of CMS Tracker Collaboration

Monolithic Pixel Sensors in SOI technology R&D activities at LBNL

Radiation-hard/high-speed data transmission using optical links

Backgrounds in DMTPC. Thomas Caldwell. Massachusetts Institute of Technology DMTPC Collaboration

Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip

A new strips tracker for the upgraded ATLAS ITk detector

Image Sensor Dark Current Non Uniformity modeling using GEANT 4

The LHCb Vertex Locator (VELO) Pixel Detector Upgrade

Application of CMOS sensors in radiation detection

STUDY OF THE RADIATION HARDNESS OF VCSEL AND PIN ARRAYS

1. Reasons for using p-type SSD

Detectors for AXIS. Eric D. Miller Catherine Grant (MIT)

ATLAS ITk and new pixel sensors technologies

Development of Integration-Type Silicon-On-Insulator Monolithic Pixel. Detectors by Using a Float Zone Silicon

BaBar SVT: Radiation Damage and Other Operational Issues

D. Ferrère, Université de Genève on behalf of the ATLAS collaboration

The Architecture of the BTeV Pixel Readout Chip

TCAD simulations of silicon strip and pixel sensor optimization

Study of the radiation-hardness of VCSEL and PIN

Towards a 10 μs, thin high resolution pixelated CMOS sensor system for future vertex detectors

Tomoyuki Saito (Tohoku Univ.) Outline

OPTICAL LINK OF THE ATLAS PIXEL DETECTOR

The CMS Silicon Strip Tracker and its Electronic Readout

CMOS Monolithic Active Pixel Sensors

A monolithic pixel sensor with fine space-time resolution based on silicon-on-insulator technology for the ILC vertex detector

arxiv: v1 [physics.ins-det] 25 Feb 2013

Silicon Sensor and Detector Developments for the CMS Tracker Upgrade

Selecting an image sensor for the EJSM VIS/NIR camera systems

A 130nm CMOS Evaluation Digitizer Chip for Silicon Strips readout at the ILC

Chapter 4 Vertex. Qun Ouyang. Nov.10 th, 2017Beijing. CEPC detector CDR mini-review

Development of Pixel Detectors for the Inner Tracker Upgrade of the ATLAS Experiment

CMS Beam Condition Monitoring Wim de Boer, Hannes Bol, Alexander Furgeri, Steffen Muller

PoS(Vertex 2016)071. The LHCb VELO for Phase 1 Upgrade. Cameron Dean, on behalf of the LHCb Collaboration

New fabrication and packaging technologies for CMOS pixel sensors: closing gap between hybrid and monolithic

The CMS electromagnetic calorimeter barrel upgrade for High-Luminosity LHC

PoS(VERTEX2015)008. The LHCb VELO upgrade. Sophie Elizabeth Richards. University of Bristol

What do the experiments want?

The upgrade of the ATLAS silicon strip tracker

Layout and prototyping of the new ATLAS Inner Tracker for the High Luminosity LHC

A High-Granularity Timing Detector for the Phase-II upgrade of the ATLAS Detector system

Lawrence Berkeley National Laboratory Lawrence Berkeley National Laboratory

The Belle II Vertex Pixel Detector

Gas scintillation Glass GEM detector for high-resolution X-ray imaging and CT

arxiv: v1 [physics.ins-det] 21 Nov 2011

SEU effects in registers and in a Dual-Ported Static RAM designed in a 0.25 µm CMOS technology for applications in the LHC

A High Granularity Timing Detector for the Phase II Upgrade of the ATLAS experiment


Timing Measurement in the CALICE Analogue Hadronic Calorimeter.

XIS 2003 Jun23. K. Hayashida (Osaka University)

Silicon Sensors for High-Luminosity Trackers - RD50 Collaboration status report

Development and application of a neutron sensor for singleevent effects analysis

Low Power Sensor Concepts

Monitoring LSO/LYSO Based Crystal Calorimeters

Geiger-mode APDs (2)

Chromatic X-Ray imaging with a fine pitch CdTe sensor coupled to a large area photon counting pixel ASIC

arxiv: v2 [physics.ins-det] 14 Jan 2009

Forward bias operation of irradiated silicon detectors A.Chilingarov Lancaster University, UK

Studies of silicon strip sensors for the ATLAS ITK project. Miguel Arratia Cavendish Laboratory, University of Cambridge

arxiv: v2 [physics.ins-det] 14 Jul 2015

Development of CMOS pixel sensors for tracking and vertexing in high energy physics experiments

arxiv: v2 [physics.ins-det] 24 Oct 2012

An Introduction to CCDs. The basic principles of CCD Imaging is explained.

The LHCb Silicon Tracker

Recent Development on CMOS Monolithic Active Pixel Sensors

Pixel sensors with different pitch layouts for ATLAS Phase-II upgrade

ATLAS strip detector upgrade for the HL-LHC

Development of Personal Dosimeter Using Electronic Dose Conversion Method

ATLAS Upgrade SSD. ATLAS Upgrade SSD. Specifications of Electrical Measurements on SSD. Specifications of Electrical Measurements on SSD

Phase 1 upgrade of the CMS pixel detector

Charged Coupled Device (CCD) S.Vidhya

Thin Silicon R&D for LC applications

The LHCb Upgrade BEACH Simon Akar on behalf of the LHCb collaboration

Sensor production readiness

AVALANCHE PHOTODIODES FOR THE CMS ELECTROMAGNETIC CALORIMETER

SPADs for Vertex Tracker Detectors in Future Colliders

CMOS Monolithic Pixel Sensors for Particle Tracking: a short summary of seven years R&D at Strasbourg

National Accelerator Laboratory

PICSEL Group. Physics with Integrated Cmos Sensors and ELectron machines.

Pixel detector development for the PANDA MVD

ISIS2 as a Pixel Sensor for ILC

Transcription:

31th March 2017, Annual ILC detector meeting Tohoku University Shunsuke Murai on behalf of FPCCD group 1

Introduction Vertex detector FPCCD Radiation damage Neutron irradiation test Measurement of performance for prototype FPCCD Improvement of CTI Summary 2

3

4 Less than a few % pixel occupancy for precise tracking When 25μm 25μm pixel detector accumulates signal in 1 train, pixel occupancy is more than 10%. Two solutions of pixel occupancy 1 Many readout in a train 2 Small pixel size 1312bunch 2 Fine Pixel CCD =FPCCD Beam structure of ILC Pixel size (5μm) 2 achieves a few % pixel occupancy!

5 Radiation in the ILC (1312bunch, 0.5 10 7 sec, E CM = 500GeV) Pair background: 2.07 x 10 11 e / cm 2 /year Neutrons from beam dump: 9.25 x 10 8 1MeVn eq / cm 2 / year Influence on CCD caused by the radiation Bulk damage lattice defects: displacement of silicon atoms Non-ionizing energy loss(niel): energy which used to bulk damage in energy loss of radiation Surface damage ionization in the silicon dioxide NIEL hypothesis Assumption that bulk damage is proportional to NIEL Damage of 30MeV electrons is 16 times smaller than 1MeV neutron 2.07 x 10 11 e / cm 2 /year 1.29 x 10 10 1MeVn eq / cm 2 / year Requirement for radiation tolerance 3 years operation and safety factor 3 1.24 x 10 11 1MeVn eq / cm 2 e - Pair background e + Beam dump Lattice defects image

6 Dark current: thermal excited electrons which is readout as signal Hot pixel: pixel whose dark current is larger than normal pixel Influence from radiation Increase of lattice defects Energy level is generated by lattice defect in band gap and probability of thermal excited to conduction band is increased. Increase of dark current Generation of defect cluster Collision of heavy particles like neutron or proton causes multiple collision and defect cluster which is displacement of multiple atoms. So that dark current is increased ununiformity. generation of hot pixel

7 Charge Transfer Inefficiency (CTI) Charge loss is caused by trap in lattice defects. It is defined as inefficiency of one transfer from pixel to pixel. Signal charge is Q 0 and it will become Q n after n times transfers. Q x, y = Q 0 1 CTI h x 1 CTI v y In ILC experiment, number of horizontal transfer is 13000 and that of vertical transfer is 125. Horizontal transfer is dominant in charge loss. Vertical transfer pixels eadout 13000 125 Horizontal register pixel (0,0) is readout Plot of the expression x, y axis is place of pixel Z axis is signal hight

8

9 Date:2014/10/15-17 Place:CYRIC@Tohoku University 65MeV Neutron beam It is produced from 70MeV proton beam Li + p Be + n Fluence: 1.78 10 10 1MeVn eq /cm 2 (1.5h) 1/7 of required NIEL damage Prototype FPCCD is used Pixel size: (6μm) 2 CYRIC Annual Report 2010-2011 Neutron energy spectrum 0 10 20 30 40 50 60 70 Energy(MeV)

10 Dark charge(200msec) Before irradiation: -0.0006 electrons@-40 After irradiation: 0.76 electrons@-40 Hot pixel fraction Before irradiation:(7.49 ± 1.91) 10 7 @-40 After irradiation:(1.03 ± 0.19) 10 6 @-40 5σ Hot pixel Before irradiation exposure time 5sec@-40 After irradiation exposure time 5sec@-40

11 Condition Temperature: -40 Clock frequency: 6MHz Source : Fe55 5.9keV X-ray is used for signal Fit function Q x, y = Q 0 1 CTI h x 1 CTI v y result CTI h = (5.93 ± 0.05) 10 5 CTI v = 7.32 ± 0.22 10 5 X-ray Signal distribution before irradiation 70 80 90 100 110 120 130 140 150 Fe55 peak X-ray Signal distribution after irradiation

12 Neutron fluence in CYRIC: 1.78 x 10 10 1MeVn eq / cm 2 Required radiation tolerance:1.24 x 10 11 1MeVn eq / cm 2 It is 7 times lager than fluence in CYRIC 3 years operation (1.5 10 7 sec) and safety factor 3 Evaluation of performance Each result was worsen 7 times to compare with requirement. Dark charge (200msec) 0.76 electrons x 7 = 5.32 electrons It is enough small comparing with noise 42 electrons Hot pixel fraction (1.03 10 6 ) 7 = 7.21 10 6 It is enough small comparing with requirement for pixel occupancy Dark charge and hot pixel are not problem in ILC

Charged particle 13 1pixel=5μm 5μm 15μm Large CTI means small signal charge S/N gets worse Noise: 42 electrons Width of dark charge(200msec) Minimum signal: 400 electrons MIP generates 80e/μm in silicon MIP pass 5μm when it enter horizontally S/N = (1 CTI)11000 400 42 Number of transfer: 11000 Evaluation of performance 5.93 10 5 7 = 41.5 10 5 S/N=0.1 CTI should be improved Goal of S/N=10 CTI < 2.45 10 5 Vertical incident 1200=80e 15μm Horizontal incident 400=80e 5μm Relation between S/N and CTI S/N

14

15 Improvement of CTI The cause of degradation of CTI is lattice defect Additional charge are injected to fill up the lattice defects before the signal charge is transferred. Fat-zero charge injection Fill lattice defect by background current In this study, CCD is irradiated by light from LED and produced charge is treated as fat-zero charge.

16 No fat-zero charge 600e/pixel injected CTI h (5.93 ± 0.05) 10 5 (0.68 ± 0.04) 10 5 CTI v 7.32 ± 0.22 10 5 3.07 ± 0.15 10 5 Factor 9 improvement for CTI h and factor 2 improvement for CTI v are achieved. Number of horizontal transfer is much larger than number of vertical transfer. Improvement of CTI h is dominant for charge loss. Dark charge with 600 e injected Pedestal is shifted by fat-zero charge

17 Shot noise by fat-zero charge Shot noise makes strict Evaluation of performance Measured CTI is multiplied 7 times to compare with requirement S/N ratio with 600e injected is 4.9 It is smaller than the goal which is S/N=10 CTI should be more improved S/N = (1 CTI)11000 400 42 2 + N Fatzero Relation between S/N ratio and required CTI Plots are the measured CTI multiplied by factor 7

Fat-zero charge effect depends on horizontal register size Notch channel Annealing Noise reduction 18

19 Degradation of performances is observed in neutron irradiated FPCCD prototype. Dark charge:increase to 0.76e which is enough small against noise Hot pixel fraction: increase to (1.03 ± 0.19) 10 6 which is enough small against pixel occupancy CTI: S/N = 0.14 CTI improvement by fat-zero charge injection Factor 9 improvement for CTI h achieved. and factor 2 improvement for CTI v are Dark charge and hot pixel is OK for ILC operation however CTI should be more improved.

20

21 Pair backgrounds 6.32/hits/cm 2 /BX at E CM =500GeV Expected hits/year assuming 0.5x10 7 sec operation 6.32 x 1312 (BX/train) x 5 (train/sec) x 0.5 x 10 7 (sec) = 2.07 x 10 11 e / cm 2 /year

22 Prototype FPCCD Vertical transfer pixel size: 6μmx6μm Horizontal transfer pixel size: 6μmx12μm, 6μmx18μm, 6μmx24μm Ch1 cannot work Number of pixels:1024(h)x255(v)/ch Made in HPK Model number:cpk1-14-cp502-07 Prototype FPCCD image Vertical transfer pixel Horizontal transfer pixel

23 Dark current Dark charge is measured as a function of exposure time The slope is dark current Hot pixel fraction Fraction=N hot /N all Measured as a function of temperature 5σ Hot pixel Before irradiation exposure time 5sec@-40 After irradiation exposure time 5sec@-40

24 Exposure time:5, 10, 30, 60sec Temperature:-30, -40 Influence of Hot pixel Peak position: only Gaussian component Mean: Including hot pixel influence Peak position Mean Hot pixel Before irradiation exposure time 5sec@-40 After irradiation Exposure time 5sec@-40

Dark charge [LSB] Dark charge [LSB] 25 Dark charge(200msec) Dark current(slope) is scaled 200msec is train gap Noise It corresponds to width of dark charge in 200msec 42electrons dark charge after irradiation (200msec) -30-40 Mean 2.5e 0.76e peak 0.23e 0.22e (1LSB=14e) dark charge in 200msec is enough smaller than noise Before irradiation After irradiation

Peak: 0.0775 Width: 2.887 26

27 Hot pixel fraction is decreasing along temperature decreasing It can be enough small against pixel occupancy by low temperature -40 Before irradiation:(7.49 ± 1.91) 10 7 @-40 After irradiation:(1.03 ± 0.19) 10 6 @-40 After irradiation exposure time 200sec@-40 Relation between hot pixel and temperature

28 8 LED were put around the CCD in the equal space. LEDs are connected in parallel and same voltages are applied. Fe55 source is located over the center hall. LED Fe55 shutter CCD

29 Fat-zero charge effect depends on horizontal register size Register size No Fat zero charge 600 electrons Improvement 6μm 12μm CTI h = 5.93 10 5 CTI h = 0.68 10 5 Factor 9 6μm 18μm CTI h = 5.45 10 5 CTI h = 1.05 10 5 Factor 5 6μm 24μm CTI h = 4.85 10 5 CTI h = 1.89 10 5 Factor 3 Fat-zero charge improvement can be more effective by small horizontal register (6μm 6μm)

30 Notch channel Signal charge encounters less traps if it is transferred through narrower channel Narrower channel than pixel (shift register) width is called notch channel Fat-zero charge injection is more effective Annealing Annealing at ~100 deg is reported CTI improvement by x2~3 after 168h 100 annealing E. Martin, et al. IEEE Trans, Nucl. Sci. vol. 58, No.3, 2011 Noise reduction Requirement for CTI gets lax